JPS596839U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS596839U
JPS596839U JP1982102839U JP10283982U JPS596839U JP S596839 U JPS596839 U JP S596839U JP 1982102839 U JP1982102839 U JP 1982102839U JP 10283982 U JP10283982 U JP 10283982U JP S596839 U JPS596839 U JP S596839U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
encapsulant
bending part
lead
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982102839U
Other languages
English (en)
Inventor
寺地　和文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1982102839U priority Critical patent/JPS596839U/ja
Publication of JPS596839U publication Critical patent/JPS596839U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図及び第２図ａ、　　ｂは各々従来の半導体装置の
断面図及び各々平面図、第３図及び第４図ａ。 ｂは本考案の一実施例を示す断面図及び各々平面図、第
５図及び第６図ａ、　　ｂは本考案の他の実施例を示す
断面図及び各々平面図、第７図はさらに他の実施例の断
面図、である。 なお図において、１１．３１・・・・・・テープキャリ
ア、１４．３４・・・・・・電極、５４・・・・・・ボ
ンディングワイヤー、１２．３２．５２・・・・・・金
属リード、１５、　２５．　５５・・・晶樹脂、１３．
　３３．　５３・・・・・・半導体素子、１６．　３６
．　５６・・・・・・外部リード、である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子下面より下の方にリード曲げ部を有し、該リ
    ード曲げ部の一部が封止材中にあり、残部が封止材面に
    埋設されほぼ該封止材面と同一面上にリード端面が露出
    していることを特徴とする半導体装置。
JP1982102839U 1982-07-07 1982-07-07 半導体装置 Pending JPS596839U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982102839U JPS596839U (ja) 1982-07-07 1982-07-07 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982102839U JPS596839U (ja) 1982-07-07 1982-07-07 半導体装置

Publications (1)

Publication Number Publication Date
JPS596839U true JPS596839U (ja) 1984-01-17

Family

ID=30242211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982102839U Pending JPS596839U (ja) 1982-07-07 1982-07-07 半導体装置

Country Status (1)

Country Link
JP (1) JPS596839U (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60156758U (ja) * 1984-03-28 1985-10-18 株式会社　フジ電科 気密端子
JPS61128548A (ja) * 1984-11-27 1986-06-16 Matsushita Electronics Corp 半導体装置
JPH0180473U (ja) * 1987-11-20 1989-05-30
JPH05115564A (ja) * 1992-04-04 1993-05-14 Advance Co Ltd 皮膚貼着型低周波治療器
JPH05115565A (ja) * 1992-04-04 1993-05-14 Advance Co Ltd 皮膚貼着型低周波治療器
JPH0774277A (ja) * 1994-07-11 1995-03-17 Matsushita Electron Corp 半導体装置
JPH08227950A (ja) * 1995-12-14 1996-09-03 Matsushita Electron Corp 半導体装置
JP2012009902A (ja) * 1999-12-30 2012-01-12 Osram Opto Semiconductors Gmbh 表面に取り付け可能な発光ダイオード光源および発光ダイオード光源を製造する方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60156758U (ja) * 1984-03-28 1985-10-18 株式会社　フジ電科 気密端子
JPS61128548A (ja) * 1984-11-27 1986-06-16 Matsushita Electronics Corp 半導体装置
JPH0180473U (ja) * 1987-11-20 1989-05-30
JPH05115564A (ja) * 1992-04-04 1993-05-14 Advance Co Ltd 皮膚貼着型低周波治療器
JPH05115565A (ja) * 1992-04-04 1993-05-14 Advance Co Ltd 皮膚貼着型低周波治療器
JPH0774277A (ja) * 1994-07-11 1995-03-17 Matsushita Electron Corp 半導体装置
JPH08227950A (ja) * 1995-12-14 1996-09-03 Matsushita Electron Corp 半導体装置
JP2012009902A (ja) * 1999-12-30 2012-01-12 Osram Opto Semiconductors Gmbh 表面に取り付け可能な発光ダイオード光源および発光ダイオード光源を製造する方法

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