JPS58103151U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS58103151U JPS58103151U JP19496681U JP19496681U JPS58103151U JP S58103151 U JPS58103151 U JP S58103151U JP 19496681 U JP19496681 U JP 19496681U JP 19496681 U JP19496681 U JP 19496681U JP S58103151 U JPS58103151 U JP S58103151U
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- semiconductor equipment
- semiconductor
- narrow groove
- length direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来例のＵＨＦ用の可変容量ダイオードの斜視
図、第２図は本考案の第１の実施例の装置の外部リード
の斜視図、第３図はその断面図、第４図は本考案の第２
の実施例の装置の外部リードの斜視図、第５図はその断
面図、第６図は本考案の第３の実施例の装置の外部リー
ドの断面図である。
図において、１・・・・・・樹脂封入部分、２．２′・
・−・・・外部リード（２はカソード、２′はアノード
）、１０・・・・・・（本考案の実施例の装置の）外部
リード、１１・・・・・・細孔、１２・・・・・・リー
ドの先端面、１３・・・・・・リードの封入面、１４．
１４’・・・・・・細溝。Fig. 1 is a perspective view of a conventional UHF variable capacitance diode, Fig. 2 is a perspective view of an external lead of the device according to the first embodiment of the present invention, Fig. 3 is a cross-sectional view thereof, and Fig. 4 is a perspective view of a conventional variable capacitance diode for UHF. The second part of this invention
5 is a sectional view thereof, and FIG. 6 is a sectional view of an external lead of a device according to a third embodiment of the present invention. In the figure, 1...Resin sealed part, 2.2'...
... External lead (2 is a cathode, 2' is an anode), 10... External lead (of the device of the embodiment of the present invention), 11... Pore, 12. . . . Lead end surface, 13 . . . Lead enclosing surface, 14.
14'...Narrow groove.
Claims (1)
において、前記外部リードに細溝あるいは幅が前記外部
リードの厚さよりも小さい細孔を前記外部リードの長さ
方向に少くとも一個以上設けたことを特徴とする半導体
装置。In a semiconductor device in which an external lead is led out from a semiconductor element enclosing part, the external lead is provided with at least one narrow groove or a pore whose width is smaller than the thickness of the external lead in the length direction of the external lead. Characteristic semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19496681U JPS58103151U (en) | 1981-12-29 | 1981-12-29 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19496681U JPS58103151U (en) | 1981-12-29 | 1981-12-29 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58103151U true JPS58103151U (en) | 1983-07-13 |
Family
ID=30108261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19496681U Pending JPS58103151U (en) | 1981-12-29 | 1981-12-29 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58103151U (en) |
-
1981
- 1981-12-29 JP JP19496681U patent/JPS58103151U/en active Pending
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