JPS58193372A - スズ−ニツケル合金のエツチング液 - Google Patents
スズ−ニツケル合金のエツチング液Info
- Publication number
- JPS58193372A JPS58193372A JP7364083A JP7364083A JPS58193372A JP S58193372 A JPS58193372 A JP S58193372A JP 7364083 A JP7364083 A JP 7364083A JP 7364083 A JP7364083 A JP 7364083A JP S58193372 A JPS58193372 A JP S58193372A
- Authority
- JP
- Japan
- Prior art keywords
- tin
- nickel alloy
- copper
- etching
- mol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7364083A JPS58193372A (ja) | 1983-04-25 | 1983-04-25 | スズ−ニツケル合金のエツチング液 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7364083A JPS58193372A (ja) | 1983-04-25 | 1983-04-25 | スズ−ニツケル合金のエツチング液 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1084479A Division JPS55104481A (en) | 1979-02-01 | 1979-02-01 | Etching fluid for tin-nickel alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58193372A true JPS58193372A (ja) | 1983-11-11 |
| JPS6217033B2 JPS6217033B2 (fr) | 1987-04-15 |
Family
ID=13524089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7364083A Granted JPS58193372A (ja) | 1983-04-25 | 1983-04-25 | スズ−ニツケル合金のエツチング液 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58193372A (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022131188A1 (fr) * | 2020-12-15 | 2022-06-23 | 三菱瓦斯化学株式会社 | Composition aqueuse, procédé de rugosification de surface d'acier inoxydable mettant en œuvre une telle composition, et procédé de fabrication d'acier inoxydable rugueux |
| WO2022131187A1 (fr) * | 2020-12-15 | 2022-06-23 | 三菱瓦斯化学株式会社 | Procédé de traitement de rugosification pour surface d'acier inoxydable, procédé de fabrication d'acier inoxydable rugosifié, et composition aqueuse utilisée dans lesdits procédés |
-
1983
- 1983-04-25 JP JP7364083A patent/JPS58193372A/ja active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022131188A1 (fr) * | 2020-12-15 | 2022-06-23 | 三菱瓦斯化学株式会社 | Composition aqueuse, procédé de rugosification de surface d'acier inoxydable mettant en œuvre une telle composition, et procédé de fabrication d'acier inoxydable rugueux |
| JPWO2022131188A1 (fr) * | 2020-12-15 | 2022-06-23 | ||
| WO2022131187A1 (fr) * | 2020-12-15 | 2022-06-23 | 三菱瓦斯化学株式会社 | Procédé de traitement de rugosification pour surface d'acier inoxydable, procédé de fabrication d'acier inoxydable rugosifié, et composition aqueuse utilisée dans lesdits procédés |
| JPWO2022131187A1 (fr) * | 2020-12-15 | 2022-06-23 | ||
| US12351922B2 (en) | 2020-12-15 | 2025-07-08 | Mitsubishi Gas Chemical Company, Inc. | Roughening treatment method for stainless steel surface, method for manufacturing roughened stainless steel, and aqueous composition used in said methods |
| US12590373B2 (en) | 2020-12-15 | 2026-03-31 | Mitsubishi Gas Chemical Company, Inc. | Aqueous composition, stainless steel surface roughening method using same, and method for manufacturing roughened stainless steel |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6217033B2 (fr) | 1987-04-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA2083197C (fr) | Utilisation d'imidazole-2-thione comme agent complexant dans l'etamage par deplacement | |
| US6746621B2 (en) | Micro-etching composition for copper or copper alloy, micro-etching method, and method for manufacturing printed circuit board | |
| US20050109734A1 (en) | Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the | |
| US5689227A (en) | Circuit board material with barrier layer | |
| EP0178864B1 (fr) | Méthode pour la production de plaquettes à circuit imprimé à trous traversants cuivrés | |
| US5217751A (en) | Stabilized spray displacement plating process | |
| CN104651840A (zh) | 蚀刻用组合物以及使用了其的印刷电路板的制造方法 | |
| CA2083196C (fr) | Procede pour prolonger la duree de vie d'un bain de galvanoplastie par jet mobile | |
| US5211831A (en) | Process for extending the life of a displacement plating bath | |
| JPS62211384A (ja) | 機械的性質の優れた銅被膜の形成方法 | |
| US4220945A (en) | Printed circuit substrate with resistance coat | |
| EP0926266B1 (fr) | Procédé et composition pour le décapage de couches Al-Cu pour la production de circuits électroniques | |
| US4734156A (en) | Method for forming electrically conductive circuits on a base board | |
| US4283248A (en) | Etching solution for tin-nickel alloy and process for etching the same | |
| US6547946B2 (en) | Processing a printed wiring board by single bath electrodeposition | |
| JP2005154899A (ja) | エッチング液、その補給液、それらを用いるエッチング方法及び配線基板の製造方法 | |
| JPS58193372A (ja) | スズ−ニツケル合金のエツチング液 | |
| JP3166868B2 (ja) | 銅ポリイミド基板の製造方法 | |
| GB2080630A (en) | Printed circuit panels | |
| JPH04245129A (ja) | チップ型ヒューズ | |
| JPS6190497A (ja) | プラスチツク層を確実に腐食しならびに亀裂のないように粗面化する方法 | |
| JP2624068B2 (ja) | プリント配線板の製造法 | |
| US4520052A (en) | Method for electroless copper-plating and a bath for carrying out the method | |
| DE3543615C2 (fr) | ||
| JPS63149393A (ja) | インバ−ル・ホイル |