JPS56103452A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56103452A
JPS56103452A JP600180A JP600180A JPS56103452A JP S56103452 A JPS56103452 A JP S56103452A JP 600180 A JP600180 A JP 600180A JP 600180 A JP600180 A JP 600180A JP S56103452 A JPS56103452 A JP S56103452A
Authority
JP
Japan
Prior art keywords
container
parts
glass
rays radiated
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP600180A
Other languages
Japanese (ja)
Other versions
JPS628032B2 (en
Inventor
Toshio Kurahashi
Yorio Kamata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP600180A priority Critical patent/JPS56103452A/en
Publication of JPS56103452A publication Critical patent/JPS56103452A/en
Publication of JPS628032B2 publication Critical patent/JPS628032B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/25—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons against alpha rays, e.g. for outer space applications
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Non-Volatile Memory (AREA)

Abstract

PURPOSE:To protect a semiconductor element from alpha-rays radiated from a sealing member by forming projecting parts inside a container at sealed parts of a cap and the container. CONSTITUTION:The projecting parts 111 are formed between a part of the container body 11 at which a semiconductor 12 is fitted and a glass member 14, and the heights of the porjecting parts are made more than the maximum thickness of the glass member. With this construction, radioactive rays radiated from the glass sealing member 14 is not allowed to reach the element 12 and soft errors are not found in the element 12. Also, the saeling member 14 can be prevented from flowing in.
JP600180A 1980-01-22 1980-01-22 Semiconductor device Granted JPS56103452A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP600180A JPS56103452A (en) 1980-01-22 1980-01-22 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP600180A JPS56103452A (en) 1980-01-22 1980-01-22 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS56103452A true JPS56103452A (en) 1981-08-18
JPS628032B2 JPS628032B2 (en) 1987-02-20

Family

ID=11626510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP600180A Granted JPS56103452A (en) 1980-01-22 1980-01-22 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56103452A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4839716A (en) * 1987-06-01 1989-06-13 Olin Corporation Semiconductor packaging
WO1996022669A3 (en) * 1995-01-13 1996-09-26 Space Electronics Inc Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US6261508B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Method for making a shielding composition
US6262362B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Radiation shielding of three dimensional multi-chip modules
US6368899B1 (en) 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
US6455864B1 (en) 1994-04-01 2002-09-24 Maxwell Electronic Components Group, Inc. Methods and compositions for ionizing radiation shielding
US6613978B2 (en) 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US6720493B1 (en) 1994-04-01 2004-04-13 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US7382043B2 (en) 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
US7696610B2 (en) 2003-07-16 2010-04-13 Maxwell Technologies, Inc. Apparatus for shielding integrated circuit devices

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4710169U (en) * 1971-02-25 1972-10-06
JPS5652415A (en) * 1979-10-03 1981-05-11 Hitachi Ltd Temperature control unit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4710169U (en) * 1971-02-25 1972-10-06
JPS5652415A (en) * 1979-10-03 1981-05-11 Hitachi Ltd Temperature control unit

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4839716A (en) * 1987-06-01 1989-06-13 Olin Corporation Semiconductor packaging
US6858795B2 (en) 1993-06-18 2005-02-22 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US6613978B2 (en) 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US6261508B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Method for making a shielding composition
US6262362B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Radiation shielding of three dimensional multi-chip modules
US6455864B1 (en) 1994-04-01 2002-09-24 Maxwell Electronic Components Group, Inc. Methods and compositions for ionizing radiation shielding
US5635754A (en) * 1994-04-01 1997-06-03 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US6720493B1 (en) 1994-04-01 2004-04-13 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
WO1996022669A3 (en) * 1995-01-13 1996-09-26 Space Electronics Inc Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US6368899B1 (en) 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
US6963125B2 (en) 2000-03-08 2005-11-08 Sony Corporation Electronic device packaging
US7382043B2 (en) 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
US7696610B2 (en) 2003-07-16 2010-04-13 Maxwell Technologies, Inc. Apparatus for shielding integrated circuit devices

Also Published As

Publication number Publication date
JPS628032B2 (en) 1987-02-20

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