JPS57106155A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57106155A
JPS57106155A JP55181978A JP18197880A JPS57106155A JP S57106155 A JPS57106155 A JP S57106155A JP 55181978 A JP55181978 A JP 55181978A JP 18197880 A JP18197880 A JP 18197880A JP S57106155 A JPS57106155 A JP S57106155A
Authority
JP
Japan
Prior art keywords
layer
bump
forming
plating
psg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55181978A
Other languages
Japanese (ja)
Inventor
Toru Kawanobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP55181978A priority Critical patent/JPS57106155A/en
Publication of JPS57106155A publication Critical patent/JPS57106155A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To prevent an element pellet from damage by forming a solder or tin layer on the surface of a bump, forming a tape lead of Cu, Ni or the like, thereby eliminating the use of gold and improving the bonding conditions. CONSTITUTION:An element pellet 10 is formed with a bump on the surface (lower surface) of an aluminum pad by a method of forming an element circuit such as PSG/SiO2 layer 15, PSG layer 16 by an ordinary step on an Si substrate 14 and employing electric plating and etching steps. The material of the bump 18 includes Cu, Ni, Fe or alloys thereof as main components, and thin solder or tin plating layer 21 of approx. 0.5-3mum is formed on the surface. The tape lead 12 is formed of Cu, Ni or their alloy. Particularly, the bonding with the bump is formed with a protective film 22 such as organic film or plating film for preventing the oxidation of the surface of the Cu. A Cr layer 19 or Cu layer 20 is formed between the aluminum pad and the bump.
JP55181978A 1980-12-24 1980-12-24 Semiconductor device Pending JPS57106155A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55181978A JPS57106155A (en) 1980-12-24 1980-12-24 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55181978A JPS57106155A (en) 1980-12-24 1980-12-24 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS57106155A true JPS57106155A (en) 1982-07-01

Family

ID=16110181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55181978A Pending JPS57106155A (en) 1980-12-24 1980-12-24 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57106155A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63275127A (en) * 1987-05-07 1988-11-11 Matsushita Electric Ind Co Ltd Electrical connection contact

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63275127A (en) * 1987-05-07 1988-11-11 Matsushita Electric Ind Co Ltd Electrical connection contact

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