JPS574182A - Metallic thin strip for installing semiconductor light-emitting element - Google Patents

Metallic thin strip for installing semiconductor light-emitting element

Info

Publication number
JPS574182A
JPS574182A JP7815980A JP7815980A JPS574182A JP S574182 A JPS574182 A JP S574182A JP 7815980 A JP7815980 A JP 7815980A JP 7815980 A JP7815980 A JP 7815980A JP S574182 A JPS574182 A JP S574182A
Authority
JP
Japan
Prior art keywords
layer
emitting element
semiconductor light
thin strip
metallic thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7815980A
Other languages
Japanese (ja)
Inventor
Ikuo Fukuda
Kiyoshi Usui
Hiroshi Yamamoto
Masamichi Shindo
Masanobu Fujisaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7815980A priority Critical patent/JPS574182A/en
Publication of JPS574182A publication Critical patent/JPS574182A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)

Abstract

PURPOSE:To prevent the lowering of luminous output by putting a metallic layer into which copper is difficult to diffuse between a copper layer and a silver layer at a tip section of a lead wire for installing the semiconductor light-emitting element. CONSTITUTION:A Ni kayer 14 is put between the Cu layer 12 and the Ag layer 13 on a Fe raw marerial 11. According to this constitution, the amount of Cu ions precipitating on the surface can be decreased without thickening the thickness of the expensive Ag layer 13, and manufacturing cost is reduced while an adverse effect on the luminous output characteristic of a light-emitting diode pellet due to Cu ions can be prevented.
JP7815980A 1980-06-10 1980-06-10 Metallic thin strip for installing semiconductor light-emitting element Pending JPS574182A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7815980A JPS574182A (en) 1980-06-10 1980-06-10 Metallic thin strip for installing semiconductor light-emitting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7815980A JPS574182A (en) 1980-06-10 1980-06-10 Metallic thin strip for installing semiconductor light-emitting element

Publications (1)

Publication Number Publication Date
JPS574182A true JPS574182A (en) 1982-01-09

Family

ID=13654133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7815980A Pending JPS574182A (en) 1980-06-10 1980-06-10 Metallic thin strip for installing semiconductor light-emitting element

Country Status (1)

Country Link
JP (1) JPS574182A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016072364A (en) * 2014-09-29 2016-05-09 日亜化学工業株式会社 Lead frame and light emitting device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54153573A (en) * 1978-05-25 1979-12-03 Mitsubishi Electric Corp Manufacture for compound semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54153573A (en) * 1978-05-25 1979-12-03 Mitsubishi Electric Corp Manufacture for compound semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016072364A (en) * 2014-09-29 2016-05-09 日亜化学工業株式会社 Lead frame and light emitting device

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