JPS5742152A - Resin sealed type semiconductor and manufacture thereof - Google Patents

Resin sealed type semiconductor and manufacture thereof

Info

Publication number
JPS5742152A
JPS5742152A JP55117979A JP11797980A JPS5742152A JP S5742152 A JPS5742152 A JP S5742152A JP 55117979 A JP55117979 A JP 55117979A JP 11797980 A JP11797980 A JP 11797980A JP S5742152 A JPS5742152 A JP S5742152A
Authority
JP
Japan
Prior art keywords
light transmitting
glass
window
pellet
constitution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55117979A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6130743B2 (cs
Inventor
Natsuki Kadokanou
Koji Nagao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP55117979A priority Critical patent/JPS5742152A/ja
Publication of JPS5742152A publication Critical patent/JPS5742152A/ja
Publication of JPS6130743B2 publication Critical patent/JPS6130743B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/06—Auxiliary circuits, e.g. for writing into memory
    • G11C16/10—Programming or data input circuits
    • G11C16/18—Circuits for erasing optically
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Volatile Memory (AREA)
JP55117979A 1980-08-27 1980-08-27 Resin sealed type semiconductor and manufacture thereof Granted JPS5742152A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55117979A JPS5742152A (en) 1980-08-27 1980-08-27 Resin sealed type semiconductor and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55117979A JPS5742152A (en) 1980-08-27 1980-08-27 Resin sealed type semiconductor and manufacture thereof

Publications (2)

Publication Number Publication Date
JPS5742152A true JPS5742152A (en) 1982-03-09
JPS6130743B2 JPS6130743B2 (cs) 1986-07-15

Family

ID=14725003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55117979A Granted JPS5742152A (en) 1980-08-27 1980-08-27 Resin sealed type semiconductor and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS5742152A (cs)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58207656A (ja) * 1982-05-28 1983-12-03 Fujitsu Ltd 樹脂封止型半導体装置およびその製造方法
US4663833A (en) * 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
US7087295B2 (en) 2002-01-18 2006-08-08 Sumitomo Electric Industries, Ltd. Surface-coated cutting tool

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58207656A (ja) * 1982-05-28 1983-12-03 Fujitsu Ltd 樹脂封止型半導体装置およびその製造方法
US4663833A (en) * 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
US7087295B2 (en) 2002-01-18 2006-08-08 Sumitomo Electric Industries, Ltd. Surface-coated cutting tool

Also Published As

Publication number Publication date
JPS6130743B2 (cs) 1986-07-15

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