JPS5776866A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5776866A JPS5776866A JP55153135A JP15313580A JPS5776866A JP S5776866 A JPS5776866 A JP S5776866A JP 55153135 A JP55153135 A JP 55153135A JP 15313580 A JP15313580 A JP 15313580A JP S5776866 A JPS5776866 A JP S5776866A
- Authority
- JP
- Japan
- Prior art keywords
- film
- sio2
- manufacture
- semiconductor device
- degeneration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
- H10P14/662—Laminate layers, e.g. stacks of alternating high-k metal oxides
Landscapes
- Local Oxidation Of Silicon (AREA)
- Bipolar Transistors (AREA)
- Formation Of Insulating Films (AREA)
Abstract
PURPOSE:To prevent the degeneration of the surface of a silicon nitride film in the heat treatment at a high temperature of a semiconductor substrate by forming a SiO2 film on the surface of the silicon nitride film shaped onto the semiconductor substrate. CONSTITUTION:The SiO2 film 6 is formed on the surface of the Si3N4 film 3 selectively shaped onto the Si substrate 1 through a SiO2 layer 2 and oxidized, and plasma-etched. Accordingly, the degeneration of the surface of the Si3N4 film 3 resulting from the heat treatment at the high temperature can be prevented.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55153135A JPS5776866A (en) | 1980-10-31 | 1980-10-31 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55153135A JPS5776866A (en) | 1980-10-31 | 1980-10-31 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5776866A true JPS5776866A (en) | 1982-05-14 |
Family
ID=15555759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55153135A Pending JPS5776866A (en) | 1980-10-31 | 1980-10-31 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5776866A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5424253A (en) * | 1992-03-09 | 1995-06-13 | Oki Electric Industry Co., Ltd. | Method for manufacturing an inter-layer insulating film |
-
1980
- 1980-10-31 JP JP55153135A patent/JPS5776866A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5424253A (en) * | 1992-03-09 | 1995-06-13 | Oki Electric Industry Co., Ltd. | Method for manufacturing an inter-layer insulating film |
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