JPS5759341A - Automatic bonding method for device - Google Patents

Automatic bonding method for device

Info

Publication number
JPS5759341A
JPS5759341A JP55134839A JP13483980A JPS5759341A JP S5759341 A JPS5759341 A JP S5759341A JP 55134839 A JP55134839 A JP 55134839A JP 13483980 A JP13483980 A JP 13483980A JP S5759341 A JPS5759341 A JP S5759341A
Authority
JP
Japan
Prior art keywords
devices
wiring substrate
tapes
inspected
coded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55134839A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6216540B2 (fr
Inventor
Yuichi Yoshida
Yuji Matsuda
Masaru Iwasaki
Takashi Nukui
Shigeo Nakatake
Katsuteru Awane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP55134839A priority Critical patent/JPS5759341A/ja
Publication of JPS5759341A publication Critical patent/JPS5759341A/ja
Publication of JPS6216540B2 publication Critical patent/JPS6216540B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP55134839A 1980-09-26 1980-09-26 Automatic bonding method for device Granted JPS5759341A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55134839A JPS5759341A (en) 1980-09-26 1980-09-26 Automatic bonding method for device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55134839A JPS5759341A (en) 1980-09-26 1980-09-26 Automatic bonding method for device

Publications (2)

Publication Number Publication Date
JPS5759341A true JPS5759341A (en) 1982-04-09
JPS6216540B2 JPS6216540B2 (fr) 1987-04-13

Family

ID=15137662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55134839A Granted JPS5759341A (en) 1980-09-26 1980-09-26 Automatic bonding method for device

Country Status (1)

Country Link
JP (1) JPS5759341A (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63173670A (ja) * 1987-01-13 1988-07-18 Alps Electric Co Ltd 光書き込みヘッド
US5542600A (en) * 1991-11-07 1996-08-06 Omron Corporation Automatic soldering apparatus, apparatus and method for teaching same, soldering inspection apparatus and method, and apparatus and method for automatically correcting soldering

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63173670A (ja) * 1987-01-13 1988-07-18 Alps Electric Co Ltd 光書き込みヘッド
US5542600A (en) * 1991-11-07 1996-08-06 Omron Corporation Automatic soldering apparatus, apparatus and method for teaching same, soldering inspection apparatus and method, and apparatus and method for automatically correcting soldering

Also Published As

Publication number Publication date
JPS6216540B2 (fr) 1987-04-13

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