JPS5771160A - Manufacture of thick film printed circuit substrate - Google Patents

Manufacture of thick film printed circuit substrate

Info

Publication number
JPS5771160A
JPS5771160A JP55146811A JP14681180A JPS5771160A JP S5771160 A JPS5771160 A JP S5771160A JP 55146811 A JP55146811 A JP 55146811A JP 14681180 A JP14681180 A JP 14681180A JP S5771160 A JPS5771160 A JP S5771160A
Authority
JP
Japan
Prior art keywords
circuit
glass
calcining
substrate
resistor circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55146811A
Other languages
Japanese (ja)
Inventor
Shoichi Muramoto
Nobuyoshi Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP55146811A priority Critical patent/JPS5771160A/en
Publication of JPS5771160A publication Critical patent/JPS5771160A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors

Landscapes

  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

PURPOSE:To provide a high-accuracy substrae with a low variation in resistance value by a method wherein conductor circuits and a resistor circuit are provided on an insulation substrate and the resistance value is adjusted after printing and calcining the first glass layers and an upper layer circuit is provided through the second low-melting point glass layers. CONSTITUTION:For example, after consecutively printing and calcining Ag-Pd oriented conductor circuits 2 and a resistor circuit 3 consisting of RuO2 oriented paste on a substrate 1 such as ceramics, glass layeres 4 are printed at 900 deg.C for calcination. Next, after trimming the resistor circuit 3, glass layers 5 having lower melting point than that of he glass layers 4 are printed and calcined at 800 deg.C. Next, a conductor circuit 6, a resistor circuit 7, and an over coat glass layer 8 are consecutively printed on an upper layer insulated by glass layers 4, 5 and after calcining them, a desired circuit substrate is made by trimming the resistor circuit 7. In this way, a variation in resistance value by a glass layer calcining process can be reduced and short circuit between layers can also be prevented and the high- accuracy and high-reliability substrate can be obtained.
JP55146811A 1980-10-22 1980-10-22 Manufacture of thick film printed circuit substrate Pending JPS5771160A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55146811A JPS5771160A (en) 1980-10-22 1980-10-22 Manufacture of thick film printed circuit substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55146811A JPS5771160A (en) 1980-10-22 1980-10-22 Manufacture of thick film printed circuit substrate

Publications (1)

Publication Number Publication Date
JPS5771160A true JPS5771160A (en) 1982-05-01

Family

ID=15416057

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55146811A Pending JPS5771160A (en) 1980-10-22 1980-10-22 Manufacture of thick film printed circuit substrate

Country Status (1)

Country Link
JP (1) JPS5771160A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS598302A (en) * 1982-07-06 1984-01-17 松下電器産業株式会社 Method of producing square chip resistor
JPS6027104A (en) * 1983-07-22 1985-02-12 ロ−ム株式会社 Method of producing chip resistor
JPS63241902A (en) * 1987-03-28 1988-10-07 ソニー株式会社 Manufacture of printed resistance board
JPH02191304A (en) * 1989-12-16 1990-07-27 Rohm Co Ltd Manufacture of chip resistor
JPH03283593A (en) * 1990-03-30 1991-12-13 Ngk Insulators Ltd Thick film multilayer board
JPH04355901A (en) * 1991-07-12 1992-12-09 Rohm Co Ltd Chip resistor
US6458670B2 (en) * 1997-08-05 2002-10-01 Denso Corporation Method of manufacturing a circuit substrate

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS598302A (en) * 1982-07-06 1984-01-17 松下電器産業株式会社 Method of producing square chip resistor
JPS6027104A (en) * 1983-07-22 1985-02-12 ロ−ム株式会社 Method of producing chip resistor
JPS63241902A (en) * 1987-03-28 1988-10-07 ソニー株式会社 Manufacture of printed resistance board
JPH02191304A (en) * 1989-12-16 1990-07-27 Rohm Co Ltd Manufacture of chip resistor
JPH03283593A (en) * 1990-03-30 1991-12-13 Ngk Insulators Ltd Thick film multilayer board
JPH04355901A (en) * 1991-07-12 1992-12-09 Rohm Co Ltd Chip resistor
US6458670B2 (en) * 1997-08-05 2002-10-01 Denso Corporation Method of manufacturing a circuit substrate

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