JPS581219A - 集積回路素子 - Google Patents

集積回路素子

Info

Publication number
JPS581219A
JPS581219A JP57081169A JP8116982A JPS581219A JP S581219 A JPS581219 A JP S581219A JP 57081169 A JP57081169 A JP 57081169A JP 8116982 A JP8116982 A JP 8116982A JP S581219 A JPS581219 A JP S581219A
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit element
terminals
film
upper casing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57081169A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0221657B2 (2
Inventor
Tadashi Tomino
冨野 忠
Masayuki Higuchi
樋口 正行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP57081169A priority Critical patent/JPS581219A/ja
Publication of JPS581219A publication Critical patent/JPS581219A/ja
Publication of JPH0221657B2 publication Critical patent/JPH0221657B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H05K3/326Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Calculators And Similar Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57081169A 1982-05-13 1982-05-13 集積回路素子 Granted JPS581219A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57081169A JPS581219A (ja) 1982-05-13 1982-05-13 集積回路素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57081169A JPS581219A (ja) 1982-05-13 1982-05-13 集積回路素子

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2925081A Division JPS57143898A (en) 1981-02-27 1981-02-27 Mounting structure for integrated circuit element

Publications (2)

Publication Number Publication Date
JPS581219A true JPS581219A (ja) 1983-01-06
JPH0221657B2 JPH0221657B2 (2) 1990-05-15

Family

ID=13738951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57081169A Granted JPS581219A (ja) 1982-05-13 1982-05-13 集積回路素子

Country Status (1)

Country Link
JP (1) JPS581219A (2)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5571553U (2) * 1978-11-09 1980-05-16

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5571553U (2) * 1978-11-09 1980-05-16

Also Published As

Publication number Publication date
JPH0221657B2 (2) 1990-05-15

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