JPS5745937A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5745937A
JPS5745937A JP55121517A JP12151780A JPS5745937A JP S5745937 A JPS5745937 A JP S5745937A JP 55121517 A JP55121517 A JP 55121517A JP 12151780 A JP12151780 A JP 12151780A JP S5745937 A JPS5745937 A JP S5745937A
Authority
JP
Japan
Prior art keywords
lead
solder
wire
pellet
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55121517A
Other languages
Japanese (ja)
Inventor
Muramasu Oomori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP55121517A priority Critical patent/JPS5745937A/en
Publication of JPS5745937A publication Critical patent/JPS5745937A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/041—Connecting or disconnecting interconnections to or from leadframes, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To connect a wire to a lead frame at a suitable temperature without losing the characteristic variation of a semiconductor device and the wettability of a solder by mounting a pellet with an alloy solder of lead-tin to the lead frame plated with lead and then thermally pressing the wire thereto. CONSTITUTION:A lead frame plated with lead is heated in non-acidic atmosphere of 340-360 deg.C, a lead-tin alloy solder is placed on a mounting part, and a pellet is placed thereon immediately thereafter. The lead-tin alloy solder and the lead plating on the lead frame are completely molten by excessive heat during several seconds to increase the ratio of lead in the solder and to thus raise the melting poit of the solder. It is then heated to 280-320 deg.C, and a gold wire is thermally pressed. With this configuration, the pellet can be mounted at a low temperature, and yet the wire can be connected without losing the characteristic variation of the device and the wettability of the solder at the suitable temperature.
JP55121517A 1980-09-02 1980-09-02 Manufacture of semiconductor device Pending JPS5745937A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55121517A JPS5745937A (en) 1980-09-02 1980-09-02 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55121517A JPS5745937A (en) 1980-09-02 1980-09-02 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5745937A true JPS5745937A (en) 1982-03-16

Family

ID=14813165

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55121517A Pending JPS5745937A (en) 1980-09-02 1980-09-02 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5745937A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03242470A (en) * 1989-10-03 1991-10-29 Trw Inc Liquid operated device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03242470A (en) * 1989-10-03 1991-10-29 Trw Inc Liquid operated device

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