JPS58166034U - 半導体製造装置 - Google Patents

半導体製造装置

Info

Publication number
JPS58166034U
JPS58166034U JP1982064246U JP6424682U JPS58166034U JP S58166034 U JPS58166034 U JP S58166034U JP 1982064246 U JP1982064246 U JP 1982064246U JP 6424682 U JP6424682 U JP 6424682U JP S58166034 U JPS58166034 U JP S58166034U
Authority
JP
Japan
Prior art keywords
cavity
semiconductor manufacturing
manufacturing equipment
substrate
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982064246U
Other languages
English (en)
Inventor
小関　隆之
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1982064246U priority Critical patent/JPS58166034U/ja
Publication of JPS58166034U publication Critical patent/JPS58166034U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は絶縁形樹脂モールド型半導体装置の一例を示す
部分透視平面図、第２図は第１図Ａ−Ａ面図、第３図は
樹脂モールド装置の一例を示す側−面図、第４図は本考
案による樹脂モールド装置の側断面図、第５図及び第６
図は第４図装置の動作を説明する側断面図を示す。　　
　−１・・・・・・基板、２・・・・・・半導体ペレッ
ト、５・・・・・・樹脂モールド部、８・・・・・・キ
ャビティ、９・・・・・・可動片。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体ベレン“トを固定した基板をキャビティ内゛　に
    位置決め固定し、樹脂を充填して、゛半導体ペレット並
    びに基板を樹脂にて被覆するものにおいて、上記基板の
    裏面とキャビティ内面の間隔を規制する可動片をキャビ
    ティ内に突出退入自在に慇けたことを特徴とする半導体
    製造装置。
JP1982064246U 1982-04-30 1982-04-30 半導体製造装置 Pending JPS58166034U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982064246U JPS58166034U (ja) 1982-04-30 1982-04-30 半導体製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982064246U JPS58166034U (ja) 1982-04-30 1982-04-30 半導体製造装置

Publications (1)

Publication Number Publication Date
JPS58166034U true JPS58166034U (ja) 1983-11-05

Family

ID=30074286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982064246U Pending JPS58166034U (ja) 1982-04-30 1982-04-30 半導体製造装置

Country Status (1)

Country Link
JP (1) JPS58166034U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02114542A (ja) * 1988-10-24 1990-04-26 Rohm Co Ltd 半導体装置におけるモールド部の成形装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02114542A (ja) * 1988-10-24 1990-04-26 Rohm Co Ltd 半導体装置におけるモールド部の成形装置

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