JPS57126157A - Integrated circuit device - Google Patents

Integrated circuit device

Info

Publication number
JPS57126157A
JPS57126157A JP56117561A JP11756181A JPS57126157A JP S57126157 A JPS57126157 A JP S57126157A JP 56117561 A JP56117561 A JP 56117561A JP 11756181 A JP11756181 A JP 11756181A JP S57126157 A JPS57126157 A JP S57126157A
Authority
JP
Japan
Prior art keywords
integrated circuit
power supply
capacitor
circuit device
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56117561A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6316906B2 (2
Inventor
Fuirofusukiii Eriotsuto
Paakinson Waado
Uiruson Denisu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera AVX Components Corp
Original Assignee
AVX Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AVX Corp filed Critical AVX Corp
Publication of JPS57126157A publication Critical patent/JPS57126157A/ja
Publication of JPS6316906B2 publication Critical patent/JPS6316906B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/475—Capacitors in combination with leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP56117561A 1981-01-12 1981-07-27 Integrated circuit device Granted JPS57126157A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US22412781A 1981-01-12 1981-01-12

Publications (2)

Publication Number Publication Date
JPS57126157A true JPS57126157A (en) 1982-08-05
JPS6316906B2 JPS6316906B2 (2) 1988-04-11

Family

ID=22839370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56117561A Granted JPS57126157A (en) 1981-01-12 1981-07-27 Integrated circuit device

Country Status (5)

Country Link
JP (1) JPS57126157A (2)
CA (1) CA1156771A (2)
DE (1) DE3130072A1 (2)
FR (1) FR2499768B1 (2)
GB (1) GB2091035B (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6077432A (ja) * 1983-10-05 1985-05-02 Fujitsu Ltd 半導体装置の製造方法
JPS61151349U (2) * 1985-03-11 1986-09-18

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5954249A (ja) * 1982-09-22 1984-03-29 Fujitsu Ltd 半導体装置
JPS5966157A (ja) * 1982-10-08 1984-04-14 Fujitsu Ltd 半導体装置及びその製造方法
FR2550009B1 (fr) * 1983-07-29 1986-01-24 Inf Milit Spatiale Aeronaut Boitier de composant electronique muni d'un condensateur
US4534105A (en) * 1983-08-10 1985-08-13 Rca Corporation Method for grounding a pellet support pad in an integrated circuit device
DE3410196A1 (de) * 1984-03-20 1985-09-26 Siemens AG, 1000 Berlin und 8000 München Leiterband fuer die montage von integrierten schaltkreisen
US4612564A (en) * 1984-06-04 1986-09-16 At&T Bell Laboratories Plastic integrated circuit package
FR2584865B1 (fr) * 1985-07-12 1988-06-17 Inf Milit Spatiale Aeronaut Composant electronique comportant un condensateur
DE4017217A1 (de) * 1990-05-29 1991-12-19 Texas Instruments Deutschland Elektronisches bauelement
US5281846A (en) * 1990-05-29 1994-01-25 Texas Instruments Deutschland Gmbh Electronic device having a discrete capacitor adherently mounted to a lead frame
US5140496A (en) * 1991-01-02 1992-08-18 Honeywell, Inc. Direct microcircuit decoupling

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5165662U (2) * 1974-11-20 1976-05-24
JPS55179055U (2) * 1979-06-07 1980-12-23

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3802069A (en) * 1972-05-04 1974-04-09 Gte Sylvania Inc Fabricating packages for use in integrated circuits
US3880493A (en) * 1973-12-28 1975-04-29 Burroughs Corp Capacitor socket for a dual-in-line package
FR2456388A1 (fr) * 1979-05-10 1980-12-05 Thomson Brandt Microboitier de circuit electronique, et circuit hybride comportant un tel microboitier

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5165662U (2) * 1974-11-20 1976-05-24
JPS55179055U (2) * 1979-06-07 1980-12-23

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6077432A (ja) * 1983-10-05 1985-05-02 Fujitsu Ltd 半導体装置の製造方法
JPS61151349U (2) * 1985-03-11 1986-09-18

Also Published As

Publication number Publication date
DE3130072A1 (de) 1982-08-05
CA1156771A (en) 1983-11-08
GB2091035A (en) 1982-07-21
GB2091035B (en) 1985-01-09
FR2499768A1 (fr) 1982-08-13
FR2499768B1 (fr) 1985-12-20
JPS6316906B2 (2) 1988-04-11

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