JPS649629A - Method for supplying and compressing solder - Google Patents

Method for supplying and compressing solder

Info

Publication number
JPS649629A
JPS649629A JP62164430A JP16443087A JPS649629A JP S649629 A JPS649629 A JP S649629A JP 62164430 A JP62164430 A JP 62164430A JP 16443087 A JP16443087 A JP 16443087A JP S649629 A JPS649629 A JP S649629A
Authority
JP
Japan
Prior art keywords
solder
clamper
compressing
cutting
knife edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62164430A
Other languages
Japanese (ja)
Inventor
Koichiro Okamura
Hideo Ichimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62164430A priority Critical patent/JPS649629A/en
Publication of JPS649629A publication Critical patent/JPS649629A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE:To improve accuracy and reliability in bonding, by supplying solder to a base assembling part of a lead frame and the like, cutting a required minute amount of the solder with a knife edge, and compressing the solder with a compressing tool at the same time. CONSTITUTION:With a solder 7 being kept with a clamper 8, the clamper 8 advances. When the minute amount of the solder 7 is pushed out, a knife edge 3, a compressing tool 5, the clamper 8 and the solder 7 are simultaneously lowered, and the solder 7 is cut. Then, the compressing tool is lowered, and the cut solder is compressed to a lead frame 12. The clamper 8 releases the solder 7. The clamper 8 is retreated by the supplied length of the solder. The clamper 8 holds the solder 7 again and 15 further retreated. The solder 7 is separated, and cutting is ensured. Thereafter, the compressing with the compressing tool 5 is completed. Ultrasonic waves are applied to the knife edge 3 and the compressing tool 5. Thus the cutting of the solder at a low temperature is performed.
JP62164430A 1987-07-01 1987-07-01 Method for supplying and compressing solder Pending JPS649629A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62164430A JPS649629A (en) 1987-07-01 1987-07-01 Method for supplying and compressing solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62164430A JPS649629A (en) 1987-07-01 1987-07-01 Method for supplying and compressing solder

Publications (1)

Publication Number Publication Date
JPS649629A true JPS649629A (en) 1989-01-12

Family

ID=15793006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62164430A Pending JPS649629A (en) 1987-07-01 1987-07-01 Method for supplying and compressing solder

Country Status (1)

Country Link
JP (1) JPS649629A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0473943U (en) * 1990-10-31 1992-06-29
US20130134210A1 (en) * 2011-11-25 2013-05-30 Aya Muto Joining method and semiconductor device manufacturing method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5237452B2 (en) * 1973-04-26 1977-09-22
JPS59150434A (en) * 1983-02-07 1984-08-28 Toshiba Corp Manufacture and apparatus of semiconductor device
JPS62269324A (en) * 1986-05-19 1987-11-21 Nec Corp Pellet-mounting unit
JPS63232340A (en) * 1987-11-13 1988-09-28 Sanyo Electric Co Ltd Device for applying foil

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5237452B2 (en) * 1973-04-26 1977-09-22
JPS59150434A (en) * 1983-02-07 1984-08-28 Toshiba Corp Manufacture and apparatus of semiconductor device
JPS62269324A (en) * 1986-05-19 1987-11-21 Nec Corp Pellet-mounting unit
JPS63232340A (en) * 1987-11-13 1988-09-28 Sanyo Electric Co Ltd Device for applying foil

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0473943U (en) * 1990-10-31 1992-06-29
US20130134210A1 (en) * 2011-11-25 2013-05-30 Aya Muto Joining method and semiconductor device manufacturing method
US8746538B2 (en) * 2011-11-25 2014-06-10 Mitsubishi Electric Corporation Joining method and semiconductor device manufacturing method

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