JPS57201030A - Heat treatment for semiconductor wafer - Google Patents
Heat treatment for semiconductor waferInfo
- Publication number
- JPS57201030A JPS57201030A JP56085640A JP8564081A JPS57201030A JP S57201030 A JPS57201030 A JP S57201030A JP 56085640 A JP56085640 A JP 56085640A JP 8564081 A JP8564081 A JP 8564081A JP S57201030 A JPS57201030 A JP S57201030A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- burner
- heat treatment
- semiconductor wafer
- partition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
Abstract
PURPOSE:To facilitate the control of a heat treatment by providing to partition with a heat shielding plate between a burning mechanism having an oxygen hydrogen burner and an area for placing semiconductor wafers and escaping the heat by radiating the heat at the rear of a furnace. CONSTITUTION:A heat shielding plate 16 secured into a quartz reaction tube 2 to partition between an area for placing semiconductor wafers 9 and a burning mechanism having a burner 10, a small hole 17 formed at the plate 16, a rear heat shielding block 18 formed in the same manner as the block 7, and the heat 19 of the burner radiated from the rear opened furnace port are provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56085640A JPS57201030A (en) | 1981-06-05 | 1981-06-05 | Heat treatment for semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56085640A JPS57201030A (en) | 1981-06-05 | 1981-06-05 | Heat treatment for semiconductor wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS57201030A true JPS57201030A (en) | 1982-12-09 |
Family
ID=13864418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56085640A Pending JPS57201030A (en) | 1981-06-05 | 1981-06-05 | Heat treatment for semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57201030A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0273730U (en) * | 1988-11-28 | 1990-06-05 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5329670A (en) * | 1976-08-31 | 1978-03-20 | Nec Corp | Thermal oxidation method of semiconductors |
| JPS5479034A (en) * | 1977-12-06 | 1979-06-23 | Fuji Photo Film Co Ltd | Image formation method |
-
1981
- 1981-06-05 JP JP56085640A patent/JPS57201030A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5329670A (en) * | 1976-08-31 | 1978-03-20 | Nec Corp | Thermal oxidation method of semiconductors |
| JPS5479034A (en) * | 1977-12-06 | 1979-06-23 | Fuji Photo Film Co Ltd | Image formation method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0273730U (en) * | 1988-11-28 | 1990-06-05 |
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