JPS5779655A - Manufacture of integrated circuit chip - Google Patents
Manufacture of integrated circuit chipInfo
- Publication number
- JPS5779655A JPS5779655A JP15543580A JP15543580A JPS5779655A JP S5779655 A JPS5779655 A JP S5779655A JP 15543580 A JP15543580 A JP 15543580A JP 15543580 A JP15543580 A JP 15543580A JP S5779655 A JPS5779655 A JP S5779655A
- Authority
- JP
- Japan
- Prior art keywords
- manufacture
- mask
- integrated circuit
- circuit chip
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Dicing (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15543580A JPS5779655A (en) | 1980-11-05 | 1980-11-05 | Manufacture of integrated circuit chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15543580A JPS5779655A (en) | 1980-11-05 | 1980-11-05 | Manufacture of integrated circuit chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5779655A true JPS5779655A (en) | 1982-05-18 |
Family
ID=15605957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15543580A Pending JPS5779655A (en) | 1980-11-05 | 1980-11-05 | Manufacture of integrated circuit chip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5779655A (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58207653A (ja) * | 1982-05-28 | 1983-12-03 | Toshiba Corp | 半導体集積回路用マスタ・ウェ−ハ |
| JPS593950A (ja) * | 1982-06-30 | 1984-01-10 | Fujitsu Ltd | ゲ−トアレイチツプ |
| JPH03136368A (ja) * | 1989-10-23 | 1991-06-11 | Nec Corp | 半導体集積回路におけるマスタスライス方式 |
| US5138419A (en) * | 1988-06-01 | 1992-08-11 | Fujitsu Limited | Wafer scale integration device with dummy chips and relay pads |
-
1980
- 1980-11-05 JP JP15543580A patent/JPS5779655A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58207653A (ja) * | 1982-05-28 | 1983-12-03 | Toshiba Corp | 半導体集積回路用マスタ・ウェ−ハ |
| JPS593950A (ja) * | 1982-06-30 | 1984-01-10 | Fujitsu Ltd | ゲ−トアレイチツプ |
| US5138419A (en) * | 1988-06-01 | 1992-08-11 | Fujitsu Limited | Wafer scale integration device with dummy chips and relay pads |
| JPH03136368A (ja) * | 1989-10-23 | 1991-06-11 | Nec Corp | 半導体集積回路におけるマスタスライス方式 |
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