JPS6258651B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a chip-type electronic component in which a solid electrolytic capacitor or the like is molded with resin.

Conventional resin-molded chip-type electronic components, such as chip-type tantalum solid electrolytic capacitors, include those shown in FIGS. 1 and 2. That is, in FIG. 1, an anode terminal 3 is welded to an anode lead wire 2 from a capacitor element 1, a cathode terminal 5 is connected to a cathode layer 4 of the element 1 with solder or conductive adhesive, and these are bonded with resin 6. It is molded. Furthermore, in the case shown in FIG. 2, the anode terminal 3 and the cathode terminal 5 are cut into long lengths, molded with resin, and then bent onto the side surface of the capacitor to facilitate soldering. A method for manufacturing a capacitor having such a configuration is to create a frame 7 made of Fe, Ni, Cu, or an alloy thereof as shown in FIG.
After placing the anode lead wire 2 and cathode layer 4, weld the anode lead wire 2, and connect the cathode layer 4 with soldering or conductive adhesive, transfer molding or injection of synthetic resin such as epoxy, silicone, or phenol is performed. The resin 6 exterior was formed using methods such as molding.
Then, the lead frame 7 is cut to obtain a chip-type tantalum solid electrolytic capacitor having the structure shown in FIG. 1, or the lead frame 7 is cut into long pieces and further bent to obtain a capacitor having the structure shown in FIG. was. However, lead frame 7
The complicated shape of the element 1 increases costs, and the positioning of the element 1 when mounting it on the lead frame 7 is difficult, especially for small electronic components, resulting in poor work efficiency.The solution to this problem is to use precision automatic machinery. There are problems such as the need for a large amount of capital investment and the
The structure shown in the figure had the disadvantage that the frame had to be cut and bent after being coated with resin, resulting in high costs.

The present invention has been made in view of the above points, and
It is an object of the present invention to provide a method of manufacturing an electronic component that can obtain an electronic component with a simple lead frame structure and a simple manufacturing method, thereby reducing costs.

This will be explained below using examples. As shown in FIG. 4, the anode lead wires 13 of the tantalum solid electrolytic capacitor element 12 are welded to the metal support plate 11 at equal intervals, and in this state, a chemical conversion film, a manganese dioxide layer, and a cathode layer are formed. As shown in FIG. 5, the capacitor element 12 produced in this manner is attached to a first lead frame 15 with a bent part 14 formed by punching and bending a metal plate, and bonded with paste solder or thermosetting conductive adhesive. Temporarily fasten with adhesive. At this time, it is a matter of course that the pitch of the bent portions 14 is set equal to the interval at which the anode lead wires 13 of the capacitor element 12 are welded. The temporarily fixed capacitor element 1
2 and the lead frame 15 to make the connection 20 by soldering or by hardening the conductive adhesive. Next, a second lead frame 16 having the same shape as the lead frame 15 is used to form the bent portion 1.
4, the upper end of the bent part 17 arranged to face the anode lead wire 13 of the element 12 is brought into contact with the anode lead wire 13 of the element 12, and after welding in this state, the anode lead wire 13 is attached at the position shown by the dotted line.
cut. These two lead frames 15,1
The capacitor element 12 connected to the lead frames 15 and 16 is set in a resin molding die, transfer molded or injection molded, and then the lead frames 15 and 16 are cut between the bent portions to form a resin 18 as shown in FIG. Packaged chip-type tantalum solid electrolytic capacitor 19
can be obtained.

As described above, according to the present invention, the structure of the lead frame used is simple, and a pair of lead frames of the same shape are used, which can significantly reduce the manufacturing cost and reduce the number of electronic components. The process of forming the cathode layer and connecting the device to the lead frame can be performed while it is welded to the metal support plate, making it extremely efficient.Also, since the device can be easily positioned, it can be easily automated. , it has various advantages such as not requiring high-precision mechanical equipment like conventional ones.

In the above embodiment, a tantalum solid electrolytic capacitor was described, but similar effects can be obtained with other electronic components such as diodes.

[Brief explanation of the drawing]

Figure 1 is a front sectional view showing a conventional chip-type tantalum solid electrolytic capacitor, Figure 2 is a front sectional view showing another conventional chip-type tantalum solid electrolytic capacitor, and Figure 3 is a conventional chip-type tantalum solid electrolytic capacitor element. FIG. 4 is a front view showing the chip-type tantalum solid electrolytic capacitor element according to the present invention welded to a metal support plate, and FIG. 5 is a perspective view showing the process of connecting the capacitor element according to the present invention to a lead frame. FIG. 6 is a front sectional view showing a chip-type tantalum solid electrolytic capacitor manufactured by the manufacturing method of the present invention. 11...Metal support plate, 12...Tantalum solid electrolytic capacitor element, 13...Anode lead wire, 14...
...bending portion of first lead frame, 15...first
lead frame, 16...second lead frame, 17...bending portion of second lead frame, 1
8... Resin, 19... Chip type tantalum solid electrolytic capacitor.

Claims (1)

[Claims] 1 Electronic component elements having lead wires connected at equal intervals to a metal support plate are connected to first
to the bent part of a second lead frame having the same shape as the first lead frame, with the lead wire placed and connected to the bent part of the lead frame and arranged to face the bent part. A method for manufacturing a chip-type electronic component, which comprises welding, cutting, resin sheathing, and cutting between the bent portions of first and second lead frames.