JPS5772359A - Lead frame for integrated circuit - Google Patents

Lead frame for integrated circuit

Info

Publication number
JPS5772359A
JPS5772359A JP55149783A JP14978380A JPS5772359A JP S5772359 A JPS5772359 A JP S5772359A JP 55149783 A JP55149783 A JP 55149783A JP 14978380 A JP14978380 A JP 14978380A JP S5772359 A JPS5772359 A JP S5772359A
Authority
JP
Japan
Prior art keywords
small piece
section
inner lead
shaped
detaching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55149783A
Other languages
Japanese (ja)
Other versions
JPH02860B2 (en
Inventor
Hiroshi Chiba
Shoichi Ogura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP55149783A priority Critical patent/JPS5772359A/en
Publication of JPS5772359A publication Critical patent/JPS5772359A/en
Publication of JPH02860B2 publication Critical patent/JPH02860B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the change of a position of a nose of an inner lead, and to ensure the connection of an Al wire by combining a small piece with the nose of the inner lead and forming a thinned section and a hanging section for removing the small piece to the small piece. CONSTITUTION:The inner lead is shaped by detaching in a form that a concave section is molded to a central connecting section. The small piece 5 of the central connecting section is not drawn out and pushed back to an original plate by spring force buried in a lower die with the rise of a press upper die after detaching at that time. Consequently, the small piece 5 and the inner lead are combined, and held each other, and the small piece 5 is not slipped off. A small hole 8 and angles 12 shaped to sections bent in V-shaped forms are molded, and used as the hanging sections. When drawing the small piece 5, the small piece 5 is bent simply from the center by means of the thinned section, and a component force in the horizontal direction functions to a combined section with the inner lead.
JP55149783A 1980-10-24 1980-10-24 Lead frame for integrated circuit Granted JPS5772359A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55149783A JPS5772359A (en) 1980-10-24 1980-10-24 Lead frame for integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55149783A JPS5772359A (en) 1980-10-24 1980-10-24 Lead frame for integrated circuit

Publications (2)

Publication Number Publication Date
JPS5772359A true JPS5772359A (en) 1982-05-06
JPH02860B2 JPH02860B2 (en) 1990-01-09

Family

ID=15482613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55149783A Granted JPS5772359A (en) 1980-10-24 1980-10-24 Lead frame for integrated circuit

Country Status (1)

Country Link
JP (1) JPS5772359A (en)

Also Published As

Publication number Publication date
JPH02860B2 (en) 1990-01-09

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