JPS5718330A - Method of and apparatus for soldering semiconductor device - Google Patents

Method of and apparatus for soldering semiconductor device

Info

Publication number
JPS5718330A
JPS5718330A JP9325580A JP9325580A JPS5718330A JP S5718330 A JPS5718330 A JP S5718330A JP 9325580 A JP9325580 A JP 9325580A JP 9325580 A JP9325580 A JP 9325580A JP S5718330 A JPS5718330 A JP S5718330A
Authority
JP
Japan
Prior art keywords
terminals
semiconductor devices
leaving
bending
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9325580A
Other languages
Japanese (ja)
Other versions
JPH0130302B2 (en
Inventor
Kazuo Numajiri
Yuji Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP9325580A priority Critical patent/JPS5718330A/en
Publication of JPS5718330A publication Critical patent/JPS5718330A/en
Publication of JPH0130302B2 publication Critical patent/JPH0130302B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To facilitate continuous automation of a plurality of semiconductor devices through etching, flux coating and soldering of the terminals thereof by employing a lead frame for supporting the semiconductor devices with the cutting and bending of the terminals thereof leaving the connection to a hanging pin. CONSTITUTION:A lead frame 4 which supports a resin-sealed semiconductor device 1 with the cutting and bending of the terminals thereof leaving a connection to hanging pin 5 is placed on a guide rail and conveyed along the rail. In the course, the terminals of the device are etched, washed and soldered. Including the washing and drying of the semiconductor devices, the full operation of all processes is done automatically and continuously. This can save time and labor for the aligning work of the semiconductor devices thereby improving the production efficiency while enabling automation connected to other processes.
JP9325580A 1980-07-10 1980-07-10 Method of and apparatus for soldering semiconductor device Granted JPS5718330A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9325580A JPS5718330A (en) 1980-07-10 1980-07-10 Method of and apparatus for soldering semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9325580A JPS5718330A (en) 1980-07-10 1980-07-10 Method of and apparatus for soldering semiconductor device

Publications (2)

Publication Number Publication Date
JPS5718330A true JPS5718330A (en) 1982-01-30
JPH0130302B2 JPH0130302B2 (en) 1989-06-19

Family

ID=14077385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9325580A Granted JPS5718330A (en) 1980-07-10 1980-07-10 Method of and apparatus for soldering semiconductor device

Country Status (1)

Country Link
JP (1) JPS5718330A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57128051A (en) * 1981-02-02 1982-08-09 Hitachi Ltd Soldering method and apparatus for semiconductor product
JPS58158993A (en) * 1982-03-17 1983-09-21 株式会社日立製作所 Method and device for soldering electronic part
JPH02172838A (en) * 1988-12-23 1990-07-04 Shin Etsu Chem Co Ltd Manufacturing method of single mode optical fiber preform
JPH04162555A (en) * 1990-10-25 1992-06-08 Mitsubishi Materials Corp Lead frame and its manufacturing and semiconductor device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5039063A (en) * 1973-08-08 1975-04-10
JPS5065173A (en) * 1973-10-09 1975-06-02
JPS5322365A (en) * 1976-08-13 1978-03-01 Hitachi Ltd Resin mold type semiconductor device and its production
JPS5439228A (en) * 1977-09-02 1979-03-26 Hitachi Ltd Evaporation type combustion device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5039063A (en) * 1973-08-08 1975-04-10
JPS5065173A (en) * 1973-10-09 1975-06-02
JPS5322365A (en) * 1976-08-13 1978-03-01 Hitachi Ltd Resin mold type semiconductor device and its production
JPS5439228A (en) * 1977-09-02 1979-03-26 Hitachi Ltd Evaporation type combustion device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57128051A (en) * 1981-02-02 1982-08-09 Hitachi Ltd Soldering method and apparatus for semiconductor product
JPS58158993A (en) * 1982-03-17 1983-09-21 株式会社日立製作所 Method and device for soldering electronic part
JPH02172838A (en) * 1988-12-23 1990-07-04 Shin Etsu Chem Co Ltd Manufacturing method of single mode optical fiber preform
JPH04162555A (en) * 1990-10-25 1992-06-08 Mitsubishi Materials Corp Lead frame and its manufacturing and semiconductor device

Also Published As

Publication number Publication date
JPH0130302B2 (en) 1989-06-19

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