JPS573877A - Thermosetting adhesive - Google Patents

Thermosetting adhesive

Info

Publication number
JPS573877A
JPS573877A JP7744380A JP7744380A JPS573877A JP S573877 A JPS573877 A JP S573877A JP 7744380 A JP7744380 A JP 7744380A JP 7744380 A JP7744380 A JP 7744380A JP S573877 A JPS573877 A JP S573877A
Authority
JP
Japan
Prior art keywords
resin
soluble
alcohol
adhesive
phenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7744380A
Other languages
Japanese (ja)
Inventor
Itsuo Matsuda
Kichinosuke Soma
Yutaka Nomi
Masahisa Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Products Co Ltd
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd, Toshiba Chemical Corp filed Critical Toshiba Chemical Products Co Ltd
Priority to JP7744380A priority Critical patent/JPS573877A/en
Publication of JPS573877A publication Critical patent/JPS573877A/en
Pending legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: The titled adhesive comprising an alcohol-soluble polyamide resin and phenol resin, a water-soluble epoxy resin and a euring agent of the epoxy resin, being of one-pack type simple and convenient to use, and having excellent chemical resistance.
CONSTITUTION: 25W65wt% Alcohol-soluble polyamide resin (A), 10W38wt% alcohol-soluble phenol resin (B) (e.g., a novolac type resin obtained from phenol and formal-dehyde) and 15W50wt% water-soluble epoxy resin (C) are dissolved in a solvent such as methanol or the like. Subsequently, a euring agent of resin C (e.g., dicyandiamide, etc.) is added to and dissolved uniformly in the solution to obtain a thermosetting adhesive. The adhesive is of one-pack type simple and convenient to use and provides excellent chemical resistance.
COPYRIGHT: (C)1982,JPO&Japio
JP7744380A 1980-06-09 1980-06-09 Thermosetting adhesive Pending JPS573877A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7744380A JPS573877A (en) 1980-06-09 1980-06-09 Thermosetting adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7744380A JPS573877A (en) 1980-06-09 1980-06-09 Thermosetting adhesive

Publications (1)

Publication Number Publication Date
JPS573877A true JPS573877A (en) 1982-01-09

Family

ID=13634157

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7744380A Pending JPS573877A (en) 1980-06-09 1980-06-09 Thermosetting adhesive

Country Status (1)

Country Link
JP (1) JPS573877A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5930857A (en) * 1982-05-10 1984-02-18 マハトスヒム・ケミカル・ワ−クス・リミテツド Manufacture of flame retardant thermoplastic nylon resin and composition therefor
JPS6157670A (en) * 1984-08-28 1986-03-24 Toshiba Chem Corp Adhesive composition for flexible printed circuit board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54125285A (en) * 1978-03-23 1979-09-28 Hitachi Chem Co Ltd Manufacturing of flexible printed circuit board
JPS5571771A (en) * 1978-11-27 1980-05-30 Yokohama Rubber Co Ltd:The Adhesive composition
JPS5571772A (en) * 1978-11-27 1980-05-30 Yokohama Rubber Co Ltd:The Adhesive composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54125285A (en) * 1978-03-23 1979-09-28 Hitachi Chem Co Ltd Manufacturing of flexible printed circuit board
JPS5571771A (en) * 1978-11-27 1980-05-30 Yokohama Rubber Co Ltd:The Adhesive composition
JPS5571772A (en) * 1978-11-27 1980-05-30 Yokohama Rubber Co Ltd:The Adhesive composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5930857A (en) * 1982-05-10 1984-02-18 マハトスヒム・ケミカル・ワ−クス・リミテツド Manufacture of flame retardant thermoplastic nylon resin and composition therefor
JPS6157670A (en) * 1984-08-28 1986-03-24 Toshiba Chem Corp Adhesive composition for flexible printed circuit board

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