JPS574146A - Package of semiconductor device - Google Patents

Package of semiconductor device

Info

Publication number
JPS574146A
JPS574146A JP7799480A JP7799480A JPS574146A JP S574146 A JPS574146 A JP S574146A JP 7799480 A JP7799480 A JP 7799480A JP 7799480 A JP7799480 A JP 7799480A JP S574146 A JPS574146 A JP S574146A
Authority
JP
Japan
Prior art keywords
lead wire
sealed
glass
convex part
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7799480A
Other languages
Japanese (ja)
Inventor
Yukio Hayakawa
Yoichi Emura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7799480A priority Critical patent/JPS574146A/en
Publication of JPS574146A publication Critical patent/JPS574146A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve a physical strength of a lead wire against a mechanical stress in a package in which a metallic mount for installing some component elements and outer lead wires are sealed by glass, by a method wherein either a convex part or a concave part is arranged at the sealed part of the lead wire. CONSTITUTION:A through-pass hole is arranged in the metallic mount 1 on which top surface some component elements are mounted. Outer lead wire 2 for use in drawing out an electrode of the element is passed through the through-pass hole, both the metallic mount 1 and the lead wire 2 are sealed by the sealing glass 3 and then fixed thereto. At the part 4 where the lead wire 2 is sealed with glass is provided either a convex part 6 or a concave part. Thereby, the lead wire 2 may be strongly fixed to the glass 3 at the convex part 6, and their adhering area is substantially made with, so that it is possible to prevent a determination of air-tightness caused by a mechanical stress etc.
JP7799480A 1980-06-10 1980-06-10 Package of semiconductor device Pending JPS574146A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7799480A JPS574146A (en) 1980-06-10 1980-06-10 Package of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7799480A JPS574146A (en) 1980-06-10 1980-06-10 Package of semiconductor device

Publications (1)

Publication Number Publication Date
JPS574146A true JPS574146A (en) 1982-01-09

Family

ID=13649360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7799480A Pending JPS574146A (en) 1980-06-10 1980-06-10 Package of semiconductor device

Country Status (1)

Country Link
JP (1) JPS574146A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008294258A (en) * 2007-05-25 2008-12-04 Panasonic Corp Electronic chip mounting base, manufacturing method thereof, and electronic apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008294258A (en) * 2007-05-25 2008-12-04 Panasonic Corp Electronic chip mounting base, manufacturing method thereof, and electronic apparatus

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