JPS58164250A - 半導体封止用樹脂組成物 - Google Patents

半導体封止用樹脂組成物

Info

Publication number
JPS58164250A
JPS58164250A JP57046611A JP4661182A JPS58164250A JP S58164250 A JPS58164250 A JP S58164250A JP 57046611 A JP57046611 A JP 57046611A JP 4661182 A JP4661182 A JP 4661182A JP S58164250 A JPS58164250 A JP S58164250A
Authority
JP
Japan
Prior art keywords
less
particle size
mold
silica powder
mixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57046611A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0343784B2 (2
Inventor
Kazuyuki Miki
三木　和幸
Takeo Ono
大野　武男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP57046611A priority Critical patent/JPS58164250A/ja
Publication of JPS58164250A publication Critical patent/JPS58164250A/ja
Publication of JPH0343784B2 publication Critical patent/JPH0343784B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP57046611A 1982-03-24 1982-03-24 半導体封止用樹脂組成物 Granted JPS58164250A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57046611A JPS58164250A (ja) 1982-03-24 1982-03-24 半導体封止用樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57046611A JPS58164250A (ja) 1982-03-24 1982-03-24 半導体封止用樹脂組成物

Publications (2)

Publication Number Publication Date
JPS58164250A true JPS58164250A (ja) 1983-09-29
JPH0343784B2 JPH0343784B2 (2) 1991-07-03

Family

ID=12752093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57046611A Granted JPS58164250A (ja) 1982-03-24 1982-03-24 半導体封止用樹脂組成物

Country Status (1)

Country Link
JP (1) JPS58164250A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6181422A (ja) * 1984-09-28 1986-04-25 Toshiba Corp 注型用エポキシ樹脂組成物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5610947A (en) * 1979-07-10 1981-02-03 Toshiba Corp Semiconductor sealing resin composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6181422A (ja) * 1984-09-28 1986-04-25 Toshiba Corp 注型用エポキシ樹脂組成物

Also Published As

Publication number Publication date
JPH0343784B2 (2) 1991-07-03

Similar Documents

Publication Publication Date Title
JPS627211B2 (2)
JPH059270A (ja) 樹脂組成物およびその製造方法
JPS5922955A (ja) 半導体封止用樹脂組成物
JPS59108026A (ja) 封止用エポキシ樹脂組成物
JPH05247181A (ja) エポキシ樹脂組成物および半導体封止装置
JPS58164250A (ja) 半導体封止用樹脂組成物
JP2000319633A (ja) エポキシ樹脂系封止材料用シリカ系充填材
JPH10173103A (ja) 半導体封止用エポキシ樹脂組成物
JPS61254619A (ja) 半導体封止用エポキシ樹脂組成物
JPS61101522A (ja) 封止用樹脂組成物
JPH04164953A (ja) エポキシ樹脂組成物
JP2000007894A (ja) エポキシ樹脂組成物及び半導体装置
JP5275697B2 (ja) 封止用エポキシ樹脂組成物およびその製造方法
JPH02219814A (ja) エポキシ樹脂組成物
JPH1030049A (ja) エポキシ樹脂組成物および電子部品封止装置
JPS61101523A (ja) 封止用樹脂組成物
JPH0588904B2 (2)
JP2741254B2 (ja) エポキシ樹脂組成物
JPS61101521A (ja) 封止用樹脂組成物
JPS6310616A (ja) 封止用樹脂組成物
JPH06184283A (ja) 半導体封止用樹脂組成物
JPH093169A (ja) 封止用樹脂組成物および電子部品封止装置
JPS61101524A (ja) 封止用樹脂組成物
JP3468900B2 (ja) 半導体装置
JPH03197529A (ja) 半導体封止用エポキシ樹脂成形材料