JPS5779630A - Assembling of semiconductor device - Google Patents

Assembling of semiconductor device

Info

Publication number
JPS5779630A
JPS5779630A JP55155342A JP15534280A JPS5779630A JP S5779630 A JPS5779630 A JP S5779630A JP 55155342 A JP55155342 A JP 55155342A JP 15534280 A JP15534280 A JP 15534280A JP S5779630 A JPS5779630 A JP S5779630A
Authority
JP
Japan
Prior art keywords
capillary tube
semiconductor element
bonding
solder
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55155342A
Other languages
Japanese (ja)
Other versions
JPS6122462B2 (en
Inventor
Kazuo Yamanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP55155342A priority Critical patent/JPS5779630A/en
Publication of JPS5779630A publication Critical patent/JPS5779630A/en
Publication of JPS6122462B2 publication Critical patent/JPS6122462B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To enable to perform heat-compression bonding of a bonding wire and a semiconductor element without affecting to solder fixing the semiconductor element and using small electric power by a method wherein a heating means is provided on the outside circumference of a capillary tube. CONSTITUTION:A lead frame 5 and the semiconductor element 3 on a processing base 8 are fixed with solder 4, and when a bonding wire 2 is to be connected to an electrode of the element using the capillary tube 11, a nichrome wire 7 is wound around the outside circumference of the capillary tube 11, the nichrome wire is heated when a gold ball 2a is to be adhered to the electrode on the surface of the semiconductor element 3 by thermo compression bonding drawing down the capillary tube 11, and the gold ball 2a is heated and heat compression bonding is performed. Accordingly heat is not transmitted to the lead frame or solder, and bonding can be performed with smaller electric power as compared with a heater block.
JP55155342A 1980-11-05 1980-11-05 Assembling of semiconductor device Granted JPS5779630A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55155342A JPS5779630A (en) 1980-11-05 1980-11-05 Assembling of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55155342A JPS5779630A (en) 1980-11-05 1980-11-05 Assembling of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5779630A true JPS5779630A (en) 1982-05-18
JPS6122462B2 JPS6122462B2 (en) 1986-05-31

Family

ID=15603789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55155342A Granted JPS5779630A (en) 1980-11-05 1980-11-05 Assembling of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5779630A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0334764U (en) * 1989-08-10 1991-04-04

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51430A (en) * 1974-06-22 1976-01-06 Goro Nishizawa SHITSUNAI GORUFUJUGIHO

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51430A (en) * 1974-06-22 1976-01-06 Goro Nishizawa SHITSUNAI GORUFUJUGIHO

Also Published As

Publication number Publication date
JPS6122462B2 (en) 1986-05-31

Similar Documents

Publication Publication Date Title
IT1167292B (en) HEATING DEVICE AND PROCEDURE FOR ITS MANUFACTURE
JPS5779630A (en) Assembling of semiconductor device
JPS5723849A (en) Gas detector and its manufacture
JPS574130A (en) Adhesion of semiconductor element
JPS51144182A (en) Indirectly heated semiconductor unit
JPS5565443A (en) Manufacture of semiconductor device
JPS55138246A (en) Manufacture of semicondoctor device
JPS57192908A (en) Fixing method for soldering
JPS54129880A (en) Manufacture for semiconductor device
JPS54107257A (en) Semiconductor device mounting method
JPS57139933A (en) Assembling apparatus for semiconductor device
JPS54119876A (en) Manufacture for semiconductor device
JPS5629350A (en) Assebling of semiconductor device
ATE33085T1 (en) THERMAL LIMITING DEVICE.
JPS5731147A (en) Method and apparatus for aging of semiconductor device
JPS5635451A (en) Semiconductor device
JPS5750440A (en) Bonding device for inner lead
JPS6454742A (en) Bonding method and device
JPS5731148A (en) Manufacture of semiconductor device
SU125837A1 (en) Method of soldering electrode leads to indium electrodes
JPS57192040A (en) Wire bonding method for semiconductor device
JPS642340A (en) Semiconductor device
JPS5486276A (en) Resin mold type semiconductor device
JPS5745937A (en) Manufacture of semiconductor device
JPS5624940A (en) Die bonding apparatus