JPS5776835A - Apparatus for applying liquid on semiconductor substrate - Google Patents
Apparatus for applying liquid on semiconductor substrateInfo
- Publication number
- JPS5776835A JPS5776835A JP55152589A JP15258980A JPS5776835A JP S5776835 A JPS5776835 A JP S5776835A JP 55152589 A JP55152589 A JP 55152589A JP 15258980 A JP15258980 A JP 15258980A JP S5776835 A JPS5776835 A JP S5776835A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- photoresist
- delivery nozzle
- liquid
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
PURPOSE:To prevent the increase in viscosity of liquid to be applied and hardening thereof, by filling the tip part, which delivers the liquid to be applied, with the atmosphere caused by the solvent of the liquid to be applied. CONSTITUTION:A delivery nozzle 4 delivers photoresist to the surface of a wafer 3. Said delivery nozzle 4 is enclosed by a cover pipe 5. Therefore, the tip part of the delivery nozzle 4 is filled with the atmosphere of the solvent of the photoresist. A carrier wherein the wafers are enclosed is set in a supply elevator 9 and automatically transferred to a wafer coating processor by a wafer transfer mechanism 8. The transferred wafer 3 is sucked by a vacuum chuck 2. After the photoresist has been applied on the wafer from the photoresist delivery nozzle 4, the wafer is automatically accommodated in a carrier set in an accommodating elevator 11 by a wafer transfer device 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55152589A JPS5776835A (en) | 1980-10-30 | 1980-10-30 | Apparatus for applying liquid on semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55152589A JPS5776835A (en) | 1980-10-30 | 1980-10-30 | Apparatus for applying liquid on semiconductor substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5776835A true JPS5776835A (en) | 1982-05-14 |
Family
ID=15543749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55152589A Pending JPS5776835A (en) | 1980-10-30 | 1980-10-30 | Apparatus for applying liquid on semiconductor substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5776835A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6122627A (en) * | 1984-07-10 | 1986-01-31 | Mitsubishi Electric Corp | Photo-sensitive resin coating nozzle |
| WO1995005901A1 (en) * | 1993-08-26 | 1995-03-02 | Steag Micro-Tech Gmbh Sternenfels | Device for coating substrates in semiconductor manufacture |
| US5650196A (en) * | 1993-05-05 | 1997-07-22 | Steag Microtech Gmbh | Device for coating substrates in semiconductor production |
-
1980
- 1980-10-30 JP JP55152589A patent/JPS5776835A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6122627A (en) * | 1984-07-10 | 1986-01-31 | Mitsubishi Electric Corp | Photo-sensitive resin coating nozzle |
| US5650196A (en) * | 1993-05-05 | 1997-07-22 | Steag Microtech Gmbh | Device for coating substrates in semiconductor production |
| WO1995005901A1 (en) * | 1993-08-26 | 1995-03-02 | Steag Micro-Tech Gmbh Sternenfels | Device for coating substrates in semiconductor manufacture |
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