JPS5772789A - Solder alloy - Google Patents

Solder alloy

Info

Publication number
JPS5772789A
JPS5772789A JP15092380A JP15092380A JPS5772789A JP S5772789 A JPS5772789 A JP S5772789A JP 15092380 A JP15092380 A JP 15092380A JP 15092380 A JP15092380 A JP 15092380A JP S5772789 A JPS5772789 A JP S5772789A
Authority
JP
Japan
Prior art keywords
solder alloy
infiltration
alloy
spheroidizing
solderability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15092380A
Other languages
Japanese (ja)
Other versions
JPS5739880B2 (en
Inventor
Shigemi Yokoi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TARUCHIN KK
Original Assignee
TARUCHIN KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TARUCHIN KK filed Critical TARUCHIN KK
Priority to JP15092380A priority Critical patent/JPS5772789A/en
Publication of JPS5772789A publication Critical patent/JPS5772789A/en
Publication of JPS5739880B2 publication Critical patent/JPS5739880B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/268—Pb as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

PURPOSE:To improve the solderability of a solder alloy obtained by contg. a slight amt. of P in a Pb-Sn-Cd alloy and prevent the melting and infiltration of Ag or Au. CONSTITUTION:This solder alloy consists of 10-90wt% Sn, 0.1-5.0wt% Cd, and 0.00001-0.5wt% P, and the balance Pb. Since this solder alloy does not contain any costly metal, it is inexpensive. In soldering, the infiltration of Ag or Au into the molten solder alloy is virtually prevented. Hence, the occurrence of partially annihilating and spheroidizing phenomena in the Ag or Au film on a substrate is obviated.
JP15092380A 1980-10-27 1980-10-27 Solder alloy Granted JPS5772789A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15092380A JPS5772789A (en) 1980-10-27 1980-10-27 Solder alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15092380A JPS5772789A (en) 1980-10-27 1980-10-27 Solder alloy

Publications (2)

Publication Number Publication Date
JPS5772789A true JPS5772789A (en) 1982-05-07
JPS5739880B2 JPS5739880B2 (en) 1982-08-24

Family

ID=15507355

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15092380A Granted JPS5772789A (en) 1980-10-27 1980-10-27 Solder alloy

Country Status (1)

Country Link
JP (1) JPS5772789A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0652072A1 (en) * 1993-11-09 1995-05-10 Matsushita Electric Industrial Co., Ltd. Solder
CN105290638A (en) * 2015-11-30 2016-02-03 苏州龙腾万里化工科技有限公司 Cadmium-added soldering tin

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100413633C (en) * 2003-09-05 2008-08-27 中国科学院金属研究所 A kind of oxidation-resistant tin-lead alloy solder

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0652072A1 (en) * 1993-11-09 1995-05-10 Matsushita Electric Industrial Co., Ltd. Solder
CN105290638A (en) * 2015-11-30 2016-02-03 苏州龙腾万里化工科技有限公司 Cadmium-added soldering tin

Also Published As

Publication number Publication date
JPS5739880B2 (en) 1982-08-24

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