JPS5772360A - Semiconductor device assembled according to film carrier system - Google Patents

Semiconductor device assembled according to film carrier system

Info

Publication number
JPS5772360A
JPS5772360A JP55148335A JP14833580A JPS5772360A JP S5772360 A JPS5772360 A JP S5772360A JP 55148335 A JP55148335 A JP 55148335A JP 14833580 A JP14833580 A JP 14833580A JP S5772360 A JPS5772360 A JP S5772360A
Authority
JP
Japan
Prior art keywords
chip
pads
leads
semiconductor device
bent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55148335A
Other languages
Japanese (ja)
Inventor
Toru Kawanobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP55148335A priority Critical patent/JPS5772360A/en
Publication of JPS5772360A publication Critical patent/JPS5772360A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To manufacture the semiconductor device easily, at low cost and in excellent yield by a method wherein a connecting position of a lead to a semiconductor chip is bent to the semiconductor chip side and formed prominently, and the porjecting section is directly connected to a pad of the semiconductor chip. CONSTITUTION:The Al pads 2 are attached to the IC chip 1, and the leads 3 are directly heated and welded to the pads 2. The connected or combined positions of the leads 3 to the pads 2 are bent mechanically to the chip 1 side, and the bent projecting sections 4 fill the role of bumps. According to this constitution, a chip for normal wire bonding with no bump is used as the chip 1, the pads 2 are applied to the projecting sections 4 of the leads 3 from the lower side, and the whole is heated under this condition, thus combining the leads 3 and the chip 1, then electrically connecting them.
JP55148335A 1980-10-24 1980-10-24 Semiconductor device assembled according to film carrier system Pending JPS5772360A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55148335A JPS5772360A (en) 1980-10-24 1980-10-24 Semiconductor device assembled according to film carrier system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55148335A JPS5772360A (en) 1980-10-24 1980-10-24 Semiconductor device assembled according to film carrier system

Publications (1)

Publication Number Publication Date
JPS5772360A true JPS5772360A (en) 1982-05-06

Family

ID=15450460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55148335A Pending JPS5772360A (en) 1980-10-24 1980-10-24 Semiconductor device assembled according to film carrier system

Country Status (1)

Country Link
JP (1) JPS5772360A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01297833A (en) * 1988-05-26 1989-11-30 Hitachi Ltd semiconductor equipment
JPH02192747A (en) * 1989-01-20 1990-07-30 Hitachi Cable Ltd Tape carrier for TAB

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01297833A (en) * 1988-05-26 1989-11-30 Hitachi Ltd semiconductor equipment
JPH02192747A (en) * 1989-01-20 1990-07-30 Hitachi Cable Ltd Tape carrier for TAB

Similar Documents

Publication Publication Date Title
JPS6428945A (en) Circuit package assembly
EP0247775A3 (en) Semiconductor package with high density i/o lead connection
GB2307336B (en) Integrated circuit package and method of fabrication
KR960019680A (en) Semiconductor device package method and device package
SG73389A1 (en) Method of connecting tab tape to semiconductor chip and bump sheet and bumped tape used in the method
EP0753891A3 (en) Low loop wire bonding
SG165145A1 (en) Film carrier tape
JPS5655067A (en) Semiconductor integrated circuit device
JPS5772360A (en) Semiconductor device assembled according to film carrier system
NL7504380A (en) CERAMIC PACKAGE WITHOUT CONNECTION PIPES, INTEGRATED FOR AN INTEGRATED CHAIN.
JPS5449066A (en) Semiconductor device
JPS5785244A (en) Semiconductor device
CA2273223A1 (en) Chip-size package using a polyimide pcb interposer
JPS6459947A (en) Semiconductor device
JPS5745263A (en) Package for semiconductor device
JPS57133651A (en) Semiconductor integrated circuit device
JPS5737867A (en) Semiconductor device
JPS647645A (en) Semiconductor device and manufacture thereof
JPS57111054A (en) Semiconductor device
JPS6476732A (en) Semiconductor device
MY106858A (en) Resin sealing type semiconductor device in which a very small semiconductor chip is sealed in package with resin.
JPS5469383A (en) Production of semiconductor device
JPS5723254A (en) Semiconductor device
JPS5290975A (en) Electronic wristwatch
JPS55127032A (en) Plastic molded type semiconductor device