JPS6476744A - Resin sealed semiconductor device - Google Patents

Resin sealed semiconductor device

Info

Publication number
JPS6476744A
JPS6476744A JP62232201A JP23220187A JPS6476744A JP S6476744 A JPS6476744 A JP S6476744A JP 62232201 A JP62232201 A JP 62232201A JP 23220187 A JP23220187 A JP 23220187A JP S6476744 A JPS6476744 A JP S6476744A
Authority
JP
Japan
Prior art keywords
insulator
resin
becomes
edge part
stress
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62232201A
Other languages
Japanese (ja)
Other versions
JPH0828462B2 (en
Inventor
Sueo Kawai
Asao Nishimura
Makoto Kitano
Hideo Miura
Akihiro Yaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62232201A priority Critical patent/JPH0828462B2/en
Priority to KR1019880011746A priority patent/KR890005868A/en
Publication of JPS6476744A publication Critical patent/JPS6476744A/en
Priority to US07/536,932 priority patent/US4987474A/en
Publication of JPH0828462B2 publication Critical patent/JPH0828462B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To decrease stress concentration of resin generating in the edge part of an insulator, and prevent the resin crack from the insulator edge part, by making dimensions of the shorter side of an electric insulator between an element and a lead frame, smaller than those of the shorter side of an element. CONSTITUTION:The short side dimension of an electric insulator is made smaller than the shorter side dimensions of an element. When the dimension of an insulator 7 becomes smaller than that of an element, stress concentration at a point (a) becomes discontinuously small, and the stress concentration almost vanishes. Then, on the contrary, the stress at a point (b) of the edge part of the element 1 becomes large. But, if only the exfoliation of resin 5 from the element 1 does not occur, the generating stress does not becomes so large, and it can be restrained at a level in which resin crack does not occur.
JP62232201A 1987-09-18 1987-09-18 Resin-sealed semiconductor device Expired - Lifetime JPH0828462B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP62232201A JPH0828462B2 (en) 1987-09-18 1987-09-18 Resin-sealed semiconductor device
KR1019880011746A KR890005868A (en) 1987-09-18 1988-09-12 Semiconductor device and manufacturing method
US07/536,932 US4987474A (en) 1987-09-18 1990-06-12 Semiconductor device and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62232201A JPH0828462B2 (en) 1987-09-18 1987-09-18 Resin-sealed semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP7232322A Division JP2651132B2 (en) 1995-09-11 1995-09-11 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS6476744A true JPS6476744A (en) 1989-03-22
JPH0828462B2 JPH0828462B2 (en) 1996-03-21

Family

ID=16935570

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62232201A Expired - Lifetime JPH0828462B2 (en) 1987-09-18 1987-09-18 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPH0828462B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009240602A (en) * 2008-03-31 2009-10-22 Mitsubishi Electric Corp Vacuum cleaner

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6072236A (en) * 1983-09-28 1985-04-24 Toshiba Corp Semiconductor device
JPS61258458A (en) * 1985-05-13 1986-11-15 Hitachi Ltd Resin-sealed ic

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6072236A (en) * 1983-09-28 1985-04-24 Toshiba Corp Semiconductor device
JPS61258458A (en) * 1985-05-13 1986-11-15 Hitachi Ltd Resin-sealed ic

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009240602A (en) * 2008-03-31 2009-10-22 Mitsubishi Electric Corp Vacuum cleaner

Also Published As

Publication number Publication date
JPH0828462B2 (en) 1996-03-21

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