JPS5776835A - Apparatus for applying liquid on semiconductor substrate - Google Patents

Apparatus for applying liquid on semiconductor substrate

Info

Publication number
JPS5776835A
JPS5776835A JP55152589A JP15258980A JPS5776835A JP S5776835 A JPS5776835 A JP S5776835A JP 55152589 A JP55152589 A JP 55152589A JP 15258980 A JP15258980 A JP 15258980A JP S5776835 A JPS5776835 A JP S5776835A
Authority
JP
Japan
Prior art keywords
wafer
photoresist
delivery nozzle
liquid
semiconductor substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55152589A
Other languages
Japanese (ja)
Inventor
Hidemi Amai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP55152589A priority Critical patent/JPS5776835A/en
Publication of JPS5776835A publication Critical patent/JPS5776835A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/162Coating on a rotating support, e.g. using a whirler or a spinner

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To prevent the increase in viscosity of liquid to be applied and hardening thereof, by filling the tip part, which delivers the liquid to be applied, with the atmosphere caused by the solvent of the liquid to be applied. CONSTITUTION:A delivery nozzle 4 delivers photoresist to the surface of a wafer 3. Said delivery nozzle 4 is enclosed by a cover pipe 5. Therefore, the tip part of the delivery nozzle 4 is filled with the atmosphere of the solvent of the photoresist. A carrier wherein the wafers are enclosed is set in a supply elevator 9 and automatically transferred to a wafer coating processor by a wafer transfer mechanism 8. The transferred wafer 3 is sucked by a vacuum chuck 2. After the photoresist has been applied on the wafer from the photoresist delivery nozzle 4, the wafer is automatically accommodated in a carrier set in an accommodating elevator 11 by a wafer transfer device 10.
JP55152589A 1980-10-30 1980-10-30 Apparatus for applying liquid on semiconductor substrate Pending JPS5776835A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55152589A JPS5776835A (en) 1980-10-30 1980-10-30 Apparatus for applying liquid on semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55152589A JPS5776835A (en) 1980-10-30 1980-10-30 Apparatus for applying liquid on semiconductor substrate

Publications (1)

Publication Number Publication Date
JPS5776835A true JPS5776835A (en) 1982-05-14

Family

ID=15543749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55152589A Pending JPS5776835A (en) 1980-10-30 1980-10-30 Apparatus for applying liquid on semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS5776835A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6122627A (en) * 1984-07-10 1986-01-31 Mitsubishi Electric Corp Photo-sensitive resin coating nozzle
WO1995005901A1 (en) * 1993-08-26 1995-03-02 Steag Micro-Tech Gmbh Sternenfels Device for coating substrates in semiconductor manufacture
US5650196A (en) * 1993-05-05 1997-07-22 Steag Microtech Gmbh Device for coating substrates in semiconductor production

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6122627A (en) * 1984-07-10 1986-01-31 Mitsubishi Electric Corp Photo-sensitive resin coating nozzle
US5650196A (en) * 1993-05-05 1997-07-22 Steag Microtech Gmbh Device for coating substrates in semiconductor production
WO1995005901A1 (en) * 1993-08-26 1995-03-02 Steag Micro-Tech Gmbh Sternenfels Device for coating substrates in semiconductor manufacture

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