JPS574183A - Metallic thin strip for installing semiconductor light-emitting element - Google Patents

Metallic thin strip for installing semiconductor light-emitting element

Info

Publication number
JPS574183A
JPS574183A JP7816080A JP7816080A JPS574183A JP S574183 A JPS574183 A JP S574183A JP 7816080 A JP7816080 A JP 7816080A JP 7816080 A JP7816080 A JP 7816080A JP S574183 A JPS574183 A JP S574183A
Authority
JP
Japan
Prior art keywords
layer
emitting element
semiconductor light
constitution
thin strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7816080A
Other languages
English (en)
Inventor
Ikuo Fukuda
Kiyoshi Usui
Hiroshi Yamamoto
Masamichi Shindo
Masanobu Fujisaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7816080A priority Critical patent/JPS574183A/ja
Publication of JPS574183A publication Critical patent/JPS574183A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
JP7816080A 1980-06-10 1980-06-10 Metallic thin strip for installing semiconductor light-emitting element Pending JPS574183A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7816080A JPS574183A (en) 1980-06-10 1980-06-10 Metallic thin strip for installing semiconductor light-emitting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7816080A JPS574183A (en) 1980-06-10 1980-06-10 Metallic thin strip for installing semiconductor light-emitting element

Publications (1)

Publication Number Publication Date
JPS574183A true JPS574183A (en) 1982-01-09

Family

ID=13654164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7816080A Pending JPS574183A (en) 1980-06-10 1980-06-10 Metallic thin strip for installing semiconductor light-emitting element

Country Status (1)

Country Link
JP (1) JPS574183A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58111959U (ja) * 1982-01-21 1983-07-30 シャープ株式会社 半導体装置
JPS58111958U (ja) * 1982-01-21 1983-07-30 シャープ株式会社 半導体装置のリ−ドフレ−ム
JPH02110982A (ja) * 1989-09-08 1990-04-24 Sharp Corp 半導体装置の製造方法
JP2001230453A (ja) * 1999-12-08 2001-08-24 Nichia Chem Ind Ltd Ｌｅｄランプ及びその製造方法
JP2002094130A (ja) * 1999-01-05 2002-03-29 Nichia Chem Ind Ltd 発光ダイオード及びその製造方法、並びにそれを用いた表示装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54153573A (en) * 1978-05-25 1979-12-03 Mitsubishi Electric Corp Manufacture for compound semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54153573A (en) * 1978-05-25 1979-12-03 Mitsubishi Electric Corp Manufacture for compound semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58111959U (ja) * 1982-01-21 1983-07-30 シャープ株式会社 半導体装置
JPS58111958U (ja) * 1982-01-21 1983-07-30 シャープ株式会社 半導体装置のリ−ドフレ−ム
JPH02110982A (ja) * 1989-09-08 1990-04-24 Sharp Corp 半導体装置の製造方法
JP2002094130A (ja) * 1999-01-05 2002-03-29 Nichia Chem Ind Ltd 発光ダイオード及びその製造方法、並びにそれを用いた表示装置
JP2001230453A (ja) * 1999-12-08 2001-08-24 Nichia Chem Ind Ltd Ｌｅｄランプ及びその製造方法

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