JPS58199521A - Method of producing chip-shaped electronic part - Google Patents
Method of producing chip-shaped electronic partInfo
- Publication number
- JPS58199521A JPS58199521A JP8349782A JP8349782A JPS58199521A JP S58199521 A JPS58199521 A JP S58199521A JP 8349782 A JP8349782 A JP 8349782A JP 8349782 A JP8349782 A JP 8349782A JP S58199521 A JPS58199521 A JP S58199521A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- chip
- solid electrolytic
- resin
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title description 6
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 description 22
- 239000007787 solid Substances 0.000 description 13
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 11
- 229910052715 tantalum Inorganic materials 0.000 description 11
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 9
- 238000005452 bending Methods 0.000 description 4
- 235000009508 confectionery Nutrition 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 101100136092 Drosophila melanogaster peng gene Proteins 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Inorganic materials O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Light Receiving Elements (AREA)
- Ceramic Capacitors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は固体電解コンデンサなどを樹脂成形したチップ
型電子部品の製漬方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing chip-type electronic components such as solid electrolytic capacitors molded with resin.
従来の樹脂成形チップ型電子部品たとえばチップ型タン
タル固体電解コンデンサの構成には第１図や第２図に示
すものがある。すなわち第１図はコンデンサ電子（１）
からの陽極引出線（２）に陽極端子（３）を溶接し、ま
た前記電子（１）の陰極層（４）に陰極端子（５）をへ
ンダまた扛導電性接檄剤などにより接続しこれらを樹脂
（６）で成形したものである。’１７を第２図に示した
ものは前記＠極端子（３）および陰極端子（５）を長く
切断し１Ｍ脂成形後コンデンサ側面に折曲げたものでへ
ンダ付けを容易ならしめたものである。このような構成
からなるコンデンサの製造方法は第３図に示すＦθ＊
Ｎ ｉ ＃ Ｃｕまたはこれらの合金からなるフレーム
（７）を打抜きや折曲げ加工を行って作成し、該フレー
ム（７）上に前記電子（１）の陽極引出線（２）および
＃＆極層（４）を載置し陽極引出線（２）を溶接し陰極
層（４）をへンダ付けまたは導電性接部剤で接続したの
ちエポキシ、シリコン、フェノールなどの合成樹脂をＦ
ランス７ア成形や射出成形などの方法で樹脂（６）外装
を形成していた。そしてリードフレーム（７）を切断し
て第１図に示す構成のチップ型タンタル固体電解コンデ
ンサを得たシ、またはリードフレーム（））を長く切断
してさらに折曲げて第２図に示す構成のコンレンサを得
た）していた。しかしながらリードフレーム（７）の形
状が複雑なためコスト高になることやリードフレーム（
７］上に載置する際の菓子（１）の位置が特に小型の電
子部品では内植で作業能率が悪くこの解決策としては精
密な自動機械を要するので多大な設備投資を必要とする
などの問題点や第２図に示す構成のものでにｗ脂外装後
に７レームを切断し折曲げ加工を行わなければならずコ
スト高となる欠点を有していた。2. Description of the Related Art Conventional resin-molded chip-type electronic components such as chip-type tantalum solid electrolytic capacitors include those shown in FIGS. 1 and 2. In other words, Figure 1 shows the capacitor electron (1)
An anode terminal (3) is welded to the anode lead wire (2) from the electron (1), and a cathode terminal (5) is connected to the cathode layer (4) of the electron (1) using a solder or a conductive adhesive. These are molded with resin (6). '17 shown in Figure 2 is made by cutting the @ electrode terminal (3) and cathode terminal (5) long, molding them with 1M resin, and bending them to the side of the capacitor to make soldering easier. be. The manufacturing method of a capacitor with such a configuration is Fθ* shown in Fig. 3.
A frame (7) made of Ni#Cu or an alloy thereof is created by punching or bending, and the anode lead wire (2) of the electron (1) and the #& electrode layer are placed on the frame (7). (4), weld the anode lead wire (2), connect the cathode layer (4) by soldering or using a conductive connecting agent, and then apply synthetic resin such as epoxy, silicone, or phenol to F.
The resin (6) exterior was formed using methods such as lance molding and injection molding. Then, the lead frame (7) is cut to obtain a chip-type tantalum solid electrolytic capacitor having the structure shown in Fig. 1, or the lead frame (7) is cut long and further bent to obtain the structure shown in Fig. 2. (obtained a consensus). However, because the shape of the lead frame (7) is complicated, the cost is high and the lead frame (7) is complicated.
7] The position of the confectionery (1) when placing it on top of the confectionery (1) is particularly in the case of small electronic components, resulting in poor work efficiency and a solution to this problem that requires precision automatic machinery, which requires a large investment in equipment. In addition, the structure shown in FIG. 2 had the disadvantage that seven frames had to be cut and bent after being covered with wand, resulting in high costs.
本発明は上記の点に鍾みてなされたものでリードフレー
ム構造および製造方法が簡単な電子部品を得、よってコ
スト低減を図ることのできる電子部品の製造方法を提供
しようとするものである。The present invention has been made in view of the above points, and it is an object of the present invention to provide an electronic component manufacturing method that can obtain an electronic component with a simple lead frame structure and a simple manufacturing method, and thereby reduce costs.
以下実施例によ如説明する。第４図に示すように金属支
持板（１１）にタンタル固体電解コンデンサ素子（１２
）の陽極引出線（１３）を等間隔に溶接し、この状態の
ままで化成皮膜−二酸化マンガン層−陰極層の形成を行
う。このようにして作成したコンデンサ素子（１２）を
第５図に示すように金属板を打抜き一折曲げた折曲部（
１４）を形成した第１のリード７ レーＪｋ （１５）
にペースト状ハンダまたは熱硬化性の導電性接着剤で仮
留めする。このとき前記折曲部（１４）のピッチはコン
デンサ素子（１２）の陽極引出線（１３）を溶接した＠
鵬に等しく設定することは当然である。前記の仮留めし
たコンデンサ素子（１２］リードフレーム（１５）と同
一構造の第２のり−ドフ１し一ム（１６）を使用し前記
折曲部（１４）と対向するように配した折曲部（１７）
の上端を菓子（１２）の陽極引出線（１３）に当接させ
この状態で溶接したのち点線で示した位置でｖａｍ引出
線（１３）を切断する。この２本のリードフレーム（１
５０１６）に接続されたコンデンサ素子（１２）を樹脂
成形金型にセットし、トランスファー成形あるいは射出
成形したのちリードフレーム（１５）（１６）の前記折
曲部間を切断して第６図に示すような樹脂（１８）で外
装したチップ型固体電解コンデンサ（１９）を得ること
ができる。This will be explained below using examples. As shown in Figure 4, a tantalum solid electrolytic capacitor element (12) is mounted on a metal support plate (11).
) are welded at equal intervals, and in this state, the chemical conversion film-manganese dioxide layer-cathode layer is formed. As shown in Fig. 5, the capacitor element (12) thus produced is made by punching out a metal plate and bending the bent part (
14) The first lead 7 formed ray Jk (15)
Temporarily fasten with paste solder or thermosetting conductive adhesive. At this time, the pitch of the bent portion (14) is set at the pitch where the anode lead wire (13) of the capacitor element (12) is welded.
It is natural to set it equal to Peng. The temporarily fastened capacitor element (12) is bent using a second glue dome (16) having the same structure as the lead frame (15) and arranged to face the bent part (14). Part (17)
The upper end of the VAM wire (13) is brought into contact with the anode lead wire (13) of the confectionery (12) and welded in this state, and then the VAM lead wire (13) is cut at the position shown by the dotted line. These two lead frames (1
The capacitor element (12) connected to the lead frame (15) and (16) is set in a resin molding die, transfer molded or injection molded, and then the lead frame (15) and (16) are cut between the bent portions as shown in FIG. A chip-type solid electrolytic capacitor (19) can be obtained which is packaged with such a resin (18).
以上述べたように本発明によれば使用するｙ−ドフレー
ムの構造が簡単であシ、よってその製造コス）を大幅に
引下げることができるし、電子部品を金属支持板に溶接
したまま陰極層形成−リードフレームへの素子接続工程
まで行うことができるので非常に能率的であり、かつそ
の素子の位置決めなども容易なため自動化も簡易に行う
ことができて、従来のような高精度な機械設備を要しな
いなどの桓々の利点を有するものである。As described above, according to the present invention, the structure of the y-de frame used is simple, and therefore the manufacturing cost can be significantly reduced. It is extremely efficient because it can perform the layer formation process and the process of connecting the device to the lead frame, and since the positioning of the device is easy, it can be easily automated, and it is not possible to achieve high precision as in the past. It has many advantages such as not requiring any mechanical equipment.
なお上記実施例ではタンタル固体電解コンデン費につい
て述べたがその他の電子部品たとえばダイオードなどで
も同様の効果を得ることができる。In the above embodiment, the tantalum solid electrolytic capacitor was described, but similar effects can be obtained with other electronic components such as diodes.
第１図は従来のチップ型タンタル固体電解コンデンサを
示す正断面図、第２図は他の従来のチップ型タンタル固
体電解コンデンすを示す正断面図、第３図は従来のチッ
プ型タンタル固体電解コンデン−１１″葉子をリードフ
レームに接続した工程を示す斜視図、第４図は本発明に
なるチップ型タンタル固体電解コンデン１ｍ子を金属支
持板に溶接した状態を示す正面図、第５図は本発明にな
るコンデンサ素子をリードフレームに接続した状態を示
す斜視図、第６図は本発明になる製造方法によシ作製さ
れたチップ型タンタル固体電解コンデンサを示す正断面
図である。
（１１）−−−−一強属支持板
（１２）−−−−−タンタル固体電解コンデンサ菓子＋
１３３−−−−一隅極引出線
＋１４３−−−−一第１のリードフレームの折曲部（１
５）−−−−−−ｇ １のリード７レー人（１６）−−
−−一第２のリードフレーム（１７）−−−−一第２の
リードフレームの折曲部１１８）−−−−一舊 脂
（１９）〜−−−−−タンタル固体電解コンデンサ特
許 出 願 人
マルコン電子株式金社
第３図
第４図
第３図
第６図
９１−Figure 1 is a front sectional view showing a conventional chip-type tantalum solid electrolytic capacitor, Figure 2 is a front sectional view showing another conventional chip-type tantalum solid electrolytic capacitor, and Figure 3 is a front sectional view showing a conventional chip-type tantalum solid electrolytic capacitor. FIG. 4 is a perspective view showing the process of connecting the capacitor 11" leaf to the lead frame, FIG. 4 is a front view showing the state in which the chip-type tantalum solid electrolytic capacitor according to the present invention of 1 m is welded to a metal support plate, and FIG. FIG. 6 is a perspective view showing a capacitor element according to the present invention connected to a lead frame, and FIG. 6 is a front sectional view showing a chip-type tantalum solid electrolytic capacitor manufactured by the manufacturing method according to the present invention. (11 )------One strong support plate (12)------Tantalum solid electrolytic capacitor confectionery +
133----One corner pole leader line+143-----1 bending part of the first lead frame (1
5)------g 1 lead 7 people (16)---
--- 1. Second lead frame (17) ---- 1. Bent part 118 of the second lead frame) --- 19) --- Tantalum solid electrolytic capacitor special
Permission Application Marcon Electronics Co., Ltd. Figure 3 Figure 4 Figure 3 Figure 6 Figure 91-
Claims (1)
品製子を前記間隔と等間隔に形成式れた第１のリードフ
レームの折曲部に＊＆して接続し、前記リード線を販折
曲部と対向するように配した第２のリードフレームの折
曲部へ＃ｉ接したのチ９Ｊ１９ｒＬ樹脂外装を行い、リ
ードフレームの前記折曲部間を切断するチップ型電子部
品の製造方法。(1) An electronic component holder with lead wires connected to a metal support plate in a manner of approximately 100 degrees is connected to the bent portions of the first lead frame formed at equal intervals to the above-mentioned intervals, and the above-mentioned leads A chip-type electronic component in which the lead frame is covered with resin and the lead frame is cut between the bent portions of the second lead frame in which the wire is #i in contact with the bent portion of the second lead frame arranged to face the bent portion. manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8349782A JPS58199521A (en) | 1982-05-17 | 1982-05-17 | Method of producing chip-shaped electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8349782A JPS58199521A (en) | 1982-05-17 | 1982-05-17 | Method of producing chip-shaped electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58199521A true JPS58199521A (en) | 1983-11-19 |
| JPS6258651B2 JPS6258651B2 (en) | 1987-12-07 |
Family
ID=13804110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8349782A Granted JPS58199521A (en) | 1982-05-17 | 1982-05-17 | Method of producing chip-shaped electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58199521A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6411530U (en) * | 1987-07-10 | 1989-01-20 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5478458A (en) * | 1977-12-02 | 1979-06-22 | Nippon Electric Co | Chip type solid electrolyte capacitor and method of producing same |
| JPS5676519A (en) * | 1979-11-28 | 1981-06-24 | Nippon Electric Co | Method of manufacturing chip solid electrolytic condenser |
-
1982
- 1982-05-17 JP JP8349782A patent/JPS58199521A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5478458A (en) * | 1977-12-02 | 1979-06-22 | Nippon Electric Co | Chip type solid electrolyte capacitor and method of producing same |
| JPS5676519A (en) * | 1979-11-28 | 1981-06-24 | Nippon Electric Co | Method of manufacturing chip solid electrolytic condenser |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6411530U (en) * | 1987-07-10 | 1989-01-20 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6258651B2 (en) | 1987-12-07 |
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