JPS58144877A - Duplicating method of hologram - Google Patents

Duplicating method of hologram

Info

Publication number
JPS58144877A
JPS58144877A JP2765282A JP2765282A JPS58144877A JP S58144877 A JPS58144877 A JP S58144877A JP 2765282 A JP2765282 A JP 2765282A JP 2765282 A JP2765282 A JP 2765282A JP S58144877 A JPS58144877 A JP S58144877A
Authority
JP
Japan
Prior art keywords
resin
matrix
holograms
thermoplastic resin
hologram
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2765282A
Other languages
Japanese (ja)
Inventor
Tetsuji Yamazaki
哲司 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP2765282A priority Critical patent/JPS58144877A/en
Publication of JPS58144877A publication Critical patent/JPS58144877A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0053—Moulding articles characterised by the shape of the surface, e.g. ribs, high polish
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C41/12—Spreading-out the material on a substrate, e.g. on the surface of a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0866—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using particle radiation
    • B29C2035/0877—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using particle radiation using electron radiation, e.g. beta-rays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/722—Decorative or ornamental articles
    • B29L2031/7224—Holograms
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
    • G03H1/0276—Replicating a master hologram without interference recording
    • G03H2001/0284—Replicating a master hologram without interference recording by moulding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Holo Graphy (AREA)

Abstract

PURPOSE:To duplicate holograms efficiently and inexpensively without the need for preparing many costly dies by manufacturing a matrix of a thermoplastic resin by the use of a die for a relief hologram, bringing a resin liquid layer which is curable with electron rays or the like into tight contact with the matrix and curing the resin liquid layer. CONSTITUTION:A die 1 for a relief hologram is used and a film, sheet or the like 2 of a thermoplastic resin such as a PVC resin is superposed thereon, and both are pressurized under heating with presses 3 and 3', whereby a matrix 4 is manufactured. Resin liquid 5 which is curable by irradiation of electron rays or UV rays such as a monomer, oligomer and prepolymer having unstatd. bonds, and mixtures of epoxy compds and Lewis acid, etc. is coated on the mold surface of the matrix 4, and electron rays, etc. (shown by arrows) 6 are irradiated thereto to cure the resin. Holograms are reproduced by using the matrix 4 in such a way, whereby the holograms are duplicated without the need for using many costly dies and in a short time.

Description

【発明の詳細な説明】 本発明は表面に微細な凹凸形状を賦与して情報を記録す
るレリーフホログラムの量産に適し九複製方法に関する
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a replication method suitable for mass production of relief holograms in which information is recorded by imparting fine irregularities to the surface.

ホログラムは、一般に光の干渉のパターンを記録したも
のであり、三次元（２）像の記録をはじめ、高密度な情
報記録が可能である特性を利用して光メモリー等多方面
への応用が期待されている。Holograms are generally records of light interference patterns, and their ability to record three-dimensional (2) images as well as high-density information recording allows them to be used in many fields such as optical memory. It is expected.

ホログラムの記録材料としては、高解像力の銀塩感光材
料が一般に用いられるが、この材料は高価であり、また
−撮影あるいは複製も困難であるため、ホログラム製品
は高価格となり、また現惰等の処理を必要とするため大
量生産には向がない欠点がある。High-resolution silver salt photosensitive materials are generally used as recording materials for holograms, but this material is expensive and difficult to photograph or reproduce, making hologram products expensive and It has the disadvantage that it is not suitable for mass production because it requires processing.

一方、レリーフホログラムの場合は、フォトレジスト等
にホログラム情報を凹凸のパターンで記録した後、この
凹凸パターンをメッキ等により型取りし、二の金型を熱
可塑性樹脂型呼型押しすることにより、簡単且つ大量に
複製が作れるということが知られている。On the other hand, in the case of a relief hologram, the hologram information is recorded in a pattern of concave and convex parts on a photoresist, etc., then this concave and convex pattern is molded by plating, etc., and the second mold is stamped with a thermoplastic resin mold. It is known that copies can be easily made in large quantities.

しかし、この方法では、熱可塑性樹脂を加熱し型押しし
た後、熱変型温度以下に冷却する必り≠工あるため、成
型に時間を景する欠点があった。したがって大量のホロ
グラムの製造を効率良く行うためには、同じ多数枚の金
型を用いれば良いが、かかる金型は１作製の工程熟煩雑
で高価格なものであり、したがって多数枚の金型を用い
てｆ＃造すると、製造効率が悪くホログラムの価格も非
、贋に高価格なものになるという問題があった。However, this method has the disadvantage that molding takes time because the thermoplastic resin must be heated and stamped and then cooled to below the thermal deformation temperature. Therefore, in order to efficiently manufacture a large amount of holograms, it is sufficient to use a large number of the same molds, but such molds are complicated and expensive in one production process, and therefore, a large number of molds are required. When F# was manufactured using holograms, there were problems in that the manufacturing efficiency was poor and the holograms were expensive.

本発明者はこの間軸に対し、レリーフホログ′うムの複
製屋として熱可塑性樹脂にレリーフホログラム金星を加
熱型押しして得た従来複製ホログラムとして使用したも
のを母型として使用し、この母型の型面に紫外線又は電
子線で硬化可能な樹脂液層を密着し紫外線又は電子線を
照射すること罠より樹脂液層を硬化させ賦型する方法を
用い、従来の欠点や問題点を解決するのく成功したもの
である。For this purpose, the present inventor, as a relief hologram replicator, used as a mother mold a conventional reproduction hologram obtained by heat-embossing a relief hologram Venus on thermoplastic resin, and used this mother mold. Solve the drawbacks and problems of the conventional method by applying a resin liquid layer that can be cured by ultraviolet rays or electron beams to the mold surface and then irradiating the resin liquid layer with ultraviolet rays or electron beams. It was extremely successful.

以下図面を用いて本発明の詳細な説明する。本発明に適
用可能なホログラムの種類としてはフレネルホログラム
、フーリエ変換ホログラム、フラウンホーファーホログ
ラム等のホログラムのいずれにも応用でき、これらホロ
グラムの形式を利用したイメージホログラム、レインボ
ーホログラム、ホログラフィ、クステレオグラム等、及
び一般の回折格子類に適用できる。The present invention will be described in detail below using the drawings. The types of holograms that can be applied to the present invention include Fresnel holograms, Fourier transform holograms, Fraunhofer holograms, etc., and image holograms, rainbow holograms, holography, crystal stereograms, etc. that utilize these hologram formats, etc. , and general diffraction gratings.

レリーフホログラムの凹凸形状を有する金型の作製方法
自体は公知であって、フレネルホログラムの場合につき
具体的に例示すると、感光体としてガラス基板上にフォ
トレジスト（例えばシプレー社製、ＡＺ−１３５０Ｊ　
）　　を厚み１５　μｍＬ　＆’Ｃ塗布し、アルゴンレ
ーザー光をビームスプリ、ター（八−フミラー）で分割
し九一方の光を被撮影体に当て・て反射した光（物体光
）を感光体上に導き、他方の光をそのまま、やはり感光
体上に導いて互いに干渉させて露光し、所定の現像液（
例えば前述のフォトレジストであれば同社製のＡＺデペ
ロ、パー）により現像し、更に銀を厚み４００Ｘ程度に
蒸着し、該蒸着膜を電極として二、ケルメッキを行なっ
て厚さ１１１１程度のメッキ層を形成し、得られたメッ
キ層を剥離して得るものである。The method of manufacturing a mold having an uneven shape for a relief hologram is known. To give a specific example in the case of a Fresnel hologram, a photoresist (for example, AZ-1350J manufactured by Shipley Co., Ltd., manufactured by Shipley) is used as a photoreceptor on a glass substrate.
) is applied to a thickness of 15 μmL &'C, the argon laser beam is divided by a beam splitter and a tar (eighth mirror), one beam is applied to the object to be photographed, and the reflected light (object beam) is sent to the photoreceptor. The other light is guided directly onto the photoreceptor and exposed by interfering with each other, and a predetermined developer (
For example, in the case of the above-mentioned photoresist, it is developed using the same company's AZ Depero, Par), and then silver is deposited to a thickness of about 400X, and the deposited film is used as an electrode for second Kel plating to form a plated layer of about 1111mm thick. It is obtained by forming a plating layer and peeling off the obtained plating layer.

次Ｋ、第１図に示すごとくこの金１１１を熱可塑性樹脂
のフィルム若しくはシート又はプレート２と重ね合せ、
プレス３及び３’により賦瀝温度にて加熱及び加圧し、
冷却後フィルム若しくはシート又はプレートを取り出す
ことにより母型を得る。Next, as shown in FIG. 1, this gold 111 is superimposed on a thermoplastic resin film or sheet or plate 2,
Heating and pressurizing at the heating temperature using presses 3 and 3',
After cooling, the film, sheet, or plate is taken out to obtain a matrix.

尚実際に大量の複製を行うＫは、この工程を複数回行い
、複数枚の母型を作り、これを継ぎ合せて多面付けの母
型として次の複製を行うことが生産効率上好ましい。For K, which actually performs a large number of copies, it is preferable in terms of production efficiency to perform this step multiple times to create a plurality of master molds, which are then joined together to form a multi-sided master mold for the next replication.

母型材料としては、熱可塑性樹脂であればほとんどのも
のが使用でき、例えば、塩化ビニル樹脂。As the matrix material, most thermoplastic resins can be used, such as vinyl chloride resin.

塩化ビニル酢酸ビニル共重合樹脂、塩化ビニリデン樹脂
、アクリル樹脂、スチロール樹脂、ポリエステル樹脂、
ビニルブチラール樹脂、スチレンー−ｊ９ジエン共重合
樹脂、ポリエチレン樹脂、ポリアミド樹脂、ポリカーボ
ネイト樹脂、フ、素樹脂。Vinyl chloride vinyl acetate copolymer resin, vinylidene chloride resin, acrylic resin, styrene resin, polyester resin,
Vinyl butyral resin, styrene-J9 diene copolymer resin, polyethylene resin, polyamide resin, polycarbonate resin, base resin.

及び繊維素系樹脂等の内から使用する紫外線又は電子線
で硬化する樹脂液に対する耐久性や、硬化後の母型−硬
化樹脂間の剥離性及び機械的強度等を考慮し適宜選択し
使用する。and cellulose resins, etc., should be selected and used as appropriate, taking into consideration the durability against resin liquids that are cured by ultraviolet rays or electron beams, the releasability between the matrix and the cured resin after curing, and the mechanical strength. .

次ＶｃＪ２を上のような母型を用いて行なう複製は、例
えば次の様にして行うことができる、第２図に示すごと
く、上記で作製された母Ｗ４の型面上に紫外線又は電子
線で硬化可能な樹脂液５を塗設し、これに紫外線又は電
子線６を照射し樹脂液を硬化賦型する。樹脂液の塗布方
法としては、ロールコート、ナイフコート、ミャバーコ
ート、グラビアコート等、公知の方法を用いれば良く、
塗布厚みは硬化後の樹脂強度を考え、適当な値にする。Replication of the next VcJ2 using the above matrix can be carried out, for example, as follows.As shown in FIG. A resin liquid 5 that can be cured is applied and irradiated with ultraviolet rays or electron beams 6 to harden and shape the resin liquid. As a method for applying the resin liquid, any known method such as roll coating, knife coating, Myaber coating, or gravure coating may be used.
The coating thickness should be set to an appropriate value considering the resin strength after curing.

又、第３図に示すごとく、予め別体の基体７ｉＣ紫外線
又は電子線で硬化する樹脂液層５を予め塗布したものを
母型４の型面に加圧密着させた後。Further, as shown in FIG. 3, a separate base 7iC on which a resin liquid layer 5 cured by ultraviolet rays or electron beams has been applied in advance is brought into close contact with the mold surface of the matrix 4 under pressure.

紫外線又は電子線６を照射し樹脂液を硬化させ賦濃し、
しかる後基体を剥離する方法によることも可能である。The resin liquid is cured and thickened by irradiation with ultraviolet rays or electron beams 6,
It is also possible to use a method in which the substrate is then peeled off.

紫外線又は電子線の照射は、母層を通して行なっても反
対側から行なっても良く、又、両側から照射しても良い
。ただし、紫外線を硬化に用いる場合、母型又は塗布基
体の材料によりては、紫外線が透過しくくい材料もある
ため、透過しやすい側から行なう事は言うまでもない。Irradiation with ultraviolet rays or electron beams may be carried out through the base layer or from the opposite side, or may be irradiated from both sides. However, when ultraviolet rays are used for curing, it goes without saying that the curing should be carried out from the side through which ultraviolet rays can easily pass, since some materials are difficult for UV rays to pass through depending on the material of the matrix or coating substrate.

又紫外線及び電子線で硬化する樹脂液としては。Also, as a resin liquid that hardens with ultraviolet rays and electron beams.

分子中に不飽和結合を有するモノマー及びオリゴマー及
びプレポリマー等や、エポキシ化合物とルイス酸の混合
物等があり、必要であれば増感剤を加え使用すれば良い
。There are monomers, oligomers, prepolymers, etc. having unsaturated bonds in the molecule, mixtures of epoxy compounds and Lewis acids, etc., and if necessary, a sensitizer may be added for use.

以上の本発明によれば従来の複製法を用いて比較的少量
の母型を作製すれば足りるので作製工程が煩雑で高価な
金型を多数使用する必要はなく。According to the present invention, it is sufficient to produce a relatively small amount of master molds using conventional replication methods, so there is no need to use a large number of complicated and expensive molds in the manufacturing process.

紫外線又は電子線で硬化する樹脂液は硬化と同時圧賦型
されるので賦型後の冷却が不要であって複製のサイクル
が短時間で済むため、ホログラムを安価に複製しうる。Since the resin liquid that is cured by ultraviolet rays or electron beams is cured and pressed at the same time, there is no need for cooling after molding, and the replication cycle can be shortened, so that holograms can be reproduced at low cost.

又１本発明において使用する母型は紫外線又は電子線が
通過する材料とすることが可能で、この場合には紫外線
又は電子線を母型側より照射し、紫外線又は電子線で硬
化する樹脂液を硬化させることＫより、紫外線又は電子
線が透過しない基体へホログラムを付けることが可能と
なる。In addition, the matrix used in the present invention can be made of a material through which ultraviolet rays or electron beams can pass.In this case, UV rays or electron beams are irradiated from the matrix side, and a resin liquid that is cured by the ultraviolet rays or electron beams is used. By curing K, it becomes possible to attach a hologram to a substrate that does not transmit ultraviolet rays or electron beams.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は金型から熱可塑性樹脂型を製造する工程を示す
断面図、第２図および第３図は本発明の方法によりホロ
グラムを複製する工程を示す、それぞれ断面図である。 １・・・・・・・・・金　屋 ４・・・・・・・・・熱可塑性樹脂型 ５・・・・・・・・・樹脂液層 才１図 才２図 牙８図FIG. 1 is a cross-sectional view showing the process of manufacturing a thermoplastic resin mold from a mold, and FIGS. 2 and 3 are cross-sectional views showing the process of replicating a hologram by the method of the present invention. 1...... Gold shop 4... Thermoplastic resin mold 5... Resin liquid layer Figure 1 Figure Figure 2 Figure 8

Claims (1)

【特許請求の範囲】[Claims] レリーフホログラムの凹凸形状を有する金型の金型面を
熱可塑性樹脂基体に密着させて加熱加圧して熱可塑性樹
脂型を作製し、次に熱可塑性樹脂型に電子線若しくは紫
外線により硬化可能が樹脂液層を密着させ、しかる後、
電子線若しくは紫外線を照射することにより樹脂液Ｊ−
を硬化させると共に賦型し、その後熱可塑性樹脂型を剥
離することを特徴とするホログラムの複製方法。The mold surface of the mold having the uneven shape of the relief hologram is brought into close contact with a thermoplastic resin base and heated and pressurized to create a thermoplastic resin mold.Then, the thermoplastic resin mold is coated with a resin that can be cured by electron beams or ultraviolet rays. Bring the liquid layer into close contact, and then
Resin liquid J- by irradiating with electron beam or ultraviolet rays
A method for duplicating a hologram, which comprises curing and molding, and then peeling off the thermoplastic resin mold.
JP2765282A 1982-02-23 1982-02-23 Duplicating method of hologram Pending JPS58144877A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2765282A JPS58144877A (en) 1982-02-23 1982-02-23 Duplicating method of hologram

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2765282A JPS58144877A (en) 1982-02-23 1982-02-23 Duplicating method of hologram

Publications (1)

Publication Number Publication Date
JPS58144877A true JPS58144877A (en) 1983-08-29

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Family Applications (1)

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JP2765282A Pending JPS58144877A (en) 1982-02-23 1982-02-23 Duplicating method of hologram

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JP (1) JPS58144877A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60254174A (en) * 1984-05-31 1985-12-14 Dainippon Printing Co Ltd Duplicating method of hologram
US5279689A (en) * 1989-06-30 1994-01-18 E. I. Du Pont De Nemours And Company Method for replicating holographic optical elements
KR19990054116A (en) * 1997-12-26 1999-07-15 구광시 Manufacturing method of holographic master roll
KR100337809B1 (en) * 2000-04-12 2002-05-23 임기택 The double width hologram a plastic shim production a method
KR100419908B1 (en) * 1997-12-17 2004-05-22 주식회사 코오롱 Method for manufacturing synthetic resin-based engraving disc film for holographic master roll
JP5502471B2 (en) 2007-07-03 2014-05-28 東洋製罐株式会社 Method for forming film with hologram pattern and container

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5122403A (en) * 1974-08-17 1976-02-23 Teac Corp
JPS5397453A (en) * 1977-02-04 1978-08-25 Sanyo Electric Co Ltd Production of metal master

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5122403A (en) * 1974-08-17 1976-02-23 Teac Corp
JPS5397453A (en) * 1977-02-04 1978-08-25 Sanyo Electric Co Ltd Production of metal master

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60254174A (en) * 1984-05-31 1985-12-14 Dainippon Printing Co Ltd Duplicating method of hologram
US5279689A (en) * 1989-06-30 1994-01-18 E. I. Du Pont De Nemours And Company Method for replicating holographic optical elements
KR100419908B1 (en) * 1997-12-17 2004-05-22 주식회사 코오롱 Method for manufacturing synthetic resin-based engraving disc film for holographic master roll
KR19990054116A (en) * 1997-12-26 1999-07-15 구광시 Manufacturing method of holographic master roll
KR100337809B1 (en) * 2000-04-12 2002-05-23 임기택 The double width hologram a plastic shim production a method
JP5502471B2 (en) 2007-07-03 2014-05-28 東洋製罐株式会社 Method for forming film with hologram pattern and container

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