JPS58100492A - Automatic soldering device - Google Patents

Automatic soldering device

Info

Publication number
JPS58100492A
JPS58100492A JP19990481A JP19990481A JPS58100492A JP S58100492 A JPS58100492 A JP S58100492A JP 19990481 A JP19990481 A JP 19990481A JP 19990481 A JP19990481 A JP 19990481A JP S58100492 A JPS58100492 A JP S58100492A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
soldering
rod
automatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19990481A
Other languages
Japanese (ja)
Other versions
JPH0234710B2 (en
Inventor
中川 久雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koki Co Ltd
Kouki KK
Original Assignee
Koki Co Ltd
Kouki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koki Co Ltd, Kouki KK filed Critical Koki Co Ltd
Priority to JP19990481A priority Critical patent/JPH0234710B2/en
Publication of JPS58100492A publication Critical patent/JPS58100492A/en
Publication of JPH0234710B2 publication Critical patent/JPH0234710B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は、半田付装置におけるプリント基板の自動そり
防止機構に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an automatic warping prevention mechanism for a printed circuit board in a soldering apparatus.

プリント基板の自動半田付装置としては、各装置′の゛
左右@に配設した主搬送体間K、この主搬送体に設けた
支持部材にてプリント基板の左右縁を挾持しつ\半田付
けに必要な各種の処理工程を行わせる装置と、プリント
基板をキャリヤにとりつけ、このキャリヤの搬送によっ
て半田付けを完了する装置の一機種に大別できる。
As an automatic soldering device for printed circuit boards, there is a main conveyor K installed on the left and right sides of each device, and a supporting member provided on the main conveyor holds the left and right edges of the printed circuit board while soldering. There are two types of equipment: equipment that performs various processing steps necessary for soldering, and equipment that attaches a printed circuit board to a carrier and completes soldering by transporting the carrier.

後者の装置は、キャリヤ自体にプリント基板のそり防止
機構をほどこすことにより、比較的広い面積をもつプリ
ント基板の半田付けに4使用されるが、この基板をキャ
リヤにセットし、かつ、その防止機構をプリント基板の
前稜端中央部に係合させる作業に煩雑性があシ、作業効
率上思わしくない。
The latter device is used for soldering printed circuit boards with a relatively large area by applying a mechanism to prevent warpage of the printed circuit board to the carrier itself. The work of engaging the mechanism with the central part of the front edge of the printed circuit board is complicated and unsatisfactory in terms of work efficiency.

また前者は、キャリヤを使用せず、直接プリント基板を
保持せしめるので1作業効率は比較的よいが4プリント
基板のそり防止機構がないために、プリヒータによる加
熱や、半田付時点の加熱及び基板に付されている電気部
品の重みなどによシそシが生じた場合曳好な半田付けが
困難となるだけでなく、装置からプリント基板が脱落す
る等の支障があるため、そりのきわめて少い小面積のも
のしか使用し得ないなど夫々欠点がみられた。
In addition, the former does not use a carrier and directly holds the printed circuit board, so 1. The work efficiency is relatively good, but 4. There is no mechanism to prevent warping of the printed circuit board, so heating with a preheater, heating at the time of soldering, and If warping occurs due to the weight of the electrical components attached, it will not only be difficult to solder properly, but also cause problems such as the printed circuit board falling off the device, so it is important to minimize warping. Each had drawbacks, such as the fact that they could only be used in small areas.

本発明は、キャリヤを用いない前者の半田付装置に自動
そシ防止(修正)Il構を設け、広面積のプリント基板
の半田付けを可能となし、作業効率の計れる装置を提供
せんとするものである。
The present invention provides an automatic warp prevention (correction) mechanism for the former type of soldering device that does not use a carrier, thereby making it possible to solder a wide area of printed circuit boards, and providing a device that can measure work efficiency. It is.

図面について本発明の一実施例を説明すると、矛1図は
一般に知られている自動半田付装置を示し、(1)はフ
ラックス塗布槽、(2)は蚊7ラツクスの有機物を放散
させるためのプリヒータ、(3)は予備半田槽、(4)
はリード線カッタ、(5)はフラックス塗布槽、(6)
はプリヒータ、(7)は本半田榴、(8)はプリント基
iである。aυ及びaっは本発明に係るブリット基板(
8)の自動そシ防止機構で、(//す# (/、/A)
# (/ハ)(/Jりのコ個1組のそシ防止体によって
構成されている。
To explain one embodiment of the present invention with reference to the drawings, Figure 1 shows a generally known automatic soldering device, in which (1) is a flux application tank, and (2) is a tank for dispersing organic matter from insects. Preheater, (3) is preliminary solder bath, (4)
is a lead wire cutter, (5) is a flux coating tank, (6) is
is a preheater, (7) is a solder plate, and (8) is a printed board i. aυ and a are the bullet substrates according to the present invention (
8) automatic anti-slip mechanism, (//S# (/, /A)
# (/c)(/J) Consists of a set of anti-slip bodies.

次にこのそシ防止機構0υ、aりの詳細を矛コ〜参図に
ついて説明する。
Next, the details of this anti-slip mechanism 0υ and a will be explained with reference to the figures.

そシ防止体(//a)、 (//A)、 (/Jす、 
(/JA) d殆ントPI−の構造であるので、(//
りを代表としてその構成を説明するが、その前に主搬送
体について説明すると、αりは上述した(1)〜())
の部材からなる自動半田付装置の両@に、夫々各別に配
設した水平方向に循回す−る主搬送体で、矛1図におい
てはその片側のみを示し、他側のもカは図示省略しであ
る。
Anti-slip body (//a), (//A), (/Jsu,
(/JA) Since it has the structure of almost all PI-, (//
I will explain the structure of the α-ri as a representative, but before that, I will explain the main conveyance body.
The main transport body that circulates in the horizontal direction is installed separately on both sides of an automatic soldering device consisting of the following members; only one side of it is shown in Figure 1, and the other side is omitted. It is.

この主搬送体Q7Jのチェーンブロックに夫々filの
支持杆0の上辺が多数とシっけてあシ、この各支持杆α
3の下辺内側端には、基板(8)の両級部を挟着する鼓
形をした把持部材a尋がとシっけである。
The chain block of this main carrier Q7J has a large number of upper sides of support rods 0 of each fil, and each support rod α
At the inner end of the lower side of the board (8), there is a drum-shaped gripping member (a) for clamping both sides of the board (8).

この支持杆0を備えた主搬送体Q3は既に一般に使用さ
れているので詳細な説明は省略する。そしてこの主搬送
体αりの各チェーンブロックの連結軸Q!9を上方に延
長し、この延長された各連結軸α9には、連結板顛が回
少止め構造をもって、上下動可能罠遊嵌されている。
Since the main carrier Q3 equipped with this support rod 0 is already in general use, a detailed explanation will be omitted. And the connecting shaft Q of each chain block of this main transport body α! 9 is extended upward, and a connecting plate is loosely fitted into each of the extended connecting shafts α9 so as to be vertically movable with a rotation stopper structure.

次にそシ防止体(//a)について説明すると、このも
のは以下述べるように構成されている。
Next, the anti-slip body (//a) will be explained. This body is constructed as described below.

aηは水平が保たれた合板であって、該台板αηは半田
−付装置に、上記主搬送体α2の搬送方向と平行に軸架
された案内行側に係合され、これにそって一定のスト四
−り、即ち、半田槽(3)、 (7)の上手側から下手
側に至る間、往復移動しうるように案内されている。
aη is a plywood board kept horizontal, and the base plate αη is engaged with the soldering device on the guide side which is mounted on a shaft parallel to the conveyance direction of the main conveyance body α2, and the base plate αη is It is guided so that it can reciprocate over a certain distance, that is, from the upper side to the lower side of the solder baths (3) and (7).

この合板aηの内側端下側及び外側端下@には夫夫励磁
マグネット物、(イ)が設けてあシ、一方のマグネット
a!Jが励磁されたときには、これに上記連結板翰は吸
着され、台板αη、詳しくは、そり防止体(//り全体
が主搬送体a′JJと一諸に移動され、また他方の!グ
ネット■が励磁されたときKは、上下方向に常に循回し
ているそalPF正体の復帰用搬送体Qυがとのマグネ
ツ)(2Gに吸着され、そり防止体(//りが旧復する
ように構成されている。夫々も のマグネットαし■は電気回路によシ瞬時に切換えられ
るように−1にっている。
At the bottom of the inner end and the bottom of the outer end of this plywood aη, excitation magnets (A) are provided, and one magnet a! When J is excited, the connecting plate is attracted to it, and the base plate αη, more specifically, the warpage prevention body (//) is moved together with the main conveyor a′JJ, and the other! When the magnet ■ is excited, K is attracted to the magnet (2G) and the warpage prevention body (// is restored). The magnets α and ■ of each magnet are set to -1 so that they can be instantly switched by an electric circuit.

上記台板aη上には、溝付きの案内体(イ)が垂設して
あり、この案内体(転)K・昇降体(ハ)が上下動可能
にとシつけられている。そしてこの昇降体(ハ)の外側
に水平に突設した連杆(財)の端部に、上昇及び下降速
度調整器(至)、@を備えたシリンダ■が連結せしめら
れ、このシリンダーの昇降作用によシ上記昇降体(2)
が案内体(2)をガイドとして所定のストローク上下動
されるようにしである。
A grooved guide body (A) is vertically disposed on the base plate aη, and the guide body (roller) K and elevating body (C) are attached so as to be movable up and down. A cylinder ■ equipped with an ascent and descent speed regulator (to) and an @ is connected to the end of a connecting rod that protrudes horizontally on the outside of this elevating body (c), and the elevating and lowering of this cylinder Due to the action, the above-mentioned elevating body (2)
is moved up and down by a predetermined stroke using the guide body (2) as a guide.

ti上記昇降体(ハ)の内@には、水平の伸縮杆(ハ)
が設けてあり、これの先端部上fallに、上昇及び下
降速度調整器(−ツリ、(コtb)を備えたシリンダ翰
が垂設され、また先端部下側に、筒体(至)が上記シ1
リンダ(至)と同軸上Km設されている。
tiInside the elevating body (c) above, there is a horizontal telescoping rod (c).
is provided, and a cylinder holder equipped with an ascending and descending speed regulator (-tb) is installed vertically above the tip, and a cylindrical body (to) is installed below the tip. Si1
It is located Km coaxially with the cylinder.

この筒体(至)は矛ダ図から明らかなように、下端に扇
形の係合爪r31)を備えたiラド(至)の上部が回動
自在にとりつ叶られており、またとのpラド曽の上部に
設けた孔(至)には、上記シリンダ翰のロッド(ロ)端
が回動可能に挿嵌されている。そしてこのロッド(ロ)
の端部にはビン(至)が設けてあって、このビン(至)
が、上記ロッド(至)の孔(至)の半周に設けた螺旋状
溝C119に嵌合せしめられ、かつ、シリンダ(2)の
ロッド(ロ)は上記筒体(至)K対してキー溝構造によ
り回り止め構造となっていることから、ロッド(至)の
上下動によシ、ビン(至)、螺旋溝(至)の関連構造か
ら、係合爪GDを備えたロッド■は/1グ往後回動する
ように構成されている。
As is clear from the figure, this cylinder has a rotatable upper part with a fan-shaped engagement claw r31) at the lower end, and also has a rotatable upper part. The rod (b) end of the cylinder rod is rotatably inserted into the hole (b) provided in the upper part of the rad. And this rod (b)
A bottle (to) is provided at the end of the
is fitted into a spiral groove C119 provided on the half circumference of the hole (to) of the rod (to), and the rod (B) of the cylinder (2) is fitted into a keyway with respect to the cylinder body (to) K. Since the structure prevents rotation, the vertical movement of the rod (to) is prevented. Due to the related structure of the bottle (to) and the spiral groove (to), the rod with the engaging pawl GD is /1 It is configured to rotate back and forth.

各そシ防止体(//す、 (tth)、 (/Jす、(
lコリは上述のように構成されているが、次に矛5図に
ついて(//す、 (tth) Kよシその作用を説明
すると、(//@)と(11b)は、半円槽の上手側で
は図のような関係位置にある。
Each break prevention body (//su, (tth), (/Jsu, (
The l-cori is constructed as described above, but next, to explain its function in Figure 5 (//su, (tth) K), (//@) and (11b) are semicircular tanks. On the upper side, they are in the relative position as shown in the figure.

そしてプリント基板(8)が矢印方向より進入し、上下
に配設した光電管装置(ロ)の光軸を、プリント基IN
 (8)先端−が連断され、かつ、予め電気的すなわち
シフトレジスト回路により設定された距離−だけプリン
ト基板(8)が進むと、そシ防止体(//a)のマグネ
ット0が励磁され、主搬送体a3の連結板(leがこの
マグネッ)09Klj着され、そり防止体(//りが主
搬送体a2と共に進行する。そしてたyちK (/ /
 a )のシリンダ(ハ)めロッド(ロ)が下降して、
このロッド(至)に設は九ビン缶、町ツド(2)の螺旋
状溝(至)の作用でロッド(2)を/If(ロ)転させ
なからロッド0)を一定のストローク(鴇・・・約10
m)だけ上昇して係合爪6υをプリント基板(8)の下
面に画線せしめ、プリヒータの加熱及び付設せる電気部
品の重みによるそりを修正する。
Then, the printed circuit board (8) enters in the direction of the arrow, and the optical axis of the phototube device (b) arranged above and below is aligned with the printed circuit board IN.
(8) When the tip end is disconnected and the printed circuit board (8) advances by a distance preset by the electric, ie, shift register circuit, the magnet 0 of the anti-slip body (//a) is excited. , the connecting plate (LE is this magnet) of the main transport body a3 is attached, and the warpage prevention body (// is moved along with the main transport body a2.
The cylinder (c) and rod (b) of a) are lowered,
This rod (to) is set in a 9-bin can, and the action of the spiral groove (to) of the machitsudo (2) causes the rod (2) to rotate /If (b), so that the rod (0) is moved at a constant stroke (to). ...about 10
m) to place the engaging claw 6υ on the lower surface of the printed circuit board (8), thereby correcting the warping caused by the heating of the preheater and the weight of the attached electrical parts.

そして、プリント基板(8)の後端すが上記光電管装置
の光軸を通過し、この光軸が導通し、更に予め電気的す
なわちシフトレジスト回路により設定された距離−だけ
プリント基板(8)が進行すると、そシ防止体(//り
の一方のマグネット0が励磁され、上記と同様にこのそ
シ防止体(tiりが主搬送体αりと結合され、移動を開
始すると同時に、シリンダーの作用で(/lわが4のス
トa−りだけ下降し、次いで別のシリンダ翰の作用でロ
ッド(2)をltグ回転させながら鴇だけ上昇し、プリ
ント基板(8)?後端部下側に接触しそりの修正を行う
Then, the rear end of the printed circuit board (8) passes through the optical axis of the phototube device, this optical axis is electrically connected, and the printed circuit board (8) is further moved by a distance set in advance by the electrical or shift resist circuit. As it moves forward, the magnet 0 on one side of the anti-slip body (//) is excited, and in the same way as above, this anti-slip body (ti) is connected to the main carrier α, and at the same time as it starts moving, the cylinder Then, by the action of another cylinder, the rod (2) is rotated and moved up by a distance, and the printed circuit board (8) is moved to the lower side of the rear end. Correct contact warping.

このように、プリント基板(8)の先、後端中央部を係
合爪−にて支持した状態で予備または本半田付作業が行
われ完了すると、(//す、 (11りのロッドC33
がシリンダ翰の作用で同時に為だけ下降しながら螺旋状
溝(至)の作用で同時ycitグ回転して、係合爪o1
)をプリント基板(8)のシルエット範囲外に逃避せし
める。
In this way, when the preliminary or main soldering work is completed with the front and rear center parts of the printed circuit board (8) supported by the engaging claws, (//s, (11 rods C33
is lowered at the same time by the action of the cylinder rod, and simultaneously rotates by the action of the spiral groove (end), and the engaging pawl o1
) to escape outside the silhouette range of the printed circuit board (8).

゛ 次いで他方のシリンダ(5)の作用で(//a)と
(//A)を同時に鳥の距離だけ上昇させ上昇端で―上
記マグネツ)(19の励磁が解かれ、、 (//α)と
(//りは主搬送体a2と絶縁される。この絶縁後側の
マグネット(イ)がマグネットalの絶縁と同時に切換
励磁され、(//a)と(llりは同時に復帰用搬送体
(2υに連結せしめられ、もとの位置、詳しくは、半田
槽(3)、 (7)−の上手ll1tで戻されるととK
なる。
゛ Next, by the action of the other cylinder (5), (//a) and (//A) are simultaneously raised by the distance of the bird, and at the rising end - the magnet (19) is de-energized, (//α ) and (// are insulated from the main transport body a2. The magnet (a) on the side after this insulation is switched and excited at the same time as the magnet al is insulated, and (//a) and (ll are simultaneously insulated from the main transport body a2. body (2υ) and returned to its original position, specifically, at the top of the solder tank (3) and (7).
Become.

即ち、一方のそシ防止体(11b)が定位置に到達する
と、これのマグネット■の励磁が解かれ、(llb)は
そのt〜の姿勢で停止する。つまり15図の状態である
。他方の七妙防止体(//a)は更に復帰を続け、15
図の−の位置で!グネット■の励磁が解かれて停止する
と\もに、シリンダ罰の作用で鳥のストロークだけ降下
した位置で停止し、次の作業態勢をとるものである。
That is, when one of the deflection prevention bodies (11b) reaches the home position, the magnet (1) of this body is de-energized, and (11b) stops at its position t~. In other words, it is the state shown in Figure 15. The other Seven Mysterious Prevention Body (//a) continued to return, and reached 15
At the - position in the diagram! As soon as the magnet (2) is de-energized and stops, it stops at a position where it has descended by the stroke of the bird due to the effect of cylinder punishment, and is ready for the next work.

以下同様の作用で自動連続的にプリント基板のそυ修正
及び防止を行うものである。尚−はプリント、基板(8
)の長さと略同長に設定されるものである。またそシ防
止体(lコミλ(lコリも上記と全く同じ作用を行うも
のであるので、その説明は省略するし、−1X4の距離
は、この距離を超える長さのプリント基板の場合はプリ
ント基板の長aよシ長く位置するよう変更される。また
−一14 = /−Jm程度で、プリント基板(8)の
先端が(//a)、 (/Jりのロッド03KIi央す
るのを防止するものである。
Thereafter, similar actions are used to automatically and continuously correct and prevent distortion of the printed circuit board. In addition, - is printed, board (8
) is set to be approximately the same length as the In addition, the warpage prevention body (l stiffness λ (l stiffness) has exactly the same effect as above, so its explanation will be omitted. The position is changed so that it is longer than the length a of the printed circuit board. Also, at about -14 = /-Jm, the tip of the printed circuit board (8) is in the center of the rod 03KIi of (//a) and (/J). This is to prevent

このように本発明によれば、簡単な構成により、プリヒ
ータによる加熱及び電気部品の重みによる千妙を修正し
た状態で半田付けを行わせ、更に半田槽の加熱によるそ
シを強制的に防止しながらプリント基板の自動連続半田
付作業がなし得られ、従来小面積のプリント基板しか用
いられなかったキャリヤを使用しない半田付装置におい
て大形基板を半田付けする際に用いることにより良好な
半田付を行うことができ、効率のよい作業がなしうるな
ど優れた特長を有するものである。
As described above, according to the present invention, with a simple configuration, soldering is performed while correcting the distortion caused by the heating by the preheater and the weight of the electrical components, and furthermore, the distortion caused by heating the solder tank is forcibly prevented. However, automatic continuous soldering of printed circuit boards can be performed, and good soldering can be achieved by using a soldering device that does not use a carrier, which previously only used small-area printed circuit boards, when soldering large boards. It has excellent features such as being able to perform tasks efficiently and efficiently.

【図面の簡単な説明】[Brief explanation of the drawing]

矛1図は装置全体を示す配置説明図、11回は本発明装
置の要部であるそシ防止体の正面図、13図は同上平面
図、矛ダ図は係合爪の回転機構部を示す一部切欠正面図
、矛S図は動作説明図である。
Figure 1 is a layout explanatory diagram showing the entire device, Figure 11 is a front view of the anti-slip body which is the main part of the device of the present invention, Figure 13 is a plan view of the same, and Figure 1 is a diagram showing the rotation mechanism of the engaging claw. The partially cutaway front view and S figure shown are operation explanatory views.

Claims (1)

【特許請求の範囲】[Claims] プリント基板の保持搬送用キャリヤを使用しない自動半
田付装置に於いて、基板のそり防止を必要とする半田付
工程又はリード線端子切断工“程に於いて、プリント基
板の搬送体によって随伴して往行し、別の搬送体にて復
行旧復せしめられ、配設された任意の大きさのプリント
基板と任意の搬送速度に対応し得る自動そり防止機構を
設けたことを4?像とする自動半田付装置。
In automatic soldering equipment that does not use a carrier for holding and transporting printed circuit boards, during the soldering process or lead wire terminal cutting process that requires prevention of board warpage, The fourth feature is that it is equipped with an automatic warpage prevention mechanism that can be moved forward and back using another conveyor, and that can accommodate any size printed circuit board and any conveyance speed. automatic soldering equipment.
JP19990481A 1981-12-10 1981-12-10 JIDOHANDAZUKESOCHI Expired - Lifetime JPH0234710B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19990481A JPH0234710B2 (en) 1981-12-10 1981-12-10 JIDOHANDAZUKESOCHI

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19990481A JPH0234710B2 (en) 1981-12-10 1981-12-10 JIDOHANDAZUKESOCHI

Publications (2)

Publication Number Publication Date
JPS58100492A true JPS58100492A (en) 1983-06-15
JPH0234710B2 JPH0234710B2 (en) 1990-08-06

Family

ID=16415529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19990481A Expired - Lifetime JPH0234710B2 (en) 1981-12-10 1981-12-10 JIDOHANDAZUKESOCHI

Country Status (1)

Country Link
JP (1) JPH0234710B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6027188A (en) * 1983-07-23 1985-02-12 近藤 権士 Device for preventing warpage of printed board in carrierless soldering equipment
JPS63256266A (en) * 1987-04-10 1988-10-24 Fuji Electric Co Ltd Device for preventing warpage of printed circuit board for jet type soldering device
JPH02148773U (en) * 1989-05-22 1990-12-18
JPH05226827A (en) * 1991-05-24 1993-09-03 Kenji Kondo Device for preventing warpage of printed board in carrier-less soldering apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6027188A (en) * 1983-07-23 1985-02-12 近藤 権士 Device for preventing warpage of printed board in carrierless soldering equipment
JPS63256266A (en) * 1987-04-10 1988-10-24 Fuji Electric Co Ltd Device for preventing warpage of printed circuit board for jet type soldering device
JPH02148773U (en) * 1989-05-22 1990-12-18
JPH05226827A (en) * 1991-05-24 1993-09-03 Kenji Kondo Device for preventing warpage of printed board in carrier-less soldering apparatus

Also Published As

Publication number Publication date
JPH0234710B2 (en) 1990-08-06

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