JPS6112237U - ボンデイング装置 - Google Patents

ボンデイング装置

Info

Publication number
JPS6112237U
JPS6112237U JP1984097571U JP9757184U JPS6112237U JP S6112237 U JPS6112237 U JP S6112237U JP 1984097571 U JP1984097571 U JP 1984097571U JP 9757184 U JP9757184 U JP 9757184U JP S6112237 U JPS6112237 U JP S6112237U
Authority
JP
Japan
Prior art keywords
bonding equipment
bonding
horn
lead frame
conveyance path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984097571U
Other languages
English (en)
Other versions
JPH023629Y2 (ja
Inventor
哲司 南部
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP1984097571U priority Critical patent/JPS6112237U/ja
Publication of JPS6112237U publication Critical patent/JPS6112237U/ja
Application granted granted Critical
Publication of JPH023629Y2 publication Critical patent/JPH023629Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す平面図、第２図は本考
案のボンデイング動作を説明するためのり．−ドフレー
ム部分拡大平面図である。 。第３図および第４図は従来のボンデイング装置の平面
図及び側面図、第５図は第３図のボンデイング装置によ
るボンデイング動作を説明するためのリードフレーム部
分拡大平面図である。 １・・・・・・リードフレーム、２・・・・・・搬送路
、８・・・・・・ワイヤ、１４・・・・・・ボンデイン
グ装置、１７・・・・・・ホーン、１８・・・・・・キ
ャピラリ。

Claims (1)

    【実用新案登録請求の範囲】
  1. リードフレーム搬送路上に配置されたワイヤボンデイン
    グ用キャピラリにホーンを介して超音波振動を伝達する
    ボンデイング装置において、前記ホーンを前記搬送路上
    のリードフレーム送り方向と略４５’の角度をもって配
    置したことを特徴とするボンデイング装置。
JP1984097571U 1984-06-27 1984-06-27 ボンデイング装置 Granted JPS6112237U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984097571U JPS6112237U (ja) 1984-06-27 1984-06-27 ボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984097571U JPS6112237U (ja) 1984-06-27 1984-06-27 ボンデイング装置

Publications (2)

Publication Number Publication Date
JPS6112237U true JPS6112237U (ja) 1986-01-24
JPH023629Y2 JPH023629Y2 (ja) 1990-01-29

Family

ID=30657127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984097571U Granted JPS6112237U (ja) 1984-06-27 1984-06-27 ボンデイング装置

Country Status (1)

Country Link
JP (1) JPS6112237U (ja)

Also Published As

Publication number Publication date
JPH023629Y2 (ja) 1990-01-29

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