CA1156771A - Integrated circuit device and sub-assembly - Google Patents

Integrated circuit device and sub-assembly

Info

Publication number
CA1156771A
CA1156771A CA000383371A CA383371A CA1156771A CA 1156771 A CA1156771 A CA 1156771A CA 000383371 A CA000383371 A CA 000383371A CA 383371 A CA383371 A CA 383371A CA 1156771 A CA1156771 A CA 1156771A
Authority
CA
Canada
Prior art keywords
capacitor
portions
leg
plane
mounting portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000383371A
Other languages
English (en)
French (fr)
Inventor
Ward Parkinson
Elliott Philofsky
Dennis Wilson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Avx Components Corp
Original Assignee
AVX Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AVX Corp filed Critical AVX Corp
Application granted granted Critical
Publication of CA1156771A publication Critical patent/CA1156771A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/475—Capacitors in combination with leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
CA000383371A 1981-01-12 1981-08-07 Integrated circuit device and sub-assembly Expired CA1156771A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US22412781A 1981-01-12 1981-01-12
US224,127 1981-01-12

Publications (1)

Publication Number Publication Date
CA1156771A true CA1156771A (en) 1983-11-08

Family

ID=22839370

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000383371A Expired CA1156771A (en) 1981-01-12 1981-08-07 Integrated circuit device and sub-assembly

Country Status (5)

Country Link
JP (1) JPS57126157A (2)
CA (1) CA1156771A (2)
DE (1) DE3130072A1 (2)
FR (1) FR2499768B1 (2)
GB (1) GB2091035B (2)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5954249A (ja) * 1982-09-22 1984-03-29 Fujitsu Ltd 半導体装置
JPS5966157A (ja) * 1982-10-08 1984-04-14 Fujitsu Ltd 半導体装置及びその製造方法
FR2550009B1 (fr) * 1983-07-29 1986-01-24 Inf Milit Spatiale Aeronaut Boitier de composant electronique muni d'un condensateur
US4534105A (en) * 1983-08-10 1985-08-13 Rca Corporation Method for grounding a pellet support pad in an integrated circuit device
JPH0828447B2 (ja) * 1983-10-05 1996-03-21 富士通株式会社 半導体装置の製造方法
DE3410196A1 (de) * 1984-03-20 1985-09-26 Siemens AG, 1000 Berlin und 8000 München Leiterband fuer die montage von integrierten schaltkreisen
US4612564A (en) * 1984-06-04 1986-09-16 At&T Bell Laboratories Plastic integrated circuit package
JPS61151349U (2) * 1985-03-11 1986-09-18
FR2584865B1 (fr) * 1985-07-12 1988-06-17 Inf Milit Spatiale Aeronaut Composant electronique comportant un condensateur
DE4017217A1 (de) * 1990-05-29 1991-12-19 Texas Instruments Deutschland Elektronisches bauelement
US5281846A (en) * 1990-05-29 1994-01-25 Texas Instruments Deutschland Gmbh Electronic device having a discrete capacitor adherently mounted to a lead frame
US5140496A (en) * 1991-01-02 1992-08-18 Honeywell, Inc. Direct microcircuit decoupling

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3802069A (en) * 1972-05-04 1974-04-09 Gte Sylvania Inc Fabricating packages for use in integrated circuits
US3880493A (en) * 1973-12-28 1975-04-29 Burroughs Corp Capacitor socket for a dual-in-line package
JPS558286Y2 (2) * 1974-11-20 1980-02-23
FR2456388A1 (fr) * 1979-05-10 1980-12-05 Thomson Brandt Microboitier de circuit electronique, et circuit hybride comportant un tel microboitier
JPS55179055U (2) * 1979-06-07 1980-12-23

Also Published As

Publication number Publication date
DE3130072A1 (de) 1982-08-05
GB2091035A (en) 1982-07-21
GB2091035B (en) 1985-01-09
JPS57126157A (en) 1982-08-05
FR2499768A1 (fr) 1982-08-13
FR2499768B1 (fr) 1985-12-20
JPS6316906B2 (2) 1988-04-11

Similar Documents

Publication Publication Date Title
CA1180824A (en) Integrated circuit device having internal dampening for a plurality of power supplies
US5089878A (en) Low impedance packaging
CA1156771A (en) Integrated circuit device and sub-assembly
US6180433B1 (en) Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor
US6538313B1 (en) IC package with integral substrate capacitor
US4527185A (en) Integrated circuit device and subassembly
EP1438745A2 (en) Multiple die interconnect system
JPH06216297A (ja) 介挿体リードフレームを有する回路組立体
DE59706411D1 (de) Chipmodul und verfahren zur herstellung eines chipmoduls
DE19520700A1 (de) Halbleiterbausteinanordnung
KR940012549A (ko) 반도체 펙케지
EP0844663A4 (en) CIRCUIT MEMBER FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE USING THE CIRCUIT MEMBER, AND METHOD FOR MANUFACTURING THE MEMBER AND DEVICE
EP1104026B1 (en) Ground plane for a semiconductor chip
KR880001053A (ko) 집적 회로용 팔라듐 도금 리이드 프레임 및 그 제조 방법
US4617708A (en) Component module for piggyback mounting on a circuit package having dual-in-line leads, and methods of fabricating same
US5243496A (en) Molded case integrated circuit with a dynamic impedance reducing device
KR900003311B1 (ko) 인쇄 배선 감결합 형태 및 방법
US6864776B2 (en) Coupling adjusting structure for double-tuned circuit
US5650665A (en) Hybrid integrated circuit device including circuit patterns of different conductivity and circuit elements mounted on an insulating substrate
WO2001086718A3 (en) Semiconductor device with fuses and method of manufacturing same
KR20000048663A (ko) 칩 형태의 패시브 네트워크
JPH07221419A (ja) 混成集積回路装置
JPH09307202A (ja) 混成集積回路
KR19980063740A (ko) 몰딩된 패키지용 다층 리드프레임
KR100720410B1 (ko) 수동소자가 패턴된 반도체 패키지용 섭스트레이트

Legal Events

Date Code Title Description
MKEX Expiry