JPS57173954A - Ultrasonic wave wire bonding device - Google Patents

Ultrasonic wave wire bonding device

Info

Publication number
JPS57173954A
JPS57173954A JP56057854A JP5785481A JPS57173954A JP S57173954 A JPS57173954 A JP S57173954A JP 56057854 A JP56057854 A JP 56057854A JP 5785481 A JP5785481 A JP 5785481A JP S57173954 A JPS57173954 A JP S57173954A
Authority
JP
Japan
Prior art keywords
horn
held
wire
capillary
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56057854A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6227741B2 (2
Inventor
Nobuhito Yamazaki
Takeshi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP56057854A priority Critical patent/JPS57173954A/ja
Publication of JPS57173954A publication Critical patent/JPS57173954A/ja
Publication of JPS6227741B2 publication Critical patent/JPS6227741B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding

Landscapes

  • Wire Bonding (AREA)
JP56057854A 1981-04-18 1981-04-18 Ultrasonic wave wire bonding device Granted JPS57173954A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56057854A JPS57173954A (en) 1981-04-18 1981-04-18 Ultrasonic wave wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56057854A JPS57173954A (en) 1981-04-18 1981-04-18 Ultrasonic wave wire bonding device

Publications (2)

Publication Number Publication Date
JPS57173954A true JPS57173954A (en) 1982-10-26
JPS6227741B2 JPS6227741B2 (2) 1987-06-16

Family

ID=13067567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56057854A Granted JPS57173954A (en) 1981-04-18 1981-04-18 Ultrasonic wave wire bonding device

Country Status (1)

Country Link
JP (1) JPS57173954A (2)

Also Published As

Publication number Publication date
JPS6227741B2 (2) 1987-06-16

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