JPS5776849A - Bonding device for semiconductor pellel - Google Patents

Bonding device for semiconductor pellel

Info

Publication number
JPS5776849A
JPS5776849A JP55153202A JP15320280A JPS5776849A JP S5776849 A JPS5776849 A JP S5776849A JP 55153202 A JP55153202 A JP 55153202A JP 15320280 A JP15320280 A JP 15320280A JP S5776849 A JPS5776849 A JP S5776849A
Authority
JP
Japan
Prior art keywords
section
stages
nozzle
adsorbing
transfer head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55153202A
Other languages
English (en)
Inventor
Tatsuo Oketa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55153202A priority Critical patent/JPS5776849A/ja
Publication of JPS5776849A publication Critical patent/JPS5776849A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Die Bonding (AREA)
JP55153202A 1980-10-31 1980-10-31 Bonding device for semiconductor pellel Pending JPS5776849A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55153202A JPS5776849A (en) 1980-10-31 1980-10-31 Bonding device for semiconductor pellel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55153202A JPS5776849A (en) 1980-10-31 1980-10-31 Bonding device for semiconductor pellel

Publications (1)

Publication Number Publication Date
JPS5776849A true JPS5776849A (en) 1982-05-14

Family

ID=15557267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55153202A Pending JPS5776849A (en) 1980-10-31 1980-10-31 Bonding device for semiconductor pellel

Country Status (1)

Country Link
JP (1) JPS5776849A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6184843A (ja) * 1984-10-02 1986-04-30 Matsushita Electric Ind Co Ltd ダイボンデイング装置
JPS61112336A (ja) * 1984-11-07 1986-05-30 Nec Corp ダイボンダ−
JP2002214289A (ja) * 2001-01-17 2002-07-31 Nec Machinery Corp リードレス半導体素子のピックアップ装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6184843A (ja) * 1984-10-02 1986-04-30 Matsushita Electric Ind Co Ltd ダイボンデイング装置
JPS61112336A (ja) * 1984-11-07 1986-05-30 Nec Corp ダイボンダ−
JP2002214289A (ja) * 2001-01-17 2002-07-31 Nec Machinery Corp リードレス半導体素子のピックアップ装置

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