JPS57118650A - Method for solder welding - Google Patents

Method for solder welding

Info

Publication number
JPS57118650A
JPS57118650A JP56196773A JP19677381A JPS57118650A JP S57118650 A JPS57118650 A JP S57118650A JP 56196773 A JP56196773 A JP 56196773A JP 19677381 A JP19677381 A JP 19677381A JP S57118650 A JPS57118650 A JP S57118650A
Authority
JP
Japan
Prior art keywords
chip
solder
lifted
reliability
metal electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56196773A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5751253B2 (2
Inventor
Masanori Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56196773A priority Critical patent/JPS57118650A/ja
Publication of JPS57118650A publication Critical patent/JPS57118650A/ja
Publication of JPS5751253B2 publication Critical patent/JPS5751253B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP56196773A 1981-12-09 1981-12-09 Method for solder welding Granted JPS57118650A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56196773A JPS57118650A (en) 1981-12-09 1981-12-09 Method for solder welding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56196773A JPS57118650A (en) 1981-12-09 1981-12-09 Method for solder welding

Publications (2)

Publication Number Publication Date
JPS57118650A true JPS57118650A (en) 1982-07-23
JPS5751253B2 JPS5751253B2 (2) 1982-11-01

Family

ID=16363383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56196773A Granted JPS57118650A (en) 1981-12-09 1981-12-09 Method for solder welding

Country Status (1)

Country Link
JP (1) JPS57118650A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62200488A (ja) * 1986-02-28 1987-09-04 Sumitomo Electric Ind Ltd 光学的文字読取装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62200488A (ja) * 1986-02-28 1987-09-04 Sumitomo Electric Ind Ltd 光学的文字読取装置

Also Published As

Publication number Publication date
JPS5751253B2 (2) 1982-11-01

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