JPS57201030A - Heat treatment for semiconductor wafer - Google Patents

Heat treatment for semiconductor wafer

Info

Publication number
JPS57201030A
JPS57201030A JP56085640A JP8564081A JPS57201030A JP S57201030 A JPS57201030 A JP S57201030A JP 56085640 A JP56085640 A JP 56085640A JP 8564081 A JP8564081 A JP 8564081A JP S57201030 A JPS57201030 A JP S57201030A
Authority
JP
Japan
Prior art keywords
heat
burner
heat treatment
semiconductor wafer
partition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56085640A
Other languages
Japanese (ja)
Inventor
Kenichi Kuroishi
Tobohiro Tominaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP56085640A priority Critical patent/JPS57201030A/en
Publication of JPS57201030A publication Critical patent/JPS57201030A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials

Abstract

PURPOSE:To facilitate the control of a heat treatment by providing to partition with a heat shielding plate between a burning mechanism having an oxygen hydrogen burner and an area for placing semiconductor wafers and escaping the heat by radiating the heat at the rear of a furnace. CONSTITUTION:A heat shielding plate 16 secured into a quartz reaction tube 2 to partition between an area for placing semiconductor wafers 9 and a burning mechanism having a burner 10, a small hole 17 formed at the plate 16, a rear heat shielding block 18 formed in the same manner as the block 7, and the heat 19 of the burner radiated from the rear opened furnace port are provided.
JP56085640A 1981-06-05 1981-06-05 Heat treatment for semiconductor wafer Pending JPS57201030A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56085640A JPS57201030A (en) 1981-06-05 1981-06-05 Heat treatment for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56085640A JPS57201030A (en) 1981-06-05 1981-06-05 Heat treatment for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS57201030A true JPS57201030A (en) 1982-12-09

Family

ID=13864418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56085640A Pending JPS57201030A (en) 1981-06-05 1981-06-05 Heat treatment for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS57201030A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0273730U (en) * 1988-11-28 1990-06-05

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5329670A (en) * 1976-08-31 1978-03-20 Nec Corp Thermal oxidation method of semiconductors
JPS5479034A (en) * 1977-12-06 1979-06-23 Fuji Photo Film Co Ltd Image formation method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5329670A (en) * 1976-08-31 1978-03-20 Nec Corp Thermal oxidation method of semiconductors
JPS5479034A (en) * 1977-12-06 1979-06-23 Fuji Photo Film Co Ltd Image formation method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0273730U (en) * 1988-11-28 1990-06-05

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