JPS5758055B2 - - Google Patents

Info

Publication number
JPS5758055B2
JPS5758055B2 JP10281478A JP10281478A JPS5758055B2 JP S5758055 B2 JPS5758055 B2 JP S5758055B2 JP 10281478 A JP10281478 A JP 10281478A JP 10281478 A JP10281478 A JP 10281478A JP S5758055 B2 JPS5758055 B2 JP S5758055B2
Authority
JP
Japan
Prior art keywords
seat
auto
bonding
bonder
carrying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10281478A
Other languages
Japanese (ja)
Other versions
JPS5530810A (en
Inventor
Tatsuo Hatanaka
Kyohei Tamaki
Tetsuo Nanbu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP10281478A priority Critical patent/JPS5530810A/en
Priority to US06/069,286 priority patent/US4301958A/en
Publication of JPS5530810A publication Critical patent/JPS5530810A/en
Publication of JPS5758055B2 publication Critical patent/JPS5758055B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor

Landscapes

  • Attitude Control For Articles On Conveyors (AREA)

Abstract

PURPOSE:To effect the laborsaving of semiconductor assembling by systemizing a bonding device to automate the handling of a lead frame. CONSTITUTION:Chip is connected to a lead frame 7, which is supplied to an auto- dice bonder 3 of an automatic bonding system connecting in order an auto-dice bonder 3, a buffer, an auto-wire bonder, and a magazine conveyor; then, a mechanism 9 for cutting it in fixed length and a mechanism 10 for carrying a seat are set. To the buffer are set a mechanism for carrying a seat and a mechanism for temporarily storing this. To the auto-wire bonder are set a mechanism for supplying the carried seat to a bonding operation part and a mechanism for returning to the carrying part the seat after the bonding: a magazine conveyor can store the seat in a magazine.
JP10281478A 1978-08-24 1978-08-25 Automatic bonding system for semiconductor device assembling Granted JPS5530810A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP10281478A JPS5530810A (en) 1978-08-25 1978-08-25 Automatic bonding system for semiconductor device assembling
US06/069,286 US4301958A (en) 1978-08-24 1979-08-24 Arrangement for automatically fabricating and bonding semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10281478A JPS5530810A (en) 1978-08-25 1978-08-25 Automatic bonding system for semiconductor device assembling

Publications (2)

Publication Number Publication Date
JPS5530810A JPS5530810A (en) 1980-03-04
JPS5758055B2 true JPS5758055B2 (en) 1982-12-08

Family

ID=14337494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10281478A Granted JPS5530810A (en) 1978-08-24 1978-08-25 Automatic bonding system for semiconductor device assembling

Country Status (1)

Country Link
JP (1) JPS5530810A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63166238A (en) * 1986-12-27 1988-07-09 Shinkawa Ltd Inner lead bonding equipment
EP4681866A3 (en) 2017-04-04 2026-04-29 Kulicke and Soffa Industries, Inc. Ultrasonic welding system and method of operating an ultrasonic welding system
CN110482153B (en) * 2019-08-07 2024-04-12 四川大学 Automatic lead ingot carrying device
CN112193755B (en) * 2020-09-22 2024-08-20 淮北矿业股份有限公司 Device and method for realizing multi-span belt sampling coal flow centralized aggregate conveying

Also Published As

Publication number Publication date
JPS5530810A (en) 1980-03-04

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