JPS5824463Y2 - 混成集積回路のパッケ−ジ構造 - Google Patents
混成集積回路のパッケ−ジ構造Info
- Publication number
- JPS5824463Y2 JPS5824463Y2 JP1977017495U JP1749577U JPS5824463Y2 JP S5824463 Y2 JPS5824463 Y2 JP S5824463Y2 JP 1977017495 U JP1977017495 U JP 1977017495U JP 1749577 U JP1749577 U JP 1749577U JP S5824463 Y2 JPS5824463 Y2 JP S5824463Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- adhesive
- package structure
- lead terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977017495U JPS5824463Y2 (ja) | 1977-02-15 | 1977-02-15 | 混成集積回路のパッケ−ジ構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977017495U JPS5824463Y2 (ja) | 1977-02-15 | 1977-02-15 | 混成集積回路のパッケ−ジ構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53113356U JPS53113356U (2) | 1978-09-09 |
| JPS5824463Y2 true JPS5824463Y2 (ja) | 1983-05-25 |
Family
ID=28842985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977017495U Expired JPS5824463Y2 (ja) | 1977-02-15 | 1977-02-15 | 混成集積回路のパッケ−ジ構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5824463Y2 (2) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4816346U (2) * | 1971-07-02 | 1973-02-23 | ||
| JPS4932157A (2) * | 1972-07-26 | 1974-03-23 |
-
1977
- 1977-02-15 JP JP1977017495U patent/JPS5824463Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53113356U (2) | 1978-09-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6274196B2 (ja) | 電気接続箱 | |
| JPH1187933A (ja) | 電子回路装置及びその製造方法 | |
| JPS5824463Y2 (ja) | 混成集積回路のパッケ−ジ構造 | |
| JPH032099A (ja) | Icカードの製造方法 | |
| KR101319219B1 (ko) | 전력용 반도체 모듈의 터미널 핀 솔더링용 지그 | |
| JPS617692A (ja) | 導体ピンの固着方法および導体ピン固着のプリント配線板 | |
| JP2000031308A (ja) | 半導体コンポ―ネントおよび半導体素子の結合方法 | |
| JPS60129136U (ja) | 半導体装置 | |
| JPS61294845A (ja) | 半導体装置の製造方法 | |
| JPS6350853Y2 (2) | ||
| JPS5919424Y2 (ja) | 磁器コンデンサを有するパッケ−ジ | |
| JPS6334281Y2 (2) | ||
| JPS58154250A (ja) | 混成集積回路 | |
| JPS58148970U (ja) | 多層接着用固定治具 | |
| JPH047175U (2) | ||
| JPS6184027A (ja) | 半導体装置の組立方法 | |
| JPS59140466U (ja) | 回路基板接続装置 | |
| JP3040682U (ja) | プリント回路 | |
| JPS6386462A (ja) | ソリツド・ステ−ト・リレ−の製造方法 | |
| JPH0132330Y2 (2) | ||
| JPH0351297B2 (2) | ||
| JPH06140534A (ja) | 混成集積回路装置 | |
| JPH0511487U (ja) | 電子部品モジユール構造 | |
| JPS62177995A (ja) | 小型電気部品のプリント基板への取付方法 | |
| JPH04284298A (ja) | Icカード |