JPS58225657A - 多層混成集積回路 - Google Patents

多層混成集積回路

Info

Publication number
JPS58225657A
JPS58225657A JP57107873A JP10787382A JPS58225657A JP S58225657 A JPS58225657 A JP S58225657A JP 57107873 A JP57107873 A JP 57107873A JP 10787382 A JP10787382 A JP 10787382A JP S58225657 A JPS58225657 A JP S58225657A
Authority
JP
Japan
Prior art keywords
resistors
laser
conductive path
integrated circuit
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57107873A
Other languages
English (en)
Japanese (ja)
Other versions
JPH049382B2 (fr
Inventor
Akira Kazami
風見　明
Masakazu Yamagishi
正和 山岸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP57107873A priority Critical patent/JPS58225657A/ja
Publication of JPS58225657A publication Critical patent/JPS58225657A/ja
Publication of JPH049382B2 publication Critical patent/JPH049382B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP57107873A 1982-06-22 1982-06-22 多層混成集積回路 Granted JPS58225657A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57107873A JPS58225657A (ja) 1982-06-22 1982-06-22 多層混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57107873A JPS58225657A (ja) 1982-06-22 1982-06-22 多層混成集積回路

Publications (2)

Publication Number Publication Date
JPS58225657A true JPS58225657A (ja) 1983-12-27
JPH049382B2 JPH049382B2 (fr) 1992-02-20

Family

ID=14470248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57107873A Granted JPS58225657A (ja) 1982-06-22 1982-06-22 多層混成集積回路

Country Status (1)

Country Link
JP (1) JPS58225657A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63224392A (ja) * 1987-03-13 1988-09-19 日本メクトロン株式会社 多層プリント配線板およびその加工法
JPH0249169U (fr) * 1988-09-29 1990-04-05
DE19807956B4 (de) * 1997-02-26 2007-08-30 Denso Corp., Kariya Verfahren zum Trennen von Isoliersubstraten

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2492301B1 (fr) 2009-10-23 2023-03-29 Dow Toray Co., Ltd. Nouvel organopolysiloxane co-modifié
KR101833959B1 (ko) 2009-10-23 2018-03-02 다우 코닝 도레이 캄파니 리미티드 오일-기반 원료 물질을 위한 증점제 또는 겔화제
CN102665668B (zh) 2009-12-24 2014-10-22 道康宁东丽株式会社 具有碳硅氧烷树枝状大分子结构的共聚物及包含该共聚物的组合物和化妆品
KR101830292B1 (ko) 2009-12-24 2018-03-29 다우 코닝 도레이 캄파니 리미티드 화장료에 사용하기 위한 분말용 표면 처리제 및 이로 처리된 분말을 함유하는 화장료
EP2563327A1 (fr) 2010-04-30 2013-03-06 Dow Corning Toray Co., Ltd. Agent de traitement de poudre comprenant de l'organopolysiloxane modifié par un alcool de sucre
US9475828B2 (en) 2010-04-30 2016-10-25 Dow Corning Toray Co., Ltd. Organopolysiloxane and use thereof as surfactant, powder treatment agent, thickening agent of oil-based raw material or gelling agent. gel and emulsion compositions, as well as, preparations for external use and cosmetics comprising the same
KR20130058700A (ko) 2010-04-30 2013-06-04 다우 코닝 도레이 캄파니 리미티드 신규한 오르가노폴리실록산, 신규한 오르가노폴리실록산을 포함하는 계면활성제, 에멀젼 조성물, 분말 처리제, 오일-기반 원료의 증점제, 겔화제, 겔 조성물 및 화장품 원료, 그리고, 이를 포함하는 외용 제제 및 화장품
JP5830293B2 (ja) 2010-07-30 2015-12-09 東レ・ダウコーニング株式会社 共変性オルガノポリシロキサンを含む毛髪化粧料
JP2013095835A (ja) 2011-10-31 2013-05-20 Dow Corning Toray Co Ltd 長鎖アミド変性シリコーン・アミノ変性シリコーン共重合体及びその用途
JP6369888B2 (ja) 2011-12-27 2018-08-08 東レ・ダウコーニング株式会社 新規液状オルガノポリシロキサン及びその利用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS558096A (en) * 1978-06-30 1980-01-21 Ibm Ic package

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS558096A (en) * 1978-06-30 1980-01-21 Ibm Ic package

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63224392A (ja) * 1987-03-13 1988-09-19 日本メクトロン株式会社 多層プリント配線板およびその加工法
JPH0249169U (fr) * 1988-09-29 1990-04-05
DE19807956B4 (de) * 1997-02-26 2007-08-30 Denso Corp., Kariya Verfahren zum Trennen von Isoliersubstraten

Also Published As

Publication number Publication date
JPH049382B2 (fr) 1992-02-20

Similar Documents

Publication Publication Date Title
US5994997A (en) Thick-film resistor having concentric terminals and method therefor
US5960538A (en) Printed circuit board
US20050082671A1 (en) Ball grid array resistor network
KR920013489A (ko) 하이브리드 다층 회로의 비아 저항 구조물
JPH049382B2 (fr)
JPH08228064A (ja) プリント回路基板
JPH1093240A (ja) 多層配線板および多層配線板の製造方法
JP4009080B2 (ja) 配線板およびその製造方法
JPS58112359A (ja) 多層混成集積回路
JP2007317904A (ja) 抵抗素子及び抵抗素子内蔵配線回路板
JPH0716097B2 (ja) 多層印刷配線板の製造方法
JPS60171792A (ja) 金属ベ−ス多層回路基板
JP2000133506A (ja) 抵抗体付き配線基板の製造方法
JP2003008227A (ja) 多層基板
JPH04139896A (ja) セラミック多層基板
JPS601858A (ja) 多層混成集積回路
JPH0366101A (ja) 電気回路部品
JPS59119794A (ja) 混成厚膜集積回路
JPH0219980Y2 (fr)
JPH05145239A (ja) 多層基板
JPH02121386A (ja) 印刷抵抗基板
JPH0832241A (ja) セラミック多層基板に形設される抵抗素子及びその形成方法
JP2006196840A (ja) 配線基板およびその製造方法
JP2860212B2 (ja) 受動部品内蔵型多層回路基板及び受動部品調整方法
CN119629847A (zh) 布线基板