JPS57120355A - Manufacture of semiconductor element - Google Patents
Manufacture of semiconductor elementInfo
- Publication number
- JPS57120355A JPS57120355A JP56005900A JP590081A JPS57120355A JP S57120355 A JPS57120355 A JP S57120355A JP 56005900 A JP56005900 A JP 56005900A JP 590081 A JP590081 A JP 590081A JP S57120355 A JPS57120355 A JP S57120355A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- polyimide
- subsequently
- thick film
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W42/25—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons against alpha rays, e.g. for outer space applications
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To form a thick film for preventing a malfunction by alpha rays in an accurate pattern by forming a thick film of synthetic resin on a predetermined main face of semiconductor substrate by using a dry film and a lift-off technique. CONSTITUTION:A P-N junction is formed and a thermo compression bonding by dry film is provided for an Si substrate 20 including a field oxide film 21, a bonding pad 22 and a protective layer 23 by utilizing a resist layer 12 exposed by exfoliating its mylar polyester sheet. Subsequently, an exposure is established by using a mask only to a predetermined area wherein polyimide thick film is not formed and a resist layer 12' is left in the predetermined are through a processing. Subsequently, a polyimide resin liquid is coated to form a polyimide layer 30. Subsequently, the foregoing layer 12' is removed and a polyimide layer 30' for which a patterning is provided is formed by a lift-off technique.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56005900A JPS57120355A (en) | 1981-01-20 | 1981-01-20 | Manufacture of semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56005900A JPS57120355A (en) | 1981-01-20 | 1981-01-20 | Manufacture of semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57120355A true JPS57120355A (en) | 1982-07-27 |
Family
ID=11623761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56005900A Pending JPS57120355A (en) | 1981-01-20 | 1981-01-20 | Manufacture of semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57120355A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60183750A (en) * | 1984-02-09 | 1985-09-19 | フエアチアイルド カメラ アンド インストルメント コーポレーシヨン | Semiconductor structure with alpha-ray resistant film and method of producing same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53106585A (en) * | 1977-02-28 | 1978-09-16 | Nec Corp | Production of semiconductor device |
| JPS5643614A (en) * | 1979-09-17 | 1981-04-22 | Nippon Telegr & Teleph Corp <Ntt> | Production of plug for optical fiber connector |
-
1981
- 1981-01-20 JP JP56005900A patent/JPS57120355A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53106585A (en) * | 1977-02-28 | 1978-09-16 | Nec Corp | Production of semiconductor device |
| JPS5643614A (en) * | 1979-09-17 | 1981-04-22 | Nippon Telegr & Teleph Corp <Ntt> | Production of plug for optical fiber connector |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60183750A (en) * | 1984-02-09 | 1985-09-19 | フエアチアイルド カメラ アンド インストルメント コーポレーシヨン | Semiconductor structure with alpha-ray resistant film and method of producing same |
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