JPS5759922A - Production of a curing agent for epoxy resin - Google Patents

Production of a curing agent for epoxy resin

Info

Publication number
JPS5759922A
JPS5759922A JP13607780A JP13607780A JPS5759922A JP S5759922 A JPS5759922 A JP S5759922A JP 13607780 A JP13607780 A JP 13607780A JP 13607780 A JP13607780 A JP 13607780A JP S5759922 A JPS5759922 A JP S5759922A
Authority
JP
Japan
Prior art keywords
curing agent
anhydride
halogen
alkyl
heated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13607780A
Other languages
Japanese (ja)
Inventor
Kazuo Akagane
Kunimasa Kamio
Koichi Okuno
Satoru Haraguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Priority to JP13607780A priority Critical patent/JPS5759922A/en
Publication of JPS5759922A publication Critical patent/JPS5759922A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

PURPOSE: A specific styrene and a maleic acid are heated at a specific molar ratio in the presence of an acid anhydride to effect the reaction, thereby the titled curing agent is produced, which causes no bubbling and shows high eveness, good operability and compatibility.
CONSTITUTION: (A)Styrenes containing more than 20mol%, preferably 40mol% of an α-alkylstyene of formulaI(R is 1W4C alkyl; X1 and X2 are hydrogen, halogen, aryl) such as α-methylstyrene as an essential component and (B) a maleic acid of formula II[X,Y are hydroxyl, halogen, OR(R is alkyl, allyl); R1, R2 are H, halogen, alkyl]such as maleic anhydride are heated at a molar ratio A/B of 1/(1W5) in the absence of a radical polymerization catalyst in the presence of 0.01W10pts.wt., based on the total amount of components A and B, of polycarboxylic anhydride such as methylhexahydrophthalic anhydride to effect the reaction to produce the objective curing agent.
COPYRIGHT: (C)1982,JPO&Japio
JP13607780A 1980-09-29 1980-09-29 Production of a curing agent for epoxy resin Pending JPS5759922A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13607780A JPS5759922A (en) 1980-09-29 1980-09-29 Production of a curing agent for epoxy resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13607780A JPS5759922A (en) 1980-09-29 1980-09-29 Production of a curing agent for epoxy resin

Publications (1)

Publication Number Publication Date
JPS5759922A true JPS5759922A (en) 1982-04-10

Family

ID=15166690

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13607780A Pending JPS5759922A (en) 1980-09-29 1980-09-29 Production of a curing agent for epoxy resin

Country Status (1)

Country Link
JP (1) JPS5759922A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5215863A (en) * 1987-12-18 1993-06-01 Nippon Kayaku Kabushiki Kaisha Resin composition and solder resist composition
WO2015010281A1 (en) * 2013-07-24 2015-01-29 Dow Global Technologies Llc Curable compositions

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5215863A (en) * 1987-12-18 1993-06-01 Nippon Kayaku Kabushiki Kaisha Resin composition and solder resist composition
WO2015010281A1 (en) * 2013-07-24 2015-01-29 Dow Global Technologies Llc Curable compositions

Similar Documents

Publication Publication Date Title
JPS5640220A (en) Manufacturing of flyback transformer
JPS55102614A (en) Styrene copolymer and its preparation
JPS5759922A (en) Production of a curing agent for epoxy resin
JPS56166225A (en) Epoxy resin composition
JPS54162750A (en) Aromatic polyester composition
JPS5650941A (en) Covering resin composition
JPS54120661A (en) Polyester resin composition
JPS54122398A (en) Curable resin composition
JPS5655422A (en) Curable resin composition
JPS5584307A (en) Preparation of curing composition
JPS562313A (en) Photosensitive grafted unsaturated resin and photosensitive resin composition containing the same
JPS572316A (en) Thermosetting resin composition
JPS57205416A (en) Unsaturated polyester resin composition
JPS57109852A (en) Curing method of silicone
JPS572317A (en) Thermosetting resin composition
JPS5658826A (en) Preparation of unsaturated polyester resin laminate
JPS5665010A (en) Resin composition
JPS5676421A (en) Production of styrene type resin having good adhesive property
JPS5697341A (en) Photosensitive composition
JPS57177050A (en) Preparation of heat-resistant thermosetting resin
JPS544984A (en) Resin composition for insulating treatment
JPS5616562A (en) Unsaturated polyester resin coating material
JPS57117519A (en) Photosetting and thermosetting resin composition
JPS5578009A (en) Unsaturated oligoester resin composition
JPS5516006A (en) Thermosetting resin composition