JPS58166750A - 集積回路の冷却装置 - Google Patents

集積回路の冷却装置

Info

Publication number
JPS58166750A
JPS58166750A JP57049079A JP4907982A JPS58166750A JP S58166750 A JPS58166750 A JP S58166750A JP 57049079 A JP57049079 A JP 57049079A JP 4907982 A JP4907982 A JP 4907982A JP S58166750 A JPS58166750 A JP S58166750A
Authority
JP
Japan
Prior art keywords
semiconductor chip
melting point
low melting
point metal
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57049079A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0340952B2 (2
Inventor
Noriyuki Ashiwake
芦分　範行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57049079A priority Critical patent/JPS58166750A/ja
Publication of JPS58166750A publication Critical patent/JPS58166750A/ja
Publication of JPH0340952B2 publication Critical patent/JPH0340952B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/774—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP57049079A 1982-03-29 1982-03-29 集積回路の冷却装置 Granted JPS58166750A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57049079A JPS58166750A (ja) 1982-03-29 1982-03-29 集積回路の冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57049079A JPS58166750A (ja) 1982-03-29 1982-03-29 集積回路の冷却装置

Publications (2)

Publication Number Publication Date
JPS58166750A true JPS58166750A (ja) 1983-10-01
JPH0340952B2 JPH0340952B2 (2) 1991-06-20

Family

ID=12821080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57049079A Granted JPS58166750A (ja) 1982-03-29 1982-03-29 集積回路の冷却装置

Country Status (1)

Country Link
JP (1) JPS58166750A (2)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60126853A (ja) * 1983-12-14 1985-07-06 Hitachi Ltd 半導体デバイス冷却装置
US5132776A (en) * 1988-10-28 1992-07-21 Sumitomo Electric Industries, Ltd. Member for carrying a semiconductor device
US6243944B1 (en) * 1997-12-08 2001-06-12 Unisys Corporation Residue-free method of assembling and disassembling a pressed joint with low thermal resistance
US6867976B2 (en) * 2002-02-12 2005-03-15 Hewlett-Packard Development Company, L.P. Pin retention for thermal transfer interfaces, and associated methods
FR3138563A1 (fr) * 2022-07-27 2024-02-02 Safran Electronics & Defense Drain thermique pour une carte électronique

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60126853A (ja) * 1983-12-14 1985-07-06 Hitachi Ltd 半導体デバイス冷却装置
US5132776A (en) * 1988-10-28 1992-07-21 Sumitomo Electric Industries, Ltd. Member for carrying a semiconductor device
US6243944B1 (en) * 1997-12-08 2001-06-12 Unisys Corporation Residue-free method of assembling and disassembling a pressed joint with low thermal resistance
US6867976B2 (en) * 2002-02-12 2005-03-15 Hewlett-Packard Development Company, L.P. Pin retention for thermal transfer interfaces, and associated methods
FR3138563A1 (fr) * 2022-07-27 2024-02-02 Safran Electronics & Defense Drain thermique pour une carte électronique

Also Published As

Publication number Publication date
JPH0340952B2 (2) 1991-06-20

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