JPS572535A - Lead structure - Google Patents

Lead structure

Info

Publication number
JPS572535A
JPS572535A JP7552980A JP7552980A JPS572535A JP S572535 A JPS572535 A JP S572535A JP 7552980 A JP7552980 A JP 7552980A JP 7552980 A JP7552980 A JP 7552980A JP S572535 A JPS572535 A JP S572535A
Authority
JP
Japan
Prior art keywords
wires
lead
bonded
automatic wire
position detector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7552980A
Other languages
Japanese (ja)
Inventor
Tamotsu Usami
Kanji Otsuka
Takashi Araki
Mutsuo Fuda
Toshihiro Tsuboi
Shuichi Sugimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NITSUKAN DENSHI KK
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
NITSUKAN DENSHI KK
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Hitachi Ome Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NITSUKAN DENSHI KK, Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd, Hitachi Ome Electronic Co Ltd filed Critical NITSUKAN DENSHI KK
Priority to JP7552980A priority Critical patent/JPS572535A/en
Publication of JPS572535A publication Critical patent/JPS572535A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To eliminate the improper bonding of a plurality of wires to a lead due to the erroneous operation of the position detector of an automatic wire bonder by forming recess grooves corresponding to the wires at the lead to which the wires are bonded. CONSTITUTION:When a plurality (two) of wires 18, 19 to be connected to the pad 16 of a semiconductor substrate 10 are bonded to the same lead 17, a recess groove 20 for dividing the end of the lead 17 to the number corresponding to the number of the wires is formed at the end of the lead 17, and the wires are connected to the ends 21, 22 of the respective divided lead. Thus, the improper connection caused by the superposition of the connecting positions of the wires and hence the contact of the connecting part of the wires as well as the erroneous detection of the bonding position of the position detector of an automatic wire bonder can be eliminated. Since the size of the width of the lead can be reduced to the minimum necessary size, the lead structure can be highly integrated.
JP7552980A 1980-06-06 1980-06-06 Lead structure Pending JPS572535A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7552980A JPS572535A (en) 1980-06-06 1980-06-06 Lead structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7552980A JPS572535A (en) 1980-06-06 1980-06-06 Lead structure

Publications (1)

Publication Number Publication Date
JPS572535A true JPS572535A (en) 1982-01-07

Family

ID=13578837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7552980A Pending JPS572535A (en) 1980-06-06 1980-06-06 Lead structure

Country Status (1)

Country Link
JP (1) JPS572535A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59171152A (en) * 1983-03-17 1984-09-27 Nec Corp Semiconductor device
JPS61208859A (en) * 1985-03-14 1986-09-17 Kyushu Hitachi Maxell Ltd Lead frame of semiconductor device
JPH08241949A (en) * 1996-03-11 1996-09-17 Mitsubishi Electric Corp Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59171152A (en) * 1983-03-17 1984-09-27 Nec Corp Semiconductor device
JPS61208859A (en) * 1985-03-14 1986-09-17 Kyushu Hitachi Maxell Ltd Lead frame of semiconductor device
JPH08241949A (en) * 1996-03-11 1996-09-17 Mitsubishi Electric Corp Semiconductor device

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