JPS577611A - Mounting method for elastic surface wave element - Google Patents

Mounting method for elastic surface wave element

Info

Publication number
JPS577611A
JPS577611A JP8129180A JP8129180A JPS577611A JP S577611 A JPS577611 A JP S577611A JP 8129180 A JP8129180 A JP 8129180A JP 8129180 A JP8129180 A JP 8129180A JP S577611 A JPS577611 A JP S577611A
Authority
JP
Japan
Prior art keywords
printed board
pad
surface wave
resin
elastic surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8129180A
Other languages
English (en)
Inventor
Noboru Wakatsuki
Yoshiaki Fujiwara
Shigeo Tanji
Masaaki Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP8129180A priority Critical patent/JPS577611A/ja
Publication of JPS577611A publication Critical patent/JPS577611A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP8129180A 1980-06-18 1980-06-18 Mounting method for elastic surface wave element Pending JPS577611A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8129180A JPS577611A (en) 1980-06-18 1980-06-18 Mounting method for elastic surface wave element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8129180A JPS577611A (en) 1980-06-18 1980-06-18 Mounting method for elastic surface wave element

Publications (1)

Publication Number Publication Date
JPS577611A true JPS577611A (en) 1982-01-14

Family

ID=13742271

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8129180A Pending JPS577611A (en) 1980-06-18 1980-06-18 Mounting method for elastic surface wave element

Country Status (1)

Country Link
JP (1) JPS577611A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0866552A3 (en) * 1990-11-05 1999-06-30 Fujitsu Limited Surface-acoustic-wave device
WO2003058810A1 (de) * 2001-12-28 2003-07-17 Epcos Ag Verkapseltes bauelement mit geringer bauhöhe sowie verfahren zur herstellung

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0866552A3 (en) * 1990-11-05 1999-06-30 Fujitsu Limited Surface-acoustic-wave device
WO2003058810A1 (de) * 2001-12-28 2003-07-17 Epcos Ag Verkapseltes bauelement mit geringer bauhöhe sowie verfahren zur herstellung
DE10164494B4 (de) * 2001-12-28 2014-06-18 Epcos Ag Verkapseltes Bauelement mit geringer Bauhöhe sowie Verfahren zur Herstellung
DE10164494B9 (de) 2001-12-28 2014-08-21 Epcos Ag Verkapseltes Bauelement mit geringer Bauhöhe sowie Verfahren zur Herstellung

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