JPH03166583A - Hologram reproducing mold and production thereof and production of hologram - Google Patents

Abstract

PURPOSE:To make mass reproduction of holograms having stable quality by providing an acrylate resin layer curable by electron beams onto a base of a film having electron beam transmittability and forming fine relief patterns on the surface of this resin layer. CONSTITUTION:The resin layer 2 is formed on the film or sheet-like base 1 by applying a mixture composed of the acrylate resin or monomer curable by electron beams or UV rays and melamine acrylate is then brought into tight contact with the surface of a photoresist having the rugged shapes of a hologram original plate A. The resin layer is then irradiated with the electron beams or UV rays from the base side 1 and is thereby cured. This resin layer is peeled from the surface of the hologram original plate A, by which the holo gram reproducing mold B is obtd. The hologram reproducing mold B is brought into contact with a thermoplastic resin layer 5 and simultaneously, pressurized embossing under heating is executed; thereafter, the resin layer is peeled, by which the hologram reproduced product C is obtd. The mass reproduction of the holograms having the stable quality in a short period of time is possible in this way.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to the production of holograms, and more particularly to a replication mold for relief-type holograms, a method for producing the same, and an effective method for producing holograms. be. Since holograms reproduce three-dimensional images, they are preferred for their excellent design and are used for covers of books, magazines, etc., POP displays, gifts, and the like.

Additionally, since holograms are equivalent to recording information on the submicron order, they are also used to prevent counterfeiting of securities, credit cards, etc. (Prior art) Conventionally, when mass-producing relief-type holograms, a mold is made from a photoresist with an uneven relief pattern as a base plate by metal plating, etc., and this mold is used to form a pattern on the base material. There is a known method for mass-replicating holograms by heat-pressing the coated thermoplastic resin, but this method requires a large number of steps to create the mold, making quality control difficult. Moreover, since it requires a large amount of time and labor, there is a problem in that it leads to high product prices. Therefore, as a method to solve the above problem, a method of using electron beams, ultraviolet curing resin, thermoplastic resin, or thermosetting resin instead of a mold was proposed in Japanese Patent Application Laid-Open No. 58-184986.
The method described in the above publication uses a resin mold to produce a duplicate hologram. In this process, since electron beam or ultraviolet curable resin is closely adhered to the resin mold and cured and shaped by electron beam or ultraviolet irradiation, the resin mold itself deteriorates due to repeated irradiation with high energy rays, making it difficult to produce stable products. There is a possibility that it will hinder the security. Furthermore, when making a resin mold using a thermosetting resin alone, heat is also applied to the photopolymer, which is a hologram, at the same time as the thermosetting resin is heated, making it difficult to peel off due to the increased adhesive strength between the thermosetting resin and the photopolymer. In addition, there is a further problem that the relief pattern of the hologram master may be damaged due to curing shrinkage of the thermosetting resin, making it impossible to reuse the hologram master. Furthermore, since the resin mold disclosed in the above-mentioned publication does not have sufficient heat resistance, holograms could not be manufactured by heating and pressing, which is suitable for mass production.

(Problem to be Solved by the Invention) The problem to be solved by the present invention is that, as described above, in contrast to the complicated replication process for producing conventional molds, it is necessary to use electron beam or ultraviolet curable acrylate resin or By using a mixture of melamine acrylate and melamine acrylate and making it into a replica mold, the manufacturing process of the replica mold can be shortened and the manufacturing quality can be stabilized.

In addition, it provides heat resistance and mechanical strength that can withstand the heat and pressure embossing of the thermoplastic resin in the subsequent process, making it possible to mass-produce holograms with stable quality using a replication device that uses heat and pressure, which is simple in principle. The purpose of this is to provide a copy type that can be used. (Means for Solving the Problems) That is, the present invention provides an electron beam or ultraviolet curable acrylate resin or a mixture of a monomer and melamine acrylate on an electron beam or ultraviolet ray transparent film or sheet support. A hologram replicating mold is provided, in which a resin layer is provided, which is then brought into close contact with a hologram master having a fine relief pattern on the surface, and the resin layer is cured by irradiation with electron beams or ultraviolet rays, and then peeled off from the hologram master; This is the manufacturing method. Furthermore, after heat-pressing the hologram replica mold onto the thermoplastic resin layer,
This is a method for manufacturing holograms that is characterized by separation. Here, the electron beam or ultraviolet ray curable acrylate resin used in the present invention includes ester acrylate, ester methacrylate, epoxy acrylate, epoxy methacrylate, urethane acrylate, which contains at least two or more acryloyl groups in one molecule. It is urethane methacrylate. Furthermore, melamine acrylate is an ester acrylate or ester methacrylate containing at least three or more acryloyl groups in one molecule. Then, when curing the resin layer,
A hologram replica mold is manufactured by irradiating an electron beam from the support side. (Detailed Description of the Invention) The present invention will be described in detail below with reference to the drawings. First, Figures 1 to 3 show a method for manufacturing a hologram duplication type according to the present invention, and Figures 4 to 5 relate to a method for mass duplicating holograms, and each shows a cross-sectional view. ．． First, we will explain the structural materials, and then explain the manufacturing process. In Figure 1, (1) is a film or sheet-like support, (2) is a resin layer made of an electron beam or ultraviolet curable acrylate resin or a mixture of a monomer and melamine acrylate, and (3) is a A photoresist layer (4) on which a relief pattern is formed, which is a hologram original, is a base material of the photoresist, and a glass plate is usually used.

The film or sheet-like support (1) that is transparent to electron beams or ultraviolet rays according to the present invention must have appropriate heat resistance and mechanical strength to withstand the heating of the thermoplastic resin in the subsequent process and the heating during pressurized embossing or shaping. Strength, surface smoothness, etc. are required, and specifically, polyester, polycarbonate, etc. can be used, and a thickness of about 20 to 200 μm is preferable. Furthermore, engineering plastic films such as polyimide, polyetheretherketone, polyetheride, polyphenylene sulfide, etc. can also be used. Further, as the electron beam or ultraviolet curable acrylate used in the resin layer (2), general ester acrylate, ester methacrylate, epoxy acrylate, epoxy methacrylate, urethane acrylate, and urethane methacrylate can be used, but crosslinking with at least two or more functional groups can be used. It is preferable to use a material that provides a cured film with high density. The melamine acrylate to be mixed is preferably at least trifunctional or higher in order to impart good heat resistance to the hologram reproduction mold. The mixing ratio of the electron beam or ultraviolet curable acrylate resin or monomer and melamine acrylate is 1:0 by weight.
A range of 1 to 1:2 is preferable, but the optimum mixing ratio will change if the type of material, electron beam or ultraviolet curing conditions, etc. change, so it is not limited to this range. As the photoresist layer (3) on which the relief pattern of the hologram original plate A is formed, generally widely used resists for semiconductors can be used, but positive resists with particularly excellent resolution are preferred, and are available under the trade name AZ- 1350SAZ2
400 (manufactured by Sibley), OFPR800 (manufactured by Tokyo Ohka), and Way coat HPR (manufactured by Anto) are commercially available. As the base material (4) of the photoresist, a glass plate is usually used because smoothness is required.

In FIG. 4, (5) is a thermoplastic resin layer, and (6) is a thermoplastic resin base material. The thermoplastic resin layer (5) is made of polyester resin, polystyrene, styrene-acrylic copolymer, polyvinyl chloride,
Polyvinyl acetate, vinyl chloride/vinyl acetate copolymer, polyvinyl acetal, alkyd resin, acrylic resin, polyacrylonitrile, polycarbonate, polyketone, etc. can be used.

As the thermoplastic resin base material (6), polyester, polypropylene, polycarbonate, cellophane, etc. can be used, and the above-mentioned electron beam- or ultraviolet-transparent films can also be used. Thickness is 10-100μm
A film or sheet of about 100% is preferred. Next, we will explain the manufacturing process. First, in FIG. 1, an electron beam or ultraviolet curable acrylate resin or a mixture of a monomer and melamine acrylate is coated on the film or sheet-like support of (1) by knife coating, tin coating, roll coating, etc. After coating by a known method to form a resin layer (2), it is brought into close contact with the uneven photoresist surface of the hologram original plate. The photoresist is a glass film with a thickness of 2 to 3 mm, which is coated with a subin coating so that the film thickness is approximately 1 to 3 μm, exposed to an argon laser, and then developed with a specified developer to create a relief image. It is. Next, as shown in FIG. 2, the resin layer is cured by irradiating electron beams or ultraviolet rays from the support side (1), and then peeled off from the surface of the hologram master A, as shown in FIG. 3. ,
A hologram replica mold B is obtained from the support and the cured resin layer. In this case, in order to carry out a sufficient curing reaction, the electron beam irradiation amount is 1.OMrad or more, and for ultraviolet rays, it is 100 mJ.
/cm" or more. Next, as shown in FIG. By performing and then peeling off, a final hologram replica C is obtained as shown in Fig. 5. The present invention will be explained in more detail below with reference to Examples.

(Example-1) Using Microbosit 1350 (manufactured by Shipley) as a photoresist, a photoresist layer with a film thickness of about 1.5 μm was produced on a base material consisting of a glass plate with a thickness of 3 mm,
Argon laser (wavelength 4
After exposing a 13001 tne/mm interference draft for about 1 minute using three-beam interferometry with a wavelength of 57.9 nm and an intensity of 50 mJ/cm", a grating was created by alkaline development and used as a substitute for the hologram master. Next, On a support made of a polyester film with a thickness of 100 μm, a mixed solution of an electron beam curable acrylate resin and melamine acrylate of the following composition was coated with a wire bar to a thickness of about 5 μm, and the resin liquid Next, the resin liquid layer was brought into close contact with the grating relief surface, which is a substitute for the hologram original, and then
An electron beam of 200 keV was absorbed from the support side at an absorbed dose of 5.
A hologram replica mold was prepared from the support and the cured resin layer by irradiating it under Mrad's conditions and then peeling it off from the hologram master. Peeling between the cured resin layer and the photoresist layer was good. Next, a thermoplastic resin layer having the composition shown below was applied to a thickness of about 15 μm on a base material made of a polyester film having a thickness of 50 μm using a wire bar, thereby producing a film for a replicated hologram.

Next, about 25 kg of the relief surface of the hologram replication mold was placed on the thermoplastic resin layer surface of the replication hologram film.
/cm' of pressure and heated from the support surface of the hologram replication mold at 140° C. for 5 seconds, and then the thermoplastic resin layer surface and the hologram replication mold were peeled off to obtain a replication hologram product. Ta. Furthermore, even after repeating the same heat-pressure embossing duplication process 200 times, a duplication product was obtained that gave bright, clear, and sharp diffracted light.

(Example 2) A mixed solution of ultraviolet curable acrylate and melanacrylate having the following strength was spread onto a support made of a polyester film with a thickness of 70 μm using a wire bar to a film thickness of approximately 5 μm. It was coated to form a resin liquid layer. after that,
A hologram replica mold was produced under the same conditions as in Example-1. Next, 400
After irradiating ultraviolet rays of "mJ/cm" from the polyester film side, it was peeled off, and a relief pattern was created on the thermoplastic resin layer in the same manner as in Example-1 to obtain a duplicate product.30
Even after reproducing 0 copies, a duplicate product was obtained that was bright and gave clear diffracted light.

(Effects of the Invention) As described above, according to the method for manufacturing a hologram according to the present invention, it is possible to significantly shorten the steps in producing a hologram replica mold and to save time accordingly.

In addition, when creating a hologram replication mold, the curable resin layer is cured without applying heat by using electron beams or ultraviolet rays, so the relief pattern can be peeled off and replicated without damaging the mother mold. Furthermore, by using melamine acrylate as part of the curing resin, it is possible to provide good physical and chemical heat resistance and mechanical strength that can withstand a large amount of heat-pressure duplication. Therefore, by using the hologram duplication mold obtained by the above method, a hologram with a clear image and stable quality can be produced on thermoplastic resin using a method using simple heating and pressure embossing in principle. This has the great effect of making mass replication possible in a short period of time.

[Brief explanation of the drawing]

1, 2, and 3 are cross-sectional views showing a method for manufacturing a resin mold for hologram replication, and FIGS. 4 and 5 are sectional views showing steps in a method for mass-reproducing holograms. 1...Support 2...Resin layer 3...Photoresist 4, 6...Base material 5...Thermoplastic resin layer A...Hologram original plate B... Reproduction version C: Patent application for reproduction product of rehologram Kazuo Suzuki, Representative of Toppan Printing Co., Ltd.

Claims (1)

[Scope of Claims] (1) A resin layer made of an acrylate resin or a mixture of a monomer and melamine acrylate that can be cured by electron beams or ultraviolet rays on a film or sheet-like support that is transparent to electron beams or ultraviolet rays. A hologram duplication type in which a fine relief pattern is formed on the surface of the resin layer. (2) A resin layer made of an electron beam or ultraviolet curable acrylate resin or a mixture of a monomer and melamine acrylate is provided on an electron beam or ultraviolet ray transparent film or sheet support, and then a A method for manufacturing a hologram duplication type, in which the resin layer is placed in close contact with a hologram master having a relief pattern, irradiated with electron beams or ultraviolet rays to cure the resin layer, and then peeled off from the hologram master. (3) The method for manufacturing a hologram duplication type according to (2), wherein the electron beam is irradiated from the support side. (4) A claim in which the acrylate resin or monomer consists of any one of ester acrylate, ester methacrylate, epoxy acrylate, epoxy methacrylate, urethane acrylate, and urethane methacrylate containing at least two or more acryloyl groups in one molecule ( 1) The hologram reproduction type described. (5) A claim in which the acrylate resin or monomer consists of any one of ester acrylate, ester methacrylate, epoxy acrylate, epoxy methacrylate, urethane acrylate, and urethane methacrylate containing at least two or more acryloyl groups in one molecule ( 2) or (3) the method for manufacturing a hologram replication type; (6) The hologram replicating type according to claim (1), wherein the melamine acrylate is an ester acrylate or an ester methacrylate containing at least three or more acryloyl groups in one molecule. (7) A method for producing a hologram, by heat-pressing the duplication mold according to claim (1) onto a thermoplastic resin layer of a base material having a thermoplastic resin layer, and then removing the duplication mold.