JPS58204576A - 半導体発光素子または受光素子 - Google Patents

半導体発光素子または受光素子

Info

Publication number
JPS58204576A
JPS58204576A JP57087796A JP8779682A JPS58204576A JP S58204576 A JPS58204576 A JP S58204576A JP 57087796 A JP57087796 A JP 57087796A JP 8779682 A JP8779682 A JP 8779682A JP S58204576 A JPS58204576 A JP S58204576A
Authority
JP
Japan
Prior art keywords
light emitting
chip
optical fiber
emitting element
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57087796A
Other languages
English (en)
Inventor
Masataka Imoto
井元 昌隆
Hideaki Ito
英昭 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Rayon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Rayon Co Ltd filed Critical Mitsubishi Rayon Co Ltd
Priority to JP57087796A priority Critical patent/JPS58204576A/ja
Publication of JPS58204576A publication Critical patent/JPS58204576A/ja
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4212Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/421Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 本発明は半導体発光素子Rよび受光素子の構造に関する
ものである。
従来光ファイバーと半導体発光素子あるいは受光素子と
の結合は、光ファイバーの端部にとつつけるフェルール
と発光素子あるいは受光素子を挿入固定するレセプタク
ルと称する治具を用いて行うのが一般的であった。
ニア)様な治具ン用いる方法では、光ファイバーと発光
素子あるいは受光素子の元軸を正確に合わせることが難
しく、またその結合による光損失も大さかった。
本発明はこの様な半導体発光素子あるいは受光素子と光
ファイバーの結合を簡便かつ正確に行い、結合による光
損失を最小限にしようとするものである。
以下本発明馨図面に従って説明する。
図面は本発明による半導体発光素子の断面図であり、(
1)は発光チップ、(2)は反射凹面鏡、 +31゜(
4)は電極、(5)は導線であり、これらは透明な有脂
(6)ニ封じ込まれている。この樹脂層(6)の発光チ
ップ上方には光フアイバー挿入孔(7)がある。
また受光素子も発光素子と司様、受光チップの上方の樹
脂1智lこ光フアイバー挿入用の孔?有する構造とする
ここで反射凹面鏡は本発明の必須要件で1・まないので
1反射凹面纜を有しない構造とする二ともでき、また受
光素子は発光素子と一一原理lこつご図面ケ省略する。
光ファイバーと工発明による半導体発光素子?よび受光
素子との績合は孔(7)ニ光ファイバーを挿入し、孔と
光ファイバーの間7啜看゛痢で固、のれば光ファイバー
への光入射効率あるいは光ファイバーからの光の受光効
率が優れ、しかも光軸を簡便Vこ合わせることが可能に
なる。
【図面の簡単な説明】
図面は本発明による半導体発光素子の断面図であり9図
譚甲の符号(1)は発光チップ、(6)は樹脂層、(7
)は光フアイバー装着用の孔である。

Claims (1)

    【特許請求の範囲】
  1. 樹脂により発光チップあるいは受光チップ及び電標が封
    入された半導体発光素子及び受光素子において、樹脂層
    の半導体チップ真上の部分に光ファイバーを装着するた
    めの挿入孔乞有すること乞特徴とする半導体発光素子及
    び受光素子。
JP57087796A 1982-05-24 1982-05-24 半導体発光素子または受光素子 Pending JPS58204576A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57087796A JPS58204576A (ja) 1982-05-24 1982-05-24 半導体発光素子または受光素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57087796A JPS58204576A (ja) 1982-05-24 1982-05-24 半導体発光素子または受光素子

Publications (1)

Publication Number Publication Date
JPS58204576A true JPS58204576A (ja) 1983-11-29

Family

ID=13924937

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57087796A Pending JPS58204576A (ja) 1982-05-24 1982-05-24 半導体発光素子または受光素子

Country Status (1)

Country Link
JP (1) JPS58204576A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0392741A3 (en) * 1989-04-08 1990-11-28 Oxley Developments Company Limited Fibre optic/led coupling
US5825051A (en) * 1996-10-12 1998-10-20 Preh-Werke Gmbh & Co. Kg Optoelectronic component with central hollow
EP0893861A3 (en) * 1997-07-25 2000-01-12 Oki Electric Industry Co., Ltd. Optical module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524404A (en) * 1978-08-09 1980-02-21 Toshiba Corp Semiconductor light emitting device
JPS55138891A (en) * 1979-04-18 1980-10-30 Fujitsu Ltd Light semiconductor device
JPS562263B2 (ja) * 1977-10-13 1981-01-19

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS562263B2 (ja) * 1977-10-13 1981-01-19
JPS5524404A (en) * 1978-08-09 1980-02-21 Toshiba Corp Semiconductor light emitting device
JPS55138891A (en) * 1979-04-18 1980-10-30 Fujitsu Ltd Light semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0392741A3 (en) * 1989-04-08 1990-11-28 Oxley Developments Company Limited Fibre optic/led coupling
US5825051A (en) * 1996-10-12 1998-10-20 Preh-Werke Gmbh & Co. Kg Optoelectronic component with central hollow
EP0893861A3 (en) * 1997-07-25 2000-01-12 Oki Electric Industry Co., Ltd. Optical module

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