JPS5756216B2 - - Google Patents
Info
- Publication number
- JPS5756216B2 JPS5756216B2 JP54002410A JP241079A JPS5756216B2 JP S5756216 B2 JPS5756216 B2 JP S5756216B2 JP 54002410 A JP54002410 A JP 54002410A JP 241079 A JP241079 A JP 241079A JP S5756216 B2 JPS5756216 B2 JP S5756216B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP241079A JPS5595338A (en) | 1979-01-12 | 1979-01-12 | Integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP241079A JPS5595338A (en) | 1979-01-12 | 1979-01-12 | Integrated circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5595338A JPS5595338A (en) | 1980-07-19 |
| JPS5756216B2 true JPS5756216B2 (de) | 1982-11-29 |
Family
ID=11528469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP241079A Granted JPS5595338A (en) | 1979-01-12 | 1979-01-12 | Integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5595338A (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1990001215A1 (fr) * | 1988-07-22 | 1990-02-08 | Nippondenso Co., Ltd. | Dispositif a semi-conducteurs |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6167936A (ja) * | 1984-09-11 | 1986-04-08 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
| JPS61292333A (ja) * | 1985-06-19 | 1986-12-23 | Sumitomo Electric Ind Ltd | 半導体チツプキヤリアの製造方法 |
| DE19856331B4 (de) * | 1998-12-07 | 2009-01-02 | Robert Bosch Gmbh | Verfahren zur Eingehäusung elektronischer Bauelemente |
| JP4637761B2 (ja) * | 2006-02-07 | 2011-02-23 | パナソニック株式会社 | 半導体装置およびその製造方法 |
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1979
- 1979-01-12 JP JP241079A patent/JPS5595338A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1990001215A1 (fr) * | 1988-07-22 | 1990-02-08 | Nippondenso Co., Ltd. | Dispositif a semi-conducteurs |
| EP0448713B1 (de) * | 1988-07-22 | 1993-10-27 | Nippondenso Co., Ltd. | Halbleiteranordnung |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5595338A (en) | 1980-07-19 |