JPS5812945U - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS5812945U
JPS5812945U JP1981107468U JP10746881U JPS5812945U JP S5812945 U JPS5812945 U JP S5812945U JP 1981107468 U JP1981107468 U JP 1981107468U JP 10746881 U JP10746881 U JP 10746881U JP S5812945 U JPS5812945 U JP S5812945U
Authority
JP
Japan
Prior art keywords
cam
wire bonding
motor
bonding equipment
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981107468U
Other languages
English (en)
Inventor
宏一 千葉
政義 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP1981107468U priority Critical patent/JPS5812945U/ja
Publication of JPS5812945U publication Critical patent/JPS5812945U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図はリードフレーム、半導体ペレットおよびワイヤ
の位置関係を示す側面図、第２図はワイヤボンデイン作
業の工程を示す説明図、第３図は従来のワイヤボンディ
ング装置を示す斜視図、第４図はこの考案の一実施例の
斜視図である。 １・・・キャピラリアーム、２・・・金線（ワイヤ）、
３・・・キャピラ、８・・・カム、１２・・・パルスジ
ェネレータ、１３・・−ＤＣモータ、１４・・・タコジ
ェネレータ、１７・・・タイミングベルト。

Claims (1)

    【実用新案登録請求の範囲】
  1. ＤＣモータと、このＤＣモータと同軸に設けられタコジ
    ェネレータと、上記ＤＣモータにより鋼線で補強された
    タイミングベルトを介して駆動されるカムと、このカム
    と同軸に設けられカムの回転角を計測するパルスジェネ
    レータと、上記カムの回転により揺動し、先端部にワイ
    ヤを保持するキャピラリを備えたキャピラリアームとか
    らなることを特徴とするワイヤボンディング装置。
JP1981107468U 1981-07-20 1981-07-20 ワイヤボンデイング装置 Pending JPS5812945U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981107468U JPS5812945U (ja) 1981-07-20 1981-07-20 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981107468U JPS5812945U (ja) 1981-07-20 1981-07-20 ワイヤボンデイング装置

Publications (1)

Publication Number Publication Date
JPS5812945U true JPS5812945U (ja) 1983-01-27

Family

ID=29901901

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981107468U Pending JPS5812945U (ja) 1981-07-20 1981-07-20 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS5812945U (ja)

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