JPS5745938A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5745938A
JPS5745938A JP55121163A JP12116380A JPS5745938A JP S5745938 A JPS5745938 A JP S5745938A JP 55121163 A JP55121163 A JP 55121163A JP 12116380 A JP12116380 A JP 12116380A JP S5745938 A JPS5745938 A JP S5745938A
Authority
JP
Japan
Prior art keywords
hole
wire
semiconductor device
polygonal
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55121163A
Other languages
Japanese (ja)
Inventor
Mitsunori Karasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP55121163A priority Critical patent/JPS5745938A/en
Publication of JPS5745938A publication Critical patent/JPS5745938A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To improve the water resistance and moisture resistance of a semiconductor device by so connecting a wire as to block a window of a protective film of the shape formed in a polygonal or circular-arc shape bent with obtuse angle. CONSTITUTION:An insulating protective film 3 is covered on the surface of an Si substrate 2, and a hole 6 is opened. The inner periphery of the hole 6 is so formed in the polygonal or circular-arc shape of a bent part with obtuse angle difficult to be concentrated with stress. An electrode 5 of aluminum wire 4 is exposed in the hole 6. A wire 7 is bonded to the hole 6, and the hole 6 is blocked with a nail head 8. Thus, moisture is not introduced, an electrode 5 is not corroded, the wire is not disconnected, and the reliability of the semiconductor device can be improved.
JP55121163A 1980-09-03 1980-09-03 Semiconductor device Pending JPS5745938A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55121163A JPS5745938A (en) 1980-09-03 1980-09-03 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55121163A JPS5745938A (en) 1980-09-03 1980-09-03 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5745938A true JPS5745938A (en) 1982-03-16

Family

ID=14804394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55121163A Pending JPS5745938A (en) 1980-09-03 1980-09-03 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5745938A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6035524A (en) * 1983-08-08 1985-02-23 Hitachi Micro Comput Eng Ltd Semiconductor device
JPH0623802U (en) * 1992-08-11 1994-03-29 ヨシイケ科研機器株式会社 Trolley wheels
JPH0667104U (en) * 1993-03-09 1994-09-20 住友金属工業株式会社 Wheel assembly device with brake disc
EP0844664A3 (en) * 1996-11-25 2000-05-10 Texas Instruments Incorporated A bond pad for an integrated circuit
US7049705B2 (en) * 2003-07-15 2006-05-23 Advanced Semiconductor Engineering, Inc. Chip structure

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6035524A (en) * 1983-08-08 1985-02-23 Hitachi Micro Comput Eng Ltd Semiconductor device
JPH0623802U (en) * 1992-08-11 1994-03-29 ヨシイケ科研機器株式会社 Trolley wheels
JPH0667104U (en) * 1993-03-09 1994-09-20 住友金属工業株式会社 Wheel assembly device with brake disc
EP0844664A3 (en) * 1996-11-25 2000-05-10 Texas Instruments Incorporated A bond pad for an integrated circuit
US7049705B2 (en) * 2003-07-15 2006-05-23 Advanced Semiconductor Engineering, Inc. Chip structure

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